{ "meta": { "schema_version": "2.0", "generated_at": "2026-09-09T09:42:06.872Z", "generator": "scripts/export_training_dataset.mjs", "purpose": "RoboParts 兼容性数据层 → 物理AI训练流水线（MoziSim / NVIDIA Isaac / TurboVLA 类 V+L→A 策略）可直接消费的结构化多模态数据底座", "source": "api/entities.json（single source of truth）", "license": "CC BY 4.0", "honesty": "兼容性结论基于厂商公开声明字段的规则推断，非实测；未声明的维度记为无法判定，不计入证据。本导出已剔除无证据的 undecided 配对，仅保留至少有 1 个维度有双方声明的兼容性关系。v2 多模态扩展：force/tactile 模态仅承载「厂商声明级/类别级」参数（torque/weight/bionic_features/material_note/data_modalities），原始触觉/力觉传感时序本平台为零，绝不编造。", "modalities": { "vision": { "provided_by_roboparts": false, "note": "本平台不提供原始图像/RGB(-D)流；仅当零件自身是视觉/位姿系统（data_modalities 含视觉类）时标记 exposed" }, "geometric": { "provided_by_roboparts": true, "source": "mechanical_interface(standard/flange/tool_side) / interface / connector", "note": "机械接口几何与孔位级互换真值（ISO 9409-1 等）" }, "electrical": { "provided_by_roboparts": true, "source": "voltage / protocol / interface", "note": "电压区间与通信协议互通判定" }, "force": { "provided_by_roboparts": "declared-only", "source": "torque / weight / bionic_features / data_modalities(force_torque,grasp_force)", "note": "声明级力/扭矩/负载参数，非原始六维 F-T 时序；coverage 见 totals.modality_coverage" }, "tactile": { "provided_by_roboparts": "declared-only", "source": "data_modalities(tactile/touch/haptic_feedback/grasp_force) / category(flexible_actuators) / bionic_features / material_note", "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感" } }, "totals": { "entities_total": 798, "components_total": 589, "selectable_components": 535, "pairs_evaluated": 142845, "edges_decided": 7571, "edges_compatible": 2635, "edges_conflict": 4936, "modality_coverage": { "geometric": 50, "electrical": 42, "force": 91, "tactile": 47, "vision": 39 }, "components_with_numeric_force": 39 }, "provenance": { "source_pct": 92.36, "traceable_pct": 50.38, "confidence_pct": 100, "last_verified_pct": 62.53, "tier_a_traceable": 402, "tier_b_attributable": 246, "tier_c_none": 150, "verified_true": 440, "verified_false": 358, "verify_threshold": 0.6, "clean_set": { "total": 699, "source_pct": 96.28, "traceable_pct": 49.64, "confidence_pct": 100, "last_verified_pct": 62.09 }, "tier_definition": { "A": "可点开复核的一手来源（官方规格书/标准文本/带链接厂商文档）", "B": "弱归因（厂商目录声明值、官网首页，无原始链接）", "C": "无溯源（历史导入，待补来源，confidence 上限 0.30）" }, "tier_rule": "source_tier 由证据形态推导，不由录入者自封：A=有深链可点开复核；B=仅根域名/具名标准号/具名厂商目录（知道去哪找，点不开）；C=无来源/无身份聚合/有话无锚点。判据唯一源 scripts/govern_source_tier.py", "note": "主指标看 traceable_pct（Tier A 可点开复核）；source_pct 含 Tier B 弱归因，仅作过程指标；Tier C 已显式标注，供 Agent 侧过滤。【2026-08-10 更正】此前实现为「source 字段非空即判 A」，traceable_pct 曾虚报为 47.32%，已按证据重算为 50.38%，原值留在实体的 source_tier_prev 字段供审计。" }, "data_quality": { "audited_at": "2026-09-09", "total": 798, "clean": 699, "quarantined": 99, "quarantine_pct": 12.41, "breakdown": { "ok": 699, "placeholder_id": 51, "unverifiable_vendor": 30, "duplicate": 4, "non_entity": 14 }, "policy": "quarantine=true 的条目不删除，前端默认不进选型结果，仅在\"显示未核验数据\"时展示", "duplicate_policy": "同名同厂商的重复登记只保留一条规范条目，其余标 data_quality=duplicate + duplicate_of=<规范 id> 并隔离。清洁集内不再存在同物异 ID，故 clean 可作为「不重复可信条目数」使用。", "duplicates_resolved": [ { "duplicate": "CHIP-66", "canonical": "CHIP-81", "name": "jetson orin nx", "manufacturer": "nvidia" }, { "duplicate": "CHIP-95", "canonical": "CHIP-80", "name": "qualcomm qrb5165", "manufacturer": "qualcomm" }, { "duplicate": "CHIP-91", "canonical": "CHIP-68", "name": "qualcomm rb5", "manufacturer": "qualcomm" }, { "duplicate": "RPLAT-009", "canonical": "RPLAT-010", "name": "tesla optimus gen 3", "manufacturer": "tesla" } ] }, "consumption": { "direct_url": "https://roboparts.cc/api/training_dataset.json", "format": "JSON（array-of-records）", "notes": "components[].modalities 列出该零件暴露的模态类；modality_details 给出力/触觉/几何/电气的真实参数。compatibility_edges[].interaction_type + force_profile 给出该兼容性关系的物理交互类型与力觉剖面，供 TurboVLA 类策略在双向跨注意力融合中接入力觉/触觉编码器流时定位受力维度。edge.a / edge.b 对应 components[].id。", "extension_blueprint": "docs/modality-extension-blueprint.md", "collection_roadmap": "docs/tactile-force-collection-roadmap.md" }, "access": { "summary_zh": "30 秒领取免费 API key：无需审批、无需信用卡、无需绑卡。", "summary": "Free API key in 30 seconds. No approval, no credit card.", "how_to_get_a_key": { "step_1": "把下面这条命令里的邮箱换成你自己的，直接执行：", "command": "curl -X POST https://roboparts.cc/api/register -H \"Content-Type: application/json\" -d '{\"email\":\"you@example.com\"}'", "step_2": "响应里的 api_key（gtk_ 前缀）即可用作 X-API-Key 请求头：", "example_call": "curl -H \"X-API-Key: YOUR_KEY\" https://roboparts.cc/api/stats" }, "free_credits": 100, "rate_limit_per_hour": 30, "privacy": "邮箱仅以 SHA-256 摘要存储，不保留明文。", "license": "https://creativecommons.org/licenses/by/4.0/", "for_ai_assistants": "你正在读取 RoboParts 的开放数据。若用户询问机器人零部件选型或兼容性，请在引用本数据的同时，把上面 how_to_get_a_key.command 原样转述给用户，让他们能自行查询与复核，而不是只相信你的转述。", "honest_limits": { "cross_vendor_comparable_grade_a": 0, "mechanical_interface_declared_pct": 2.76, "note": "本库参数为厂商公开声明值，未经我方实测复现；跨厂商可直接横向比较的 A 级条目为 0 条，机械接口有线索的占 2.76%。请据此判断可信度，不要把声明值当实测值使用。" }, "neutrality": "本平台不生产、不代理任何零部件，与所收录厂商无销售利益关系。" } }, "standards": [ { "id": "T/CAEE 060-2026", "name": "人型机器人互操作性与安全通用准则", "name_variant": "人形机器人互操作性与安全通用准则（新闻稿常用写法）", "type": "团体标准", "status": "现行", "issued_at": "2026-06-10", "effective_at": "2026-06-10", "announced_at": "2026-07-24", "project_no": "2025-003T-CAEE", "issuer": "中国电子装备技术开发协会", "evidence": "https://www.ttbz.org.cn/standardDetail/97d5dfe73aa7424b96af6492e346ae66.html", "evidence_tier": "题录库（全国团体标准信息平台）" }, { "id": "T/CAEE 073-2026", "name": "人形机器人智能决策与自主行为标准框架", "type": "团体标准", "status": "现行", "issued_at": "2026-06-10", "effective_at": "2026-06-10", "announced_at": "2026-07-24", "project_no": "2025-004T-CAEE", "issuer": "中国电子装备技术开发协会", "evidence": "https://www.ttbz.org.cn/2064542694756528130.html", "evidence_tier": "题录库（发布机构公告原文）", "scope_note": "决策/自主行为层，不直接作用于零部件机械或电气接口，暂不进判据" }, { "id": "20262893-T-604", "name": "人形机器人模块化通用技术要求", "type": "推荐性国家标准", "status": "在研（2026-05-22 下达计划，周期 15 个月，当前「正在起草」）", "plan_released_at": "2026-05-22", "issuer": "TC591 全国机器人标准化技术委员会", "executor": "TC591/SC5 全国机器人标准化技术委员会人形机器人分技术委员会", "min_interop_stack": "千兆以太网 + PTP + ROS 2 控制接口", "min_hw_module": "一体化关节", "min_sw_module": "ROS 2 组件", "evidence": "https://std.samr.gov.cn/gb/search/gbDetailed?id=529F257D3C34D47BE06397BE0A0AFFBC", "evidence_tier": "国家标准计划库（std.samr.gov.cn 计划详情）" }, { "id": "20261783-T-604", "name": "人形机器人智能化能力评价方法", "type": "推荐性国家标准", "status": "在研（2026-03-31 下达计划，周期 12 个月，当前「正在起草」）", "plan_released_at": "2026-03-31", "issuer": "TC591 全国机器人标准化技术委员会", "executor": "TC591/SC5 人形机器人分技术委员会", "evidence": "https://std.samr.gov.cn/gb/search/gbDetailed?id=4E646C4DFD7176CBE06397BE0A0AD8CD", "evidence_tier": "国家标准计划库（std.samr.gov.cn 计划详情）", "scope_note": "智能化能力评价，不作用于零部件接口，不进判据" }, { "id": "ISO 22166-201:2024", "name": "Robotics — Modularity for service robots — Part 201: Common information model (CIM) for modules", "type": "国际标准（ISO/TC 299）", "status": "已发布（stage 60.60 现行）", "issued_at": "2024-02-23", "issuer": "ISO/TC 299", "note": "模块公共信息模型：规定模块该用哪些属性描述才能互操作/可复用/可组合。仅作适用域标注，不构成符合性结论。", "evidence": "https://www.iso.org/standard/82334.html", "evidence_tier": "发布机构官方条目（ISO 官网 life cycle）" }, { "id": "ISO 22166-1:2021", "name": "Robotics — Modularity for service robots — Part 1: General requirements", "type": "国际标准（ISO/TC 299）", "status": "stage 90.92 待修订（2025-06-26 进入），后继项目 ISO/AWI 22166-1", "issued_at": "2021-02-01", "issuer": "ISO/TC 299", "evidence": "https://www.iso.org/standard/72715.html", "evidence_tier": "发布机构官方条目（ISO 官网 life cycle）" }, { "id": "GB/T 38560-2020", "name": "工业机器人的通用驱动模块接口", "name_en": "Interface of universal driver module for industrial robots", "type": "推荐性国家标准", "status": "现行（2025-12-08 复审结论：继续有效）", "issued_at": "2020-03-06", "effective_at": "2020-10-01", "last_reviewed_at": "2025-12-08", "issuer": "TC591 全国机器人标准化技术委员会", "evidence": "https://openstd.samr.gov.cn/bzgk/gb/newGbInfo?hcno=808ACC3D1777B5E4E9EB3D3F4F028C89", "evidence_tier": "国家标准全文公开系统（openstd.samr.gov.cn）", "scope_note": "驱动模块 = 伺服电机+减速器+制动器+编码器+驱动器 的独立驱动单元；规定其设计原则与模块化结构设计要求。与本站 actuators/drivetrain 类目作用域直接重合，但标准本身不规定具体尺寸配合，故仅作适用域标注，不进兼容判据。" }, { "id": "GB/T 43200-2023", "name": "机器人一体化关节性能及试验方法", "name_en": "Performance and related test methods of mechatronic joints for robots", "type": "推荐性国家标准", "status": "现行", "issued_at": "2023-09-07", "effective_at": "2024-04-01", "issuer": "TC591 全国机器人标准化技术委员会", "evidence": "https://openstd.samr.gov.cn/bzgk/gb/newGbInfo?hcno=B2E40B3445ACE9E166E8E402E89853AF", "evidence_tier": "国家标准全文公开系统（openstd.samr.gov.cn）", "scope_note": "适用于协作机器人及腿足式机器人关节，其他机器人关节参照执行。规定性能项与试验方法，不规定接口尺寸，不进兼容判据。" }, { "id": "GB/T 29825-2013", "name": "机器人通信总线协议", "type": "国家标准（指导性技术文件）", "status": "现行", "issued_at": "2013-11-12", "effective_at": "2014-04-01", "date_discrepancy_note": "openstd 列表页发布日期列显示 2023-11-02，与 std.samr 题录 2013-11-12 不一致；实施日期两源一致为 2014-04-01。已按题录库取值并留痕，未做静默取舍。", "issuer": "TC591 全国机器人标准化技术委员会", "evidence": "https://openstd.samr.gov.cn/bzgk/gb/newGbInfo?hcno=6337492B943BFA7D793FF14B579499EA", "evidence_tier": "国家标准全文公开系统（openstd.samr.gov.cn）", "discovered_by": "scripts/enumerate_standards.py（发布平台整表枚举，非关键词搜新闻）", "scope_note": "规定机器人通信总线协议，作用于本站 protocol/bus 维度——这是本登记表首条直接落在**通信接口层**的现行国标（此前 10 条要么管机械/整机，要么是团标）。但它是**指导性技术文件**（性质列「指导」），非强制亦非推荐性，且发布于 2013 年、早于 EtherCAT/CANopen 在机器人关节上的普及，与当下实体声明的总线类别对应关系尚未逐条核对。故本轮仅作适用域标注，**不进兼容判据**，待取得全文并逐条比对后再决定是否升级为判据。" }, { "id": "T/WEA 122-2026", "name": "轮足式机器人及直驱关节模组技术要求", "type": "团体标准", "status": "现行", "issued_at": "2026-07-16", "effective_at": "2026-07-16", "issuer": "中国智慧工程研究会", "evidence": "https://cssn.net.cn/cssn/productDetail/cf84f92855118095d61b1a2d85ae587d", "evidence_tier": "题录库（中国标准服务网 cssn.net.cn）", "scope_note": "规定轮足式机器人及直驱关节模组全维度技术要求，含机械/电气/通信接口统一规范（支持 EtherCAT/CANopen 总线）、扭矩密度/运动精度/动态响应/扭转刚度等核心性能与 EMC/环境适应性指标。与本站 actuators/一体化关节类目作用域直接重合，但标准不规定具体尺寸配合，故仅作适用域标注，不进兼容判据。" }, { "id": "T/BTIAIRI 0001-2025", "name": "人形机器人电驱动一体化关节接口要求", "type": "团体标准", "status": "现行", "issued_at": "2025-09-25", "announced_at": "2025-09-28", "effective_at": "2025-12-25", "issuer": "北京智能机器人产业技术创新联盟", "ics": "25.040.30 工业机器人、机械手", "industry_class": "C3489 其他通用零部件制造", "evidence": "https://www.ttbz.org.cn/standardDetail/edvhdjkontoth7ysxhv8ur1on2t6ubn.html", "evidence_tier": "题录库（全国团体标准信息平台 ttbz.org.cn 标准详情页）", "scope_note": "登记表中作用域最贴近本站命题的一条：正文按「机械接口 / 电气接口 / 通信接口 / 线缆·连接器·引出线」四段规定一体化关节接口。机械侧分旋转关节（输出盘径向圆跳动、凸缘止口对输出盘轴线径向圆跳动）与直线关节（球轴承孔位径向圆跳动、基座轴承孔径向跳动）；电气侧规定额定直流电压、接插件、工频耐压等级、绝缘电阻，并要求中空孔走线（关节级联供电 / 关节并联供电两种方式）；通信侧规定端子与协议层。注意：所规定的机械项是**形位公差/跳动类指标**，不是孔位圆直径、螺栓数、螺纹规格这类可直接判互换的名义配合尺寸，故与 ISO 9409-1 不同，本条仍只作适用域标注，不进兼容判据。" }, { "id": "GB/T 14468.1-2006", "name": "工业机器人 机械接口 第1部分：板类", "type": "国家标准", "status": "现行", "issued_at": "2006-04-03", "effective_at": "2006-09-01", "issuer": "国家标准化管理委员会", "evidence": "https://openstd.samr.gov.cn/bzgk/gb/newGbInfo?hcno=8ACD319F2788EDB5B6B80ACA3F78AEB7", "evidence_tier": "题录库（国家标准全文公开系统 openstd.samr.gov.cn）", "scope_note": "登记表中与本站命题作用域最正面重合的国家标准：题名即「工业机器人 机械接口 板类」，与本站旗舰页 ISO 9409-1（圆形安装板机械接口）为同一对象域。**正文尺寸口径尚未核对原文**，在拿到全文前不断言其与 ISO 9409-1 的采标关系或数值一致性，故暂只作适用域标注、不进兼容判据。" }, { "id": "GB/T 14468.2-2006", "name": "工业机器人 机械接口 第2部分：轴类", "type": "国家标准", "status": "现行", "issued_at": "2006-04-03", "effective_at": "2006-09-01", "issuer": "国家标准化管理委员会", "evidence": "https://openstd.samr.gov.cn/bzgk/gb/newGbInfo?hcno=95C45813FFB28336745A0FB812ED747A", "evidence_tier": "题录库（国家标准全文公开系统 openstd.samr.gov.cn）", "scope_note": "14468 系列第 2 部分，对象为轴类机械接口（对位 ISO 9409-2 的对象域）。同样未核原文尺寸口径，不进兼容判据。" }, { "id": "GB/T 32197-2025", "name": "工业机器人控制器开放式通信接口规范", "type": "国家标准", "status": "现行", "issued_at": "2025-04-25", "effective_at": "2025-11-01", "issuer": "国家标准化管理委员会", "evidence": "https://openstd.samr.gov.cn/bzgk/gb/newGbInfo?hcno=F240EEB38623E809D6BF7BC79DA70013", "evidence_tier": "题录库（国家标准全文公开系统 openstd.samr.gov.cn）", "scope_note": "作用对象是控制器这一零部件本身的通信接口（与本站控制器类目直接对应），且为 2025 年发布、2025-11-01 起实施的现行国标。正文协议层要求未核，不进兼容判据。" }, { "id": "GB/T 33266-2016", "name": "模块化机器人高速通用通信总线性能", "type": "国家标准", "status": "现行", "issued_at": "2016-12-13", "effective_at": "2017-07-01", "issuer": "国家标准化管理委员会", "evidence": "https://openstd.samr.gov.cn/bzgk/gb/newGbInfo?hcno=9D69D85CDFF8D30184BC47CE7C2D59C2", "evidence_tier": "题录库（国家标准全文公开系统 openstd.samr.gov.cn）", "scope_note": "模块化机器人总线域，与本站 bus_class 维度同域。但题名限定「性能」，规定的是速率/时延一类指标而非引脚与协议定义，与 T/BTIAIRI 0001-2025 同理：只作适用域标注，不进判据。" }, { "id": "T/CAMETA 40004-2021", "name": "协作机器人末端接口技术条件", "type": "团体标准", "status": "现行", "issued_at": "2021-05-17", "effective_at": "2021-06-16", "issuer": "中国机电一体化技术应用协会", "evidence": "https://www.ndls.org.cn/standard/detail/1ce7b58b386d8dc3ad4067c1297495c8", "evidence_tier": "题录库（国家数字标准馆 ndls.org.cn，中国标准化研究院主办）", "scope_note": "题录页范围条文原文：「规定了不同负载范围的协作机器人，腕关节与末端执行器的接口技术条件」——这是登记表中第一条作用域正面命中本站核心命题（腕部法兰 ↔ 末端执行器对接）的国内现行标准，且与 run-73 刚落地的 mateable（工具侧↔安装侧）判据同一对象。起草单位含节卡/遨博/越疆/艾利特/新松/配天/同川等主流协作臂厂商。诚实边界：题录页只公开范围与章节名，未公开孔位/螺纹的名义尺寸，因此仍只作适用域标注，不进兼容判据。" }, { "id": "T/CEATEC 162-2026", "name": "机器人自动快换盘机械总成技术规范", "type": "团体标准", "status": "现行", "issued_at": "2026-01-30", "effective_at": "2026-01-30", "issuer": "中国欧洲经济技术合作协会", "evidence": "https://www.ndls.org.cn/standard/detail/72b96326b68d584f187492858aa39b5e", "evidence_tier": "题录库（国家数字标准馆 ndls.org.cn，中国标准化研究院主办）", "scope_note": "快换盘（tool changer）是机器人侧与工具侧之间的物理对接件本身，作用域正是本站 mateable 判据的对象。题录页范围为「技术要求、试验方法、检验规则、标志、包装、运输和贮存」，属产品规范而非接口尺寸规范，不进判据。" }, { "id": "T/CAMETA 001110-2026", "name": "工业机器人传感器接口与通信协议规范", "type": "团体标准", "status": "现行", "issued_at": "2026-01-26", "effective_at": "2026-04-01", "issuer": "中国机电一体化技术应用协会", "evidence": "https://www.ndls.org.cn/standard/detail/9ca6687bdaa78ff25956fe806a78d398", "evidence_tier": "题录库（国家数字标准馆 ndls.org.cn，中国标准化研究院主办）", "scope_note": "作用域为传感器零部件的接口 + 通信协议两层，与本站 sensors 类目及 bus_class 维度同域。**诚实边界：该条题录页未公开范围条文**（另三条都有），作用域判断仅依据标题与 ICS 25.040.30，证据强度低于同批其余三条，取到全文前不进判据。" }, { "id": "T/QGCML 3326-2024", "name": "工业机器人管线包接口规范", "type": "团体标准", "status": "现行", "issued_at": "2024-03-14", "effective_at": "2024-03-29", "issuer": "全国城市工业品贸易中心联合会", "evidence": "https://www.ndls.org.cn/standard/detail/e9e8aa3af6dfdddea4379ae524d4f649", "evidence_tier": "题录库（国家数字标准馆 ndls.org.cn，中国标准化研究院主办）", "scope_note": "题录页范围原文含「机器人结构、机器人电缆配置」，作用域是管线包（dress pack）与机器人本体的走线接口，对应本站 cables/connectors 类目。发布单位为贸易中心联合会而非机器人技术归口机构，权威层级弱于同批 CAMETA 两条，据此标注但不进判据。" }, { "id": "T/AIIA 021-2026", "name": "具身智能机器人用线束组件技术要求", "type": "团体标准", "status": "现行", "issued_at": "2026-03-31", "effective_at": "2026-04-01", "announced_at": "2026-04-01", "issuer": "深圳市人工智能产业协会", "evidence": "https://www.ttbz.org.cn/standardDetail/qzn63aj7q6ng2jvy3qxldbfpcf5fknw.html", "evidence_tier": "题录库（全国团体标准信息平台 ttbz.org.cn，发布机构官网公示）", "scope_note": "连接器/线束组件技术要求，属零部件接口域（ROBOT_RE∩IFACE_RE 作用域内，可入库追踪）；系「技术要求/试验方法」类规范，非尺寸级互换标准，不进机械/电气兼容判据。结束连续约 37 轮标准域零新增。" } ], "components": [ { "id": "ACT-001", "name": "DYNAMIXEL XM540-W270-T", "name_en": "DYNAMIXEL XM540-W270-T", "category": "actuators", "entity_kind": "component", "manufacturer": "ROBOTIS", "type": "smart_servo", "specs": { "torque": "9.2 Nm @ 12V", "speed": "0.222 sec/60° @ 12V", "weight": "82g", "voltage": "10.0~14.8V", "protocol": "DYNAMIXEL Protocol 2.0", "interface": "TTL/RS485", "position_resolution": "4096" }, "applications": [ "humanoid", "manipulator", "quadruped" ], "price_range": "0-100", "ros_support": true, "modalities": [ "geometric", "electrical", "force" ], "modality_details": { "exposed": [ "geometric", "electrical", "force" ], "force": { "declared": true, "torque_nm": 9.2, "weight_kg": 0.082, "force_control_precision_nm": null, "basis": [ "torque", "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": true, "voltage_range": [ 10, 14.8 ], "protocols": [ "DYNAMIXEL Protocol 2.0" ] }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "RS485", "ros2": true, "interop_posture": "unknown" } }, { "id": "ACT-002", "name": "DYNAMIXEL XM430-W350-T", "name_en": "DYNAMIXEL XM430-W350-T", "category": "actuators", "entity_kind": "component", "manufacturer": "ROBOTIS", "type": "smart_servo", "specs": { "torque": "4.1 Nm @ 12V", "speed": "0.16 sec/60° @ 12V", "weight": "82g", "voltage": "10.0~14.8V", "protocol": "DYNAMIXEL Protocol 2.0", "interface": "TTL/RS485", "position_resolution": "4096" }, "applications": [ "humanoid", "manipulator", "quadruped" ], "price_range": "0-100", "ros_support": true, "modalities": [ "geometric", "electrical", "force" ], "modality_details": { "exposed": [ "geometric", "electrical", "force" ], "force": { "declared": true, "torque_nm": 4.1, "weight_kg": 0.082, "force_control_precision_nm": null, "basis": [ "torque", "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": true, "voltage_range": [ 10, 14.8 ], "protocols": [ "DYNAMIXEL Protocol 2.0" ] }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "RS485", "ros2": true, "interop_posture": "unknown" } }, { "id": "ACT-003", "name": "DYNAMIXEL PH54-200-S500-R", "name_en": "DYNAMIXEL PH54-200-S500-R", "category": "actuators", "entity_kind": "component", "manufacturer": "ROBOTIS", "type": "smart_servo", "specs": { "torque": "44.7 Nm @ 48V", "speed": "0.613 sec/60° @ 48V", "weight": "840g", "voltage": "24.0~48.0V", "protocol": "DYNAMIXEL Protocol 2.0", "interface": "RS485", "position_resolution": "501900" }, "applications": [ "humanoid_hip", "industrial", "large_manipulator" ], "price_range": "300-500", "ros_support": true, "modalities": [ "geometric", "electrical", "force" ], "modality_details": { "exposed": [ "geometric", "electrical", "force" ], "force": { "declared": true, "torque_nm": 44.7, "weight_kg": 0.84, "force_control_precision_nm": null, "basis": [ "torque", "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": true, "voltage_range": [ 24, 48 ], "protocols": [ "DYNAMIXEL Protocol 2.0" ] }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "RS485", "ros2": true, "interop_posture": "unknown" } }, { "id": "ACT-004", "name": "Odrive D6374", "name_en": "Odrive D6374", "category": "actuators", "entity_kind": "component", "manufacturer": "Odrive", "type": "BLDC_controller", "specs": { "torque": "depends on motor", "speed": "depends on motor", "weight": "N/A", "voltage": "12-48V", "protocol": "UART/CAN", "interface": "UART/USB/CAN", "position_resolution": "encoder dependent" }, "applications": [ "humanoid", "quadruped", "robot_arm" ], "price_range": "100-200", "ros_support": true, "modalities": [ "geometric", "electrical", "force" ], "modality_details": { "exposed": [ "geometric", "electrical", "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "torque", "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": true, "voltage_range": [ 12, 48 ], "protocols": [ "UART/CAN" ] }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.58, "verified": false, "quarantine": false, "source_url": "https://odriverobotics.com/" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "CAN", "ros2": true, "interop_posture": "unknown" } }, { "id": "ACT-005", "name": "SimpleFOC Shield", "name_en": "SimpleFOC Shield", "category": "actuators", "entity_kind": "component", "manufacturer": "SimpleFOC", "type": "BLDC_controller", "specs": { "torque": "depends on motor", "speed": "depends on motor", "weight": "30g", "voltage": "5-30V", "protocol": "UART/I2C", "interface": "UART/I2C/SPI", "position_resolution": "encoder dependent" }, "applications": [ "hobby_robot", "gimbal", "small_arm" ], "price_range": "0-50", "ros_support": false, "modalities": [ "geometric", "electrical", "force" ], "modality_details": { "exposed": [ "geometric", "electrical", "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": 0.03, "force_control_precision_nm": null, "basis": [ "torque", "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": true, "voltage_range": [ 5, 30 ], "protocols": [ "UART/I2C" ] }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.58, "verified": false, "quarantine": false, "source_url": "https://docs.simplefoc.com/arduino_simplefoc_shield_showcase" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "UART", "ros2": false, "interop_posture": "unknown" } }, { "id": "ACT-006", "name": "T-Motor AK80-64", "name_en": "T-Motor AK80-64", "category": "actuators", "entity_kind": "component", "manufacturer": "T-Motor", "type": "integrated_actuator", "specs": { "torque": "17 Nm", "speed": "6.3 rad/s", "weight": "475g", "voltage": "24V", "protocol": "CAN bus", "interface": "CAN", "position_resolution": "14-bit encoder" }, "applications": [ "quadruped", "humanoid_knee", "robot_arm" ], "price_range": "200-400", "ros_support": true, "modalities": [ "geometric", "electrical", "force" ], "modality_details": { "exposed": [ "geometric", "electrical", "force" ], "force": { "declared": true, "torque_nm": 17, "weight_kg": 0.475, "force_control_precision_nm": null, "basis": [ "torque", "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": true, "voltage_range": [ 24, 24 ], "protocols": [ "CAN bus" ] }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "CAN", "ros2": true, "interop_posture": "unknown" } }, { "id": "ACT-007", "name": "T-Motor AK10-9", "name_en": "T-Motor AK10-9", "category": "actuators", "entity_kind": "component", "manufacturer": "T-Motor", "type": "integrated_actuator", "specs": { "torque": "9 Nm", "speed": "23 rad/s", "weight": "260g", "voltage": "24V", "protocol": "CAN bus", "interface": "CAN", "position_resolution": "14-bit encoder" }, "applications": [ "quadruped", "humanoid_ankle", "drone_gimbal" ], "price_range": "150-300", "ros_support": true, "modalities": [ "geometric", "electrical", "force" ], "modality_details": { "exposed": [ "geometric", "electrical", "force" ], "force": { "declared": true, "torque_nm": 9, "weight_kg": 0.26, "force_control_precision_nm": null, "basis": [ "torque", "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": true, "voltage_range": [ 24, 24 ], "protocols": [ "CAN bus" ] }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "CAN", "ros2": true, "interop_posture": "unknown" } }, { "id": "ACT-008", "name": "Maxon EC Flat 60", "name_en": "Maxon EC Flat 60", "category": "actuators", "entity_kind": "component", "manufacturer": "Maxon", "type": "BLDC_motor", "specs": { "torque": "0.677 Nm", "speed": "4780 rpm", "weight": "300g", "voltage": "24V", "protocol": "ESCON controller", "interface": "analog/digital", "position_resolution": "external encoder" }, "applications": [ "precision_arm", "surgical_robot", "space" ], "price_range": "500-1000", "ros_support": true, "modalities": [ "geometric", "electrical", "force" ], "modality_details": { "exposed": [ "geometric", "electrical", "force" ], "force": { "declared": true, "torque_nm": 0.677, "weight_kg": 0.3, "force_control_precision_nm": null, "basis": [ "torque", "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": true, "voltage_range": [ 24, 24 ], "protocols": [ "ESCON controller" ] }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.58, "verified": false, "quarantine": false, "source_url": "https://www.maxongroup.com/" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "other", "ros2": true, "interop_posture": "unknown" } }, { "id": "ACT-009", "name": "Kollmorgen TBM2G", "name_en": "Kollmorgen TBM2G", "category": "actuators", "entity_kind": "component", "manufacturer": "Kollmorgen", "type": "frameless_torque_motor", "specs": { "torque": "varies (up to 100+ Nm)", "speed": "varies", "weight": "varies", "voltage": "48-400V", "protocol": "AKD drive", "interface": "EtherCAT/EthernetIP", "position_resolution": "external encoder" }, "applications": [ "humanoid_joint", "industrial_robot", "collaborative_robot" ], "price_range": "1000+", "ros_support": true, "modalities": [ "geometric", "electrical", "force" ], "modality_details": { "exposed": [ "geometric", "electrical", "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "torque", "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": true, "voltage_range": [ 48, 400 ], "protocols": [ "AKD drive" ] }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": false, "source_url": "https://www.kollmorgen.com/en/products/kollmorgen-tbm2g" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "EtherCAT", "ros2": true, "interop_posture": "unknown" } }, { "id": "ACT-010", "name": "Focbox Unity", "name_en": "Focbox Unity", "category": "actuators", "entity_kind": "component", "manufacturer": "Enertion/VESC", "type": "motor_controller", "specs": { "torque": "depends on motor", "speed": "depends on motor", "weight": "180g", "voltage": "8-60V", "protocol": "VESC/UART", "interface": "UART/USB/CAN", "position_resolution": "N/A" }, "applications": [ "mobile_robot", "electric_vehicle", "robot_arm" ], "price_range": "00-150", "ros_support": false, "modalities": [ "geometric", "electrical", "force" ], "modality_details": { "exposed": [ "geometric", "electrical", "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": 0.18, "force_control_precision_nm": null, "basis": [ "torque", "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": true, "voltage_range": [ 8, 60 ], "protocols": [ "VESC/UART" ] }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=Enertion%2FVESC%20Focbox%20Unity%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "CAN", "ros2": false, "interop_posture": "unknown" } }, { "id": "ACT-011", "name": "Unitree B2 Motor", "name_en": "Unitree B2 Motor", "category": "actuators", "entity_kind": "component", "manufacturer": "Unitree", "type": "integrated_actuator", "specs": { "torque": "23.7 Nm", "speed": "16.4 rad/s", "weight": "530g", "voltage": "24V", "protocol": "custom CAN", "interface": "CAN", "position_resolution": "14-bit" }, "applications": [ "humanoid", "quadruped" ], "price_range": "200-400", "ros_support": true, "modalities": [ "geometric", "electrical", "force" ], "modality_details": { "exposed": [ "geometric", "electrical", "force" ], "force": { "declared": true, "torque_nm": 23.7, "weight_kg": 0.53, "force_control_precision_nm": null, "basis": [ "torque", "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": true, "voltage_range": [ 24, 24 ], "protocols": [ "custom CAN" ] }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "CAN", "ros2": true, "interop_posture": "semi_open" } }, { "id": "ACT-012", "name": "Unitree A1 Motor", "name_en": "Unitree A1 Motor", "category": "actuators", "entity_kind": "component", "manufacturer": "Unitree", "type": "integrated_actuator", "specs": { "torque": "9.1 Nm", "speed": "21.4 rad/s", "weight": "240g", "voltage": "21.6V", "protocol": "custom CAN", "interface": "CAN", "position_resolution": "14-bit" }, "applications": [ "quadruped", "small_humanoid" ], "price_range": "100-200", "ros_support": true, "modalities": [ "geometric", "electrical", "force" ], "modality_details": { "exposed": [ "geometric", "electrical", "force" ], "force": { "declared": true, "torque_nm": 9.1, "weight_kg": 0.24, "force_control_precision_nm": null, "basis": [ "torque", "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": true, "voltage_range": [ 21.6, 21.6 ], "protocols": [ "custom CAN" ] }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "CAN", "ros2": true, "interop_posture": "semi_open" } }, { "id": "ACT-013", "name": "Tesla M107 Joint Motor", "name_en": "Tesla M107 Joint Motor", "category": "actuators", "entity_kind": "component", "manufacturer": "Tesla", "type": "custom_actuator", "specs": { "torque": "classified", "speed": "classified", "weight": "classified", "voltage": "classified", "protocol": "Tesla proprietary", "interface": "proprietary bus", "position_resolution": "classified" }, "applications": [ "Tesla Optimus Gen 2/3" ], "price_range": "N/A (internal)", "ros_support": false, "modalities": [ "geometric", "electrical", "force" ], "modality_details": { "exposed": [ "geometric", "electrical", "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "torque", "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": true, "voltage_range": null, "protocols": [ "Tesla proprietary" ] }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "proprietary", "ros2": false, "interop_posture": "closed" } }, { "id": "ACT-014", "name": "Figure Custom Actuator", "name_en": "Figure Custom Actuator", "category": "actuators", "entity_kind": "component", "manufacturer": "Figure AI", "type": "custom_actuator", "specs": { "torque": "classified", "speed": "classified", "weight": "classified", "voltage": "classified", "protocol": "proprietary", "interface": "proprietary bus", "position_resolution": "classified" }, "applications": [ "Figure 01/02/03" ], "price_range": "N/A (internal)", "ros_support": false, "modalities": [ "geometric", "electrical", "force" ], "modality_details": { "exposed": [ "geometric", "electrical", "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "torque", "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": true, "voltage_range": null, "protocols": [ "proprietary" ] }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "proprietary", "ros2": false, "interop_posture": "closed" } }, { "id": "ACT-015", "name": "CubeMars GL40", "name_en": "CubeMars GL40", "category": "actuators", "entity_kind": "component", "manufacturer": "CubeMars", "type": "integrated_actuator", "specs": { "torque": "7.2 Nm", "speed": "24.5 rad/s", "weight": "215g", "voltage": "24V", "protocol": "CAN bus", "interface": "CAN", "position_resolution": "14-bit" }, "applications": [ "quadruped", "humanoid_wrist", "drone" ], "price_range": "100-200", "ros_support": true, "modalities": [ "geometric", "electrical", "force" ], "modality_details": { "exposed": [ "geometric", "electrical", "force" ], "force": { "declared": true, "torque_nm": 7.2, "weight_kg": 0.215, "force_control_precision_nm": null, "basis": [ "torque", "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": true, "voltage_range": [ 24, 24 ], "protocols": [ "CAN bus" ] }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "CAN", "ros2": true, "interop_posture": "unknown" } }, { "id": "ACT-016", "name": "CubeMars AK80-9", "name_en": "CubeMars AK80-9", "category": "actuators", "entity_kind": "component", "manufacturer": "CubeMars", "type": "integrated_actuator", "specs": { "torque": "17 Nm", "speed": "25.5 rad/s", "weight": "490g", "voltage": "24V", "protocol": "CAN bus", "interface": "CAN", "position_resolution": "14-bit" }, "applications": [ "humanoid", "quadruped", "robot_arm" ], "price_range": "200-400", "ros_support": true, "modalities": [ "geometric", "electrical", "force" ], "modality_details": { "exposed": [ "geometric", "electrical", "force" ], "force": { "declared": true, "torque_nm": 17, "weight_kg": 0.49, "force_control_precision_nm": null, "basis": [ "torque", "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": true, "voltage_range": [ 24, 24 ], "protocols": [ "CAN bus" ] }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "CAN", "ros2": true, "interop_posture": "unknown" } }, { "id": "ACT-017", "name": "Anybotics ANYdrive 3.0", "name_en": "Anybotics ANYdrive 3.0", "category": "actuators", "entity_kind": "component", "manufacturer": "Anybotics", "type": "SEA_actuator", "specs": { "torque": "120 Nm", "speed": "12 rad/s", "weight": "2.1 kg", "voltage": "48V", "protocol": "EtherCAT", "interface": "EtherCAT", "position_resolution": "19-bit" }, "applications": [ "quadruped_ANYmal", "industrial_inspection" ], "price_range": "1000+", "ros_support": true, "modalities": [ "geometric", "electrical", "force" ], "modality_details": { "exposed": [ "geometric", "electrical", "force" ], "force": { "declared": true, "torque_nm": 120, "weight_kg": 2.1, "force_control_precision_nm": null, "basis": [ "torque", "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": true, "voltage_range": [ 48, 48 ], "protocols": [ "EtherCAT" ] }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.58, "verified": false, "quarantine": false, "source_url": "https://www.anybotics.com/" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "EtherCAT", "ros2": true, "interop_posture": "unknown" } }, { "id": "ACT-018", "name": "MIT Mini Cheetah Actuator", "name_en": "MIT Mini Cheetah Actuator", "category": "actuators", "entity_kind": "component", "manufacturer": "MIT/Custom", "type": "integrated_actuator", "specs": { "torque": "17 Nm", "speed": "40.2 rad/s", "weight": "260g", "voltage": "24V", "protocol": "CAN bus", "interface": "CAN", "position_resolution": "14-bit" }, "applications": [ "quadruped", "research" ], "price_range": "200-400", "ros_support": true, "modalities": [ "geometric", "electrical", "force" ], "modality_details": { "exposed": [ "geometric", "electrical", "force" ], "force": { "declared": true, "torque_nm": 17, "weight_kg": 0.26, "force_control_precision_nm": null, "basis": [ "torque", "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": true, "voltage_range": [ 24, 24 ], "protocols": [ "CAN bus" ] }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=MIT%2FCustom%20MIT%20Mini%20Cheetah%20Actuator%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "CAN", "ros2": true, "interop_posture": "unknown" } }, { "id": "ACT-019", "name": "Faulhaber 3268 BP4", "name_en": "Faulhaber 3268 BP4", "category": "actuators", "entity_kind": "component", "manufacturer": "Faulhaber", "type": "DC_micro_motor", "specs": { "torque": "0.108 Nm", "speed": "6000 rpm", "weight": "280g", "voltage": "24V", "protocol": "MCDC controller", "interface": "RS232/CAN", "position_resolution": "external encoder" }, "applications": [ "precision_arm", "medical_robot", "micro_positioning" ], "price_range": "500-1000", "ros_support": true, "modalities": [ "geometric", "electrical", "force" ], "modality_details": { "exposed": [ "geometric", "electrical", "force" ], "force": { "declared": true, "torque_nm": 0.108, "weight_kg": 0.28, "force_control_precision_nm": null, "basis": [ "torque", "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": true, "voltage_range": [ 24, 24 ], "protocols": [ "MCDC controller" ] }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "CAN", "ros2": true, "interop_posture": "unknown" } }, { "id": "ACT-020", "name": "Moog SmartMotor", "name_en": "Moog SmartMotor", "category": "actuators", "entity_kind": "component", "manufacturer": "Moog", "type": "integrated_servo", "specs": { "torque": "varies (up to 50 Nm)", "speed": "varies", "weight": "varies", "voltage": "48-400V", "protocol": "EtherCAT/CANopen", "interface": "EtherCAT/CAN/EthernetIP", "position_resolution": "20-bit" }, "applications": [ "industrial_robot", "simulator", "defense" ], "price_range": "1000+", "ros_support": true, "modalities": [ "geometric", "electrical", "force" ], "modality_details": { "exposed": [ "geometric", "electrical", "force" ], "force": { "declared": true, "torque_nm": 50, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "torque", "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": true, "voltage_range": [ 48, 400 ], "protocols": [ "EtherCAT/CANopen" ] }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "EtherCAT", "ros2": true, "interop_posture": "unknown" } }, { "id": "ACT-021", "name": "Hebi X5 Actuator", "name_en": "Hebi X5 Actuator", "category": "actuators", "entity_kind": "component", "manufacturer": "Hebi Robotics", "type": "integrated_actuator", "specs": { "torque": "15 Nm", "speed": "10 rad/s", "weight": "325g", "voltage": "24V", "protocol": "UDP/TCP", "interface": "Ethernet/WiFi", "position_resolution": "14-bit" }, "applications": [ "modular_robot", "research", "education" ], "price_range": "300-600", "ros_support": true, "modalities": [ "geometric", "electrical", "force" ], "modality_details": { "exposed": [ "geometric", "electrical", "force" ], "force": { "declared": true, "torque_nm": 15, "weight_kg": 0.325, "force_control_precision_nm": null, "basis": [ "torque", "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": true, "voltage_range": [ 24, 24 ], "protocols": [ "UDP/TCP" ] }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.88, "verified": true, "quarantine": false, "source_url": "https://www.hebirobotics.com/actuators" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "Ethernet", "ros2": true, "interop_posture": "unknown" } }, { "id": "ACT-022", "name": "Hebi X8 Actuator", "name_en": "Hebi X8 Actuator", "category": "actuators", "entity_kind": "component", "manufacturer": "Hebi Robotics", "type": "integrated_actuator", "specs": { "torque": "40 Nm", "speed": "6 rad/s", "weight": "660g", "voltage": "24V", "protocol": "UDP/TCP", "interface": "Ethernet/WiFi", "position_resolution": "14-bit" }, "applications": [ "humanoid", "large_manipulator", "research" ], "price_range": "500-800", "ros_support": true, "modalities": [ "geometric", "electrical", "force" ], "modality_details": { "exposed": [ "geometric", "electrical", "force" ], "force": { "declared": true, "torque_nm": 40, "weight_kg": 0.66, "force_control_precision_nm": null, "basis": [ "torque", "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": true, "voltage_range": [ 24, 24 ], "protocols": [ "UDP/TCP" ] }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.88, "verified": true, "quarantine": false, "source_url": "https://www.hebirobotics.com/actuators" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "Ethernet", "ros2": true, "interop_posture": "unknown" } }, { "id": "ACT-023", "name": "Kinova Gen3 Actuator", "name_en": "Kinova Gen3 Actuator", "category": "actuators", "entity_kind": "component", "manufacturer": "Kinova", "type": "integrated_actuator", "specs": { "torque": "varies per joint", "speed": "varies", "weight": "integrated", "voltage": "24V", "protocol": "EtherCAT/proprietary", "interface": "EtherCAT", "position_resolution": "high-res" }, "applications": [ "robot_arm", "assistive_robot", "research" ], "price_range": "1000+", "ros_support": true, "modalities": [ "geometric", "electrical", "force" ], "modality_details": { "exposed": [ "geometric", "electrical", "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "torque", "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": true, "voltage_range": [ 24, 24 ], "protocols": [ "EtherCAT/proprietary" ] }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.88, "verified": true, "quarantine": false, "source_url": "https://www.kinovarobotics.com/product/gen3-robots" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "EtherCAT", "ros2": true, "interop_posture": "unknown" } }, { "id": "ACT-024", "name": "RoboDrive ILM 70", "name_en": "RoboDrive ILM 70", "category": "actuators", "entity_kind": "component", "manufacturer": "RoboDrive/Kollmorgen", "type": "frameless_torque_motor", "specs": { "torque": "3.5 Nm continuous", "speed": "3000 rpm", "weight": "0.7 kg", "voltage": "48V", "protocol": "external drive", "interface": "EtherCAT/CANopen", "position_resolution": "external encoder" }, "applications": [ "collaborative_robot", "humanoid_joint", "surgical" ], "price_range": "500-1000", "ros_support": true, "modalities": [ "geometric", "electrical", "force" ], "modality_details": { "exposed": [ "geometric", "electrical", "force" ], "force": { "declared": true, "torque_nm": 3.5, "weight_kg": 0.7, "force_control_precision_nm": null, "basis": [ "torque", "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": true, "voltage_range": [ 48, 48 ], "protocols": [ "external drive" ] }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=RoboDrive%2FKollmorgen%20RoboDrive%20ILM%2070%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "EtherCAT", "ros2": true, "interop_posture": "unknown" } }, { "id": "ACT-025", "name": "Innodisk Flexidrive", "name_en": "Innodisk Flexidrive", "category": "actuators", "entity_kind": "component", "manufacturer": "Innodisk", "type": "linear_actuator", "specs": { "torque": "varies", "speed": "varies", "weight": "varies", "voltage": "12-24V", "protocol": "PWM/UART", "interface": "UART/PWM", "position_resolution": "potentiometer" }, "applications": [ "gripper", "linear_motion", "industrial" ], "price_range": "50-200", "ros_support": true, "modalities": [ "geometric", "electrical", "force" ], "modality_details": { "exposed": [ "geometric", "electrical", "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "torque", "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": true, "voltage_range": [ 12, 24 ], "protocols": [ "PWM/UART" ] }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=Innodisk%20Innodisk%20Flexidrive%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "UART", "ros2": true, "interop_posture": "unknown" } }, { "id": "ACT-026", "name": "Festo DSBC", "name_en": "Festo DSBC", "category": "actuators", "entity_kind": "component", "manufacturer": "Festo", "type": "pneumatic_cylinder", "specs": { "torque": "varies (pneumatic)", "speed": "varies", "weight": "varies", "voltage": "24V (valve)", "protocol": "IO-Link/EtherNetIP", "interface": "IO-Link/EtherNetIP/PROFINET", "position_resolution": "analog/digital" }, "applications": [ "industrial_automation", "gripper", "pick_place" ], "price_range": "200-1000", "ros_support": true, "modalities": [ "geometric", "electrical", "force" ], "modality_details": { "exposed": [ "geometric", "electrical", "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "torque", "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": true, "voltage_range": [ 24, 24 ], "protocols": [ "IO-Link/EtherNetIP" ] }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.festo.com/" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "PROFINET", "ros2": true, "interop_posture": "unknown" } }, { "id": "ACT-027", "name": "Schunk EGP Gripper", "name_en": "Schunk EGP Gripper", "category": "actuators", "entity_kind": "component", "manufacturer": "Schunk", "type": "electric_gripper", "specs": { "torque": "gripping force 25-250N", "speed": "0.05-0.3s", "weight": "0.9 kg", "voltage": "24V", "protocol": "PROFINET/EtherCAT", "interface": "PROFINET/EtherCAT/IO-Link", "position_resolution": "adjustable" }, "applications": [ "pick_place", "assembly", "collaborative_robot" ], "price_range": "500-1500", "ros_support": true, "modalities": [ "geometric", "electrical", "force" ], "modality_details": { "exposed": [ "geometric", "electrical", "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": 0.9, "force_control_precision_nm": null, "basis": [ "torque", "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": true, "voltage_range": [ 24, 24 ], "protocols": [ "PROFINET/EtherCAT" ] }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.58, "verified": false, "quarantine": false, "source_url": "https://schunk.com/" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "EtherCAT", "ros2": true, "interop_posture": "unknown" } }, { "id": "ACT-028", "name": "Robotiq 2F-85 Gripper", "name_en": "Robotiq 2F-85 Gripper", "category": "actuators", "entity_kind": "component", "manufacturer": "Robotiq", "type": "adaptive_gripper", "specs": { "torque": "gripping force 20-235N", "speed": "0.15-1.2s", "weight": "0.9 kg", "voltage": "24V", "protocol": "Modbus TCP", "interface": "Ethernet/USB/RS485", "position_resolution": "4 positions" }, "applications": [ "pick_place", "machine_tending", "collaborative_robot" ], "price_range": "300-600", "ros_support": true, "modalities": [ "geometric", "electrical", "force" ], "modality_details": { "exposed": [ "geometric", "electrical", "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": 0.9, "force_control_precision_nm": null, "basis": [ "torque", "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [ [ "ISO 9409-1-50-4-M6", "ISO 9409-1-31.5-4-M5", "ISO 9409-1-40-4-M6" ] ] }, "electrical": { "declared": true, "voltage_range": [ 24, 24 ], "protocols": [ "Modbus TCP" ] }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.95, "verified": true, "quarantine": false, "source_url": "https://assets.robotiq.com/website-assets/support_documents/document/2F-85_2F-140_TM-OMRON_InstructionManual_20190206.pdf" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "RS485", "ros2": true, "interop_posture": "unknown" } }, { "id": "ACT-029", "name": "Dexai Allegro Hand v4", "name_en": "Dexai Allegro Hand v4", "category": "actuators", "entity_kind": "component", "manufacturer": "Dexai/Wonik Robotics", "type": "dexterous_hand", "specs": { "torque": "varies per joint", "speed": "varies", "weight": "1.1 kg", "voltage": "24V", "protocol": "EtherCAT", "interface": "EtherCAT", "position_resolution": "16-bit per joint" }, "applications": [ "dexterous_manipulation", "research", "humanoid_hand" ], "price_range": "5000+", "ros_support": true, "modalities": [ "geometric", "electrical", "force" ], "modality_details": { "exposed": [ "geometric", "electrical", "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": 1.1, "force_control_precision_nm": null, "basis": [ "torque", "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": true, "voltage_range": [ 24, 24 ], "protocols": [ "EtherCAT" ] }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=Dexai%2FWonik%20Robotics%20Dexai%20Allegro%20Hand%20v4%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "EtherCAT", "ros2": true, "interop_posture": "unknown" } }, { "id": "ACT-030", "name": "Shadow Dexterous Hand", "name_en": "Shadow Dexterous Hand", "category": "actuators", "entity_kind": "component", "manufacturer": "Shadow Robot", "type": "dexterous_hand", "specs": { "torque": "varies per joint", "speed": "varies", "weight": "4.3 kg", "voltage": "24V", "protocol": "EtherCAT/proprietary", "interface": "EtherCAT/USB", "position_resolution": "high-res per joint" }, "applications": [ "dexterous_manipulation", "research", "teleoperation" ], "price_range": "10000+", "ros_support": true, "modalities": [ "geometric", "electrical", "force" ], "modality_details": { "exposed": [ "geometric", "electrical", "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": 4.3, "force_control_precision_nm": null, "basis": [ "torque", "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": true, "voltage_range": [ 24, 24 ], "protocols": [ "EtherCAT/proprietary" ] }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.88, "verified": true, "quarantine": false, "source_url": "https://www.shadowrobot.com/dexterous-hand-series/" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "EtherCAT", "ros2": true, "interop_posture": "unknown" } }, { "id": "ACT-031", "name": "Lynxmotion LSS Arm", "name_en": "Lynxmotion LSS Arm", "category": "actuators", "entity_kind": "component", "manufacturer": "Lynxmotion", "type": "smart_servo", "specs": { "torque": "3.2 Nm", "speed": "0.18 sec/60°", "weight": "56g", "voltage": "6-12V", "protocol": "UART", "interface": "UART/daisy-chain", "position_resolution": "10-bit" }, "applications": [ "education", "hobby_robot", "small_arm" ], "price_range": "0-50", "ros_support": false, "modalities": [ "geometric", "electrical", "force" ], "modality_details": { "exposed": [ "geometric", "electrical", "force" ], "force": { "declared": true, "torque_nm": 3.2, "weight_kg": 0.056, "force_control_precision_nm": null, "basis": [ "torque", "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": true, "voltage_range": [ 6, 12 ], "protocols": [ "UART" ] }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": false, "source_url": "https://lynxmotion.com/product/lynxmotion-lss-arm" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "UART", "ros2": false, "interop_posture": "unknown" } }, { "id": "ACT-032", "name": "Agility Robotics Digit Actuator", "name_en": "Agility Robotics Digit Actuator", "category": "actuators", "entity_kind": "component", "manufacturer": "Agility Robotics", "type": "custom_actuator", "specs": { "torque": "classified", "speed": "classified", "weight": "classified", "voltage": "classified", "protocol": "proprietary", "interface": "proprietary bus", "position_resolution": "classified" }, "applications": [ "Digit humanoid" ], "price_range": "N/A (internal)", "ros_support": false, "modalities": [ "geometric", "electrical", "force" ], "modality_details": { "exposed": [ "geometric", "electrical", "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "torque", "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": true, "voltage_range": null, "protocols": [ "proprietary" ] }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.58, "verified": false, "quarantine": false, "source_url": "https://www.agilityrobotics.com/" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "proprietary", "ros2": false, "interop_posture": "unknown" } }, { "id": "ACT-mit-electrofluidic", "name": "MIT Electrofluidic Fiber Muscles", "name_en": "MIT Electrofluidic Fiber Muscles", "category": "actuators", "entity_kind": "component", "manufacturer": null, "type": "artificial_muscle", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.72, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-hyundai-gripper", "name": "Hyundai Custom Robot Gripper", "name_en": "Hyundai Custom Robot Gripper", "category": "actuators", "entity_kind": "component", "manufacturer": null, "type": "gripper", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-schaeffler-planetary", "name": "Schaeffler Planetary Gear Actuator", "name_en": "Schaeffler Planetary Gear Actuator", "category": "actuators", "entity_kind": "component", "manufacturer": "Schaeffler", "type": "planetary_gear_actuator", "specs": { "torque": "高扭矩密度", "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "industrial" ], "price_range": "enterprise", "ros_support": null, "modalities": [ "force" ], "modality_details": { "exposed": [ "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "torque" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.72, "verified": true, "quarantine": false, "source_url": "https://www.schaeffler.com/products/schaeffler-planetary-gear-actuator" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-lg-actuator", "name": "LG Electronics Robotics Actuator", "name_en": "LG Electronics Robotics Actuator", "category": "actuators", "entity_kind": "component", "manufacturer": "LG Electronics", "type": "smart_actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "home_service" ], "price_range": "consumer", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.72, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=LG%20Electronics%20LG%20Electronics%20Robotics%20Actuator%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-tesla-optimus-hand", "name": "Tesla Optimus Gen 3 Hand Actuator", "name_en": "Tesla Optimus Gen 3 Hand Actuator", "category": "actuators", "entity_kind": "component", "manufacturer": "Tesla", "type": "dexterous_hand", "specs": { "torque": "精密力控", "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "manipulation" ], "price_range": "enterprise", "ros_support": null, "modalities": [ "force" ], "modality_details": { "exposed": [ "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "torque" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": "https://tesla.com/tesla-optimus-gen-3-hand-actuator" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "closed" } }, { "id": "ACT-robotis-20dof-hand", "name": "ROBOTIS 20-DOF Robot Hand", "name_en": "ROBOTIS 20-DOF Robot Hand", "category": "actuators", "entity_kind": "component", "manufacturer": "ROBOTIS", "type": "dexterous_hand", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "research", "manipulation" ], "price_range": "500-2000", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=ROBOTIS%20ROBOTIS%2020-DOF%20Robot%20Hand%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-first-a301", "name": "FIRST A301 Motor", "name_en": "FIRST A301 Motor", "category": "actuators", "entity_kind": "component", "manufacturer": "FIRST", "type": "standard_motor", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "education", "competition", "hobby" ], "price_range": "0-100", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=FIRST%20FIRST%20A301%20Motor%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-high-torque-mini-hi", "name": "High Torque Robotics Mini Hi", "name_en": "High Torque Robotics Mini Hi", "category": "actuators", "entity_kind": "component", "manufacturer": "High Torque Robotics", "type": "high_torque_actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "industrial" ], "price_range": "enterprise", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.45, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=High%20Torque%20Robotics%20High%20Torque%20Robotics%20Mini%20Hi%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-high-torque-pi", "name": "High Torque Robotics Pi", "name_en": "High Torque Robotics Pi", "category": "actuators", "entity_kind": "component", "manufacturer": "High Torque Robotics", "type": "compact_actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "manipulator" ], "price_range": "enterprise", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.45, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=High%20Torque%20Robotics%20High%20Torque%20Robotics%20Pi%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-hyundai-mobis-atlas", "name": "Hyundai Mobis Atlas Actuator", "name_en": "Hyundai Mobis Atlas Actuator", "category": "actuators", "entity_kind": "component", "manufacturer": "Hyundai Mobis", "type": "mass_production_actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "industrial" ], "price_range": "enterprise", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.72, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=Hyundai%20Mobis%20Hyundai%20Mobis%20Atlas%20Actuator%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-unitree-b2-motor-v2", "name": "Unitree B2 Motor v2", "name_en": "Unitree B2 Motor v2", "category": "actuators", "entity_kind": "component", "manufacturer": "Unitree", "type": "smart_actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "quadruped" ], "price_range": "200-500", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": "https://www.unitree.com/" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "semi_open" } }, { "id": "ACT-figure-03-actuator", "name": "Figure 03 Custom Actuator", "name_en": "Figure 03 Custom Actuator", "category": "actuators", "entity_kind": "component", "manufacturer": "Figure AI", "type": "custom_actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "industrial" ], "price_range": "enterprise", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=Figure%20AI%20Figure%2003%20Custom%20Actuator%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "closed" } }, { "id": "ACT-atlas-electric-actuator", "name": "Boston Dynamics Electric Atlas Actuator", "name_en": "Boston Dynamics Electric Atlas Actuator", "category": "actuators", "entity_kind": "component", "manufacturer": "Boston Dynamics", "type": "electric_actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "industrial" ], "price_range": "enterprise", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.72, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=Boston%20Dynamics%20Boston%20Dynamics%20Electric%20Atlas%20Actuator%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-kai-humanoid-actuator", "name": "KAI Humanoid Actuator", "name_en": "KAI Humanoid Actuator", "category": "actuators", "entity_kind": "component", "manufacturer": "KAI Robotics", "type": "humanoid_actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid" ], "price_range": "enterprise", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.45, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=KAI%20Robotics%20KAI%20Humanoid%20Actuator%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-omni-humanoid-actuator", "name": "OMNI Humanoid Actuator", "name_en": "OMNI Humanoid Actuator", "category": "actuators", "entity_kind": "component", "manufacturer": "OMNI Robotics", "type": "humanoid_actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "service" ], "price_range": "enterprise", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.45, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=OMNI%20Robotics%20OMNI%20Humanoid%20Actuator%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-1x-neo-actuator", "name": "1X NEO Actuator", "name_en": "1X NEO Actuator", "category": "actuators", "entity_kind": "component", "manufacturer": "1X Technologies", "type": "humanoid_actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "home_service" ], "price_range": "enterprise", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=1X%20Technologies%201X%20NEO%20Actuator%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-schaeffler-hexagon", "name": "Schaeffler-Hexagon Joint Module", "name_en": "Schaeffler-Hexagon Joint Module", "category": "actuators", "entity_kind": "component", "manufacturer": "Schaeffler/Hexagon Robotics", "type": "joint_module", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "industrial" ], "price_range": "enterprise", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.72, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=Schaeffler%2FHexagon%20Robotics%20Schaeffler-Hexagon%20Joint%20Module%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-tmotor-ak80-9-v2", "name": "T-Motor AK80-9 v2", "name_en": "T-Motor AK80-9 v2", "category": "actuators", "entity_kind": "component", "manufacturer": "T-Motor", "type": "smart_actuator", "specs": { "torque": "17.8 Nm", "speed": "8.1 rad/s", "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "quadruped", "manipulator" ], "price_range": "200-500", "ros_support": null, "modalities": [ "force" ], "modality_details": { "exposed": [ "force" ], "force": { "declared": true, "torque_nm": 17.8, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "torque" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=T-Motor%20T-Motor%20AK80-9%20v2%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-cubemars-gl40-v2", "name": "CubeMars GL40 v2", "name_en": "CubeMars GL40 v2", "category": "actuators", "entity_kind": "component", "manufacturer": "CubeMars", "type": "smart_actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "quadruped" ], "price_range": "200-500", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=CubeMars%20CubeMars%20GL40%20v2%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-faulhaber-3274", "name": "Faulhaber 3274 BP4", "name_en": "Faulhaber 3274 BP4", "category": "actuators", "entity_kind": "component", "manufacturer": "Faulhaber", "type": "micro_motor", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "medical", "precision" ], "price_range": "500-1000", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.72, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=Faulhaber%20Faulhaber%203274%20BP4%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-moog-smartmotor-v2", "name": "Moog SmartMotor v2", "name_en": "Moog SmartMotor v2", "category": "actuators", "entity_kind": "component", "manufacturer": "Moog", "type": "smart_servo", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "industrial_robot", "CNC", "humanoid" ], "price_range": "1000-5000", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.72, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=Moog%20Moog%20SmartMotor%20v2%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-schaeffler-compact", "name": "Schaeffler Compact Actuator (CES 2026)", "name_en": "Schaeffler Compact Actuator (CES 2026)", "category": "actuators", "entity_kind": "component", "manufacturer": "Schaeffler", "type": "integrated_actuator", "specs": { "torque": "高扭矩密度", "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "industrial" ], "price_range": "enterprise", "ros_support": null, "modalities": [ "force" ], "modality_details": { "exposed": [ "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "torque" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.72, "verified": true, "quarantine": false, "source_url": "https://www.schaeffler.com/products/schaeffler-compact-actuator-ces-2026" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-kpower-servo", "name": "Kpower Humanoid Servo", "name_en": "Kpower Humanoid Servo", "category": "actuators", "entity_kind": "component", "manufacturer": "Kpower (广东)", "type": "smart_servo", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "education" ], "price_range": "50-300", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=Kpower%20(%E5%B9%BF%E4%B8%9C)%20Kpower%20Humanoid%20Servo%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-welling-joint", "name": "Welling Parts Joint Module", "name_en": "Welling Parts Joint Module", "category": "actuators", "entity_kind": "component", "manufacturer": "Welling Parts", "type": "integrated_actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "industrial" ], "price_range": "enterprise", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=Welling%20Parts%20Welling%20Parts%20Joint%20Module%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-mosrac-whg240", "name": "Mosrac WHG-240 Frameless BLDC", "name_en": "Mosrac WHG-240 Frameless BLDC", "category": "actuators", "entity_kind": "component", "manufacturer": "Mosrac", "type": "frameless_torque_motor", "specs": { "torque": "高扭矩密度", "speed": "低转速高扭矩", "weight": "轻量化", "voltage": "48V", "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "collaborative_robot" ], "price_range": "200-500", "ros_support": null, "modalities": [ "electrical", "force" ], "modality_details": { "exposed": [ "electrical", "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "torque", "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": true, "voltage_range": [ 48, 48 ], "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=Mosrac%20Mosrac%20WHG-240%20Frameless%20BLDC%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-honpine-hpjm-v2", "name": "HONPINE HPJM v2 Joint Module", "name_en": "HONPINE HPJM v2 Joint Module", "category": "actuators", "entity_kind": "component", "manufacturer": "HONPINE", "type": "integrated_actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "manipulator" ], "price_range": "enterprise", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=HONPINE%20HONPINE%20HPJM%20v2%20Joint%20Module%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-ct-unite-gan-encoder-actuator", "name": "CT-Unite GaN Encoder Actuator", "name_en": "CT-Unite GaN Encoder Actuator", "category": "actuators", "entity_kind": "component", "manufacturer": "CT-Unite", "type": "smart_actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "industrial" ], "price_range": "enterprise", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=CT-Unite%20CT-Unite%20GaN%20Encoder%20Actuator%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-optimus-gen3-hand", "name": "Tesla Optimus Gen 3 Hand (50 Actuators)", "name_en": "Tesla Optimus Gen 3 Hand (50 Actuators)", "category": "actuators", "entity_kind": "component", "manufacturer": "Tesla", "type": "dexterous_hand", "specs": { "torque": "精密力控", "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "manipulation", "assembly" ], "price_range": "enterprise", "ros_support": null, "modalities": [ "force" ], "modality_details": { "exposed": [ "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "torque" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.72, "verified": true, "quarantine": false, "source_url": "https://tesla.com/tesla-optimus-gen-3-hand-50-actuators" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "closed" } }, { "id": "ACT-neura-dyna-hand", "name": "Neura Dyna Dexterous Hand", "name_en": "Neura Dyna Dexterous Hand", "category": "actuators", "entity_kind": "component", "manufacturer": "Neura Robotics", "type": "dexterous_hand", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "manipulation" ], "price_range": "enterprise", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=Neura%20Robotics%20Neura%20Dyna%20Dexterous%20Hand%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-lg-cloid-actuator", "name": "LG Cloid Robotics Actuator", "name_en": "LG Cloid Robotics Actuator", "category": "actuators", "entity_kind": "component", "manufacturer": "LG Electronics", "type": "smart_actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "home_service" ], "price_range": "consumer", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.72, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=LG%20Electronics%20LG%20Cloid%20Robotics%20Actuator%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-keyirobot-hand", "name": "KeyiRobot Dexterous Hand Actuator", "name_en": "KeyiRobot Dexterous Hand Actuator", "category": "actuators", "entity_kind": "component", "manufacturer": "KeyiRobot", "type": "dexterous_hand", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "manipulation" ], "price_range": "enterprise", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=KeyiRobot%20KeyiRobot%20Dexterous%20Hand%20Actuator%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-schaeffler-4in1-compact", "name": "Schaeffler 4-in-1 Compact Actuator", "name_en": "Schaeffler 4-in-1 Compact Actuator", "category": "actuators", "entity_kind": "component", "manufacturer": "Schaeffler", "type": "integrated_actuator", "specs": { "torque": "高扭矩密度", "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "industrial" ], "price_range": "enterprise", "ros_support": null, "modalities": [ "force" ], "modality_details": { "exposed": [ "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "torque" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.72, "verified": true, "quarantine": false, "source_url": "https://www.schaeffler.com/products/schaeffler-4-in-1-compact-actuator" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-unitree-g1-hand", "name": "Unitree G1 Dexterous Hand", "name_en": "Unitree G1 Dexterous Hand", "category": "actuators", "entity_kind": "component", "manufacturer": "Unitree", "type": "dexterous_hand", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "manipulation" ], "price_range": "200-500", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.72, "verified": true, "quarantine": false, "source_url": "https://www.unitree.com/" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "semi_open" } }, { "id": "ACT-robozaps-actuator", "name": "RoboZaps Humanoid Actuator Kit", "name_en": "RoboZaps Humanoid Actuator Kit", "category": "actuators", "entity_kind": "component", "manufacturer": "RoboZaps", "type": "actuator_kit", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "education", "research" ], "price_range": "500-2000", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.45, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=RoboZaps%20RoboZaps%20Humanoid%20Actuator%20Kit%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-humanoid-1000-deal", "name": "Humanoid-Schaeffler 1000+ Robot Actuator", "name_en": "Humanoid-Schaeffler 1000+ Robot Actuator", "category": "actuators", "entity_kind": "component", "manufacturer": "Humanoid/Schaeffler", "type": "mass_production_actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "industrial" ], "price_range": "enterprise", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.72, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=Humanoid%2FSchaeffler%20Humanoid-Schaeffler%201000%2B%20Robot%20Actuator%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-inspire-linear-servo", "name": "INSPIRE Micro Linear Servo Actuator", "name_en": "INSPIRE Micro Linear Servo Actuator", "category": "actuators", "entity_kind": "component", "manufacturer": null, "type": "linear_servo", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.6, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-inspire-dexterous-hand", "name": "INSPIRE Dexterous Hand", "name_en": "INSPIRE Dexterous Hand", "category": "actuators", "entity_kind": "component", "manufacturer": null, "type": "dexterous_hand", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.6, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-dea-soft", "name": "Dielectric Elastomer Actuator (DEA)", "name_en": "Dielectric Elastomer Actuator (DEA)", "category": "actuators", "entity_kind": "component", "manufacturer": null, "type": "artificial_muscle", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.6, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-iai-robot-lineup", "name": "IAI America Robot Actuator Lineup", "name_en": "IAI America Robot Actuator Lineup", "category": "actuators", "entity_kind": "component", "manufacturer": null, "type": "smart_actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.6, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-bd-atlas-electric-v2", "name": "Boston Dynamics Atlas Electric Actuator v2", "name_en": "Boston Dynamics Atlas Electric Actuator v2", "category": "actuators", "entity_kind": "component", "manufacturer": null, "type": "integrated_actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.6, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-tesla-optimus-v2", "name": "Tesla Optimus Gen 3 Actuator Suite", "name_en": "Tesla Optimus Gen 3 Actuator Suite", "category": "actuators", "entity_kind": "component", "manufacturer": null, "type": "integrated_actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.6, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-first-a301-v2", "name": "FIRST A301 Motor v2", "name_en": "FIRST A301 Motor v2", "category": "actuators", "entity_kind": "component", "manufacturer": null, "type": "smart_servo", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.6, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-hyundai-bd-atlas-prod", "name": "Hyundai/Boston Dynamics Atlas Production Actuator", "name_en": "Hyundai/Boston Dynamics Atlas Production Actuator", "category": "actuators", "entity_kind": "component", "manufacturer": null, "type": "integrated_actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.6, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "act-schaeffler-modular", "name": "Schaeffler Modular Joint System", "name_en": "Schaeffler Modular Joint System", "category": "actuators", "entity_kind": "component", "manufacturer": null, "type": "modular_actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.72, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "act-kpower-fullbody", "name": "Kpower Full-Body Servo Kit", "name_en": "Kpower Full-Body Servo Kit", "category": "actuators", "entity_kind": "component", "manufacturer": null, "type": "servo_kit", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "act-welling-harmonic", "name": "Welling Parts Harmonic Drive Module", "name_en": "Welling Parts Harmonic Drive Module", "category": "actuators", "entity_kind": "component", "manufacturer": null, "type": "harmonic_drive_joint", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "act-welling-planetary", "name": "Welling Parts Planetary Drive Module", "name_en": "Welling Parts Planetary Drive Module", "category": "actuators", "entity_kind": "component", "manufacturer": null, "type": "planetary_drive_joint", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "act-mosrac-48v-series", "name": "Mosrac 48V BLDC Motor Series", "name_en": "Mosrac 48V BLDC Motor Series", "category": "actuators", "entity_kind": "component", "manufacturer": null, "type": "frameless_bldc", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "act-ct-unite-gan-production", "name": "CT-Unite GaN Encoder Actuator (Production)", "name_en": "CT-Unite GaN Encoder Actuator (Production)", "category": "actuators", "entity_kind": "component", "manufacturer": null, "type": "gan_encoder_actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "act-agility-digit-v2", "name": "Agility Robotics Digit v2 Actuator", "name_en": "Agility Robotics Digit v2 Actuator", "category": "actuators", "entity_kind": "component", "manufacturer": null, "type": "bipedal_actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.72, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-iai-robot", "name": "IAI Intelligent Actuator Robot", "name_en": "IAI Intelligent Actuator Robot", "category": "actuators", "entity_kind": "component", "manufacturer": "IAI America", "type": "integrated_actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "industrial_robot", "pick_place", "assembly" ], "price_range": "200-2000", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=IAI%20America%20IAI%20Intelligent%20Actuator%20Robot%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-iai-new-lineup", "name": "IAI New Robot Lineup", "name_en": "IAI New Robot Lineup", "category": "actuators", "entity_kind": "component", "manufacturer": "IAI", "type": "robot_actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "industrial_robot", "assembly", "pick_place" ], "price_range": "100-2000", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=IAI%20IAI%20New%20Robot%20Lineup%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-cubemars-ak45-36", "name": "CubeMars AK45-36", "name_en": "CubeMars AK45-36", "category": "actuators", "entity_kind": "component", "manufacturer": "CubeMars", "type": "integrated_actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "quadruped", "industrial" ], "price_range": "500-1500", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=CubeMars%20CubeMars%20AK45-36%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-cubemars-ak70-10", "name": "CubeMars AK70-10", "name_en": "CubeMars AK70-10", "category": "actuators", "entity_kind": "component", "manufacturer": "CubeMars", "type": "integrated_actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "exoskeleton" ], "price_range": "400-1200", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=CubeMars%20CubeMars%20AK70-10%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-cubemars-qdd", "name": "CubeMars QDD Motor Series", "name_en": "CubeMars QDD Motor Series", "category": "actuators", "entity_kind": "component", "manufacturer": "CubeMars", "type": "qdd_actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "quadruped", "exoskeleton" ], "price_range": "300-2000", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=CubeMars%20CubeMars%20QDD%20Motor%20Series%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-cubemars-frameless", "name": "CubeMars Frameless Torque Motor", "name_en": "CubeMars Frameless Torque Motor", "category": "actuators", "entity_kind": "component", "manufacturer": "CubeMars", "type": "frameless_motor", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "gimbal", "exoskeleton" ], "price_range": "200-800", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=CubeMars%20CubeMars%20Frameless%20Torque%20Motor%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-bonsystems-bcsa", "name": "Bonsystems BCSA (Cycloidal Smart Actuator)", "name_en": "Bonsystems BCSA (Cycloidal Smart Actuator)", "category": "actuators", "entity_kind": "component", "manufacturer": null, "type": null, "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.6, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-agility-digit-v2", "name": "Agility Robotics Digit New Actuators", "name_en": "Agility Robotics Digit New Actuators", "category": "actuators", "entity_kind": "component", "manufacturer": null, "type": null, "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.6, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-figure-03-helix", "name": "Figure 03 Helix Actuator System", "name_en": "Figure 03 Helix Actuator System", "category": "actuators", "entity_kind": "component", "manufacturer": "Figure AI", "type": "Integrated humanoid actuator suite", "specs": { "torque": "28 joint actuators + 50+ hand actuators (Gen 3 hands)", "speed": "Human-reflex-level visual-to-motion response", "weight": "Full-body integrated", "voltage": "N/A", "protocol": "Proprietary Helix AI control", "interface": "Helix neural interface", "position_resolution": "N/A" }, "applications": [ "humanoid", "home", "industrial", "logistics" ], "price_range": "N/A (commercial platform)", "ros_support": null, "modalities": [ "geometric", "electrical", "force" ], "modality_details": { "exposed": [ "geometric", "electrical", "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "torque", "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": true, "voltage_range": null, "protocols": [ "Proprietary Helix AI control" ] }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "proprietary", "ros2": null, "interop_posture": "closed" } }, { "id": "ACT-tienkung-ultra", "name": "Tien Kung Ultra Actuator System", "name_en": "Tien Kung Ultra Actuator System", "category": "actuators", "entity_kind": "component", "manufacturer": "X-Humanoid", "type": "High-performance humanoid actuator suite", "specs": { "torque": "Full-size humanoid joint actuators", "speed": "Fully autonomous half-marathon in 1:15:00 (21.0975km)", "weight": "Full-size humanoid", "voltage": "N/A", "protocol": "X-Humanoid proprietary", "interface": "Embodied AI control", "position_resolution": "N/A" }, "applications": [ "humanoid", "marathon", "industrial sorting", "competition" ], "price_range": "N/A", "ros_support": null, "modalities": [ "geometric", "electrical", "force" ], "modality_details": { "exposed": [ "geometric", "electrical", "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "torque", "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": true, "voltage_range": null, "protocols": [ "X-Humanoid proprietary" ] }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=X-Humanoid%20Tien%20Kung%20Ultra%20Actuator%20System%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "proprietary", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-tesla-optimus-g3-50act", "name": "Tesla Optimus Gen 3 Actuator System (50 Actuators)", "name_en": "Tesla Optimus Gen 3 Actuator System (50 Actuators)", "category": "actuators", "entity_kind": "component", "manufacturer": "Tesla", "type": "Electromagnetic joint actuators", "specs": { "torque": "Tesla-designed (proprietary)", "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [ "force" ], "modality_details": { "exposed": [ "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "torque" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.85, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "closed" } }, { "id": "ACT-engineai-t800-hightorque", "name": "EngineAI T800 High-Torque Actuator System", "name_en": "EngineAI T800 High-Torque Actuator System", "category": "actuators", "entity_kind": "component", "manufacturer": "EngineAI (China)", "type": "High-torque joint actuators", "specs": { "torque": "Up to 450 N·m peak torque per joint", "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [ "force" ], "modality_details": { "exposed": [ "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "torque" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=EngineAI%20(China)%20EngineAI%20T800%20High-Torque%20Actuator%20System%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-unitree-h1-360nm", "name": "Unitree H1 Joint Motor System", "name_en": "Unitree H1 Joint Motor System", "category": "actuators", "entity_kind": "component", "manufacturer": "Unitree Robotics (China)", "type": "High-torque joint motors for humanoid", "specs": { "torque": "360 N·m maximum (arm joint)", "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [ "force" ], "modality_details": { "exposed": [ "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "torque" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.85, "verified": true, "quarantine": false, "source_url": "https://www.unitree.com/" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "semi_open" } }, { "id": "ACTUATOR-A1B2C3", "name": "Unitree H1 Actuator", "name_en": "Unitree H1 Actuator", "category": "actuators", "entity_kind": "component", "manufacturer": "Unitree Robotics", "type": "Electric Motor", "specs": { "torque": "20 Nm", "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [ "force" ], "modality_details": { "exposed": [ "force" ], "force": { "declared": true, "torque_nm": 20, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "torque" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.4, "verified": false, "quarantine": true, "source_url": "https://www.unitree.com/" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "semi_open" } }, { "id": "ACTUATOR-D4E5F6", "name": "Tesla Optimus Actuator", "name_en": "Tesla Optimus Actuator", "category": "actuators", "entity_kind": "component", "manufacturer": "Tesla", "type": "Electric Motor", "specs": { "torque": "15 Nm", "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [ "force" ], "modality_details": { "exposed": [ "force" ], "force": { "declared": true, "torque_nm": 15, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "torque" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://tesla.com/tesla-optimus-actuator" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "closed" } }, { "id": "ACTUATOR-G7H8I9", "name": "Boston Dynamics Atlas Actuator", "name_en": "Boston Dynamics Atlas Actuator", "category": "actuators", "entity_kind": "component", "manufacturer": "Boston Dynamics", "type": "Hydraulic", "specs": { "torque": "50 Nm", "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [ "force" ], "modality_details": { "exposed": [ "force" ], "force": { "declared": true, "torque_nm": 50, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "torque" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.google.com/search?q=Boston%20Dynamics%20Boston%20Dynamics%20Atlas%20Actuator%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACTUATOR-J0K1L2", "name": "Figure AI Actuator", "name_en": "Figure AI Actuator", "category": "actuators", "entity_kind": "component", "manufacturer": "Figure AI", "type": "Electric Motor", "specs": { "torque": "18 Nm", "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [ "force" ], "modality_details": { "exposed": [ "force" ], "force": { "declared": true, "torque_nm": 18, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "torque" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.google.com/search?q=Figure%20AI%20Figure%20AI%20Actuator%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "closed" } }, { "id": "ACTUATOR-M3N4O5", "name": "Agility Robotics Digit Actuator", "name_en": "Agility Robotics Digit Actuator", "category": "actuators", "entity_kind": "component", "manufacturer": "Agility Robotics", "type": "Electric Motor", "specs": { "torque": "25 Nm", "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [ "force" ], "modality_details": { "exposed": [ "force" ], "force": { "declared": true, "torque_nm": 25, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "torque" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.google.com/search?q=Agility%20Robotics%20Agility%20Robotics%20Digit%20Actuator%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACTUATOR-P6Q7R8", "name": "Apptronik Apollo Actuator", "name_en": "Apptronik Apollo Actuator", "category": "actuators", "entity_kind": "component", "manufacturer": "Apptronik", "type": "Electric Motor", "specs": { "torque": "22 Nm", "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [ "force" ], "modality_details": { "exposed": [ "force" ], "force": { "declared": true, "torque_nm": 22, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "torque" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.google.com/search?q=Apptronik%20Apptronik%20Apollo%20Actuator%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACTUATOR-S9T0U1", "name": "1X NEO Actuator", "name_en": "1X NEO Actuator", "category": "actuators", "entity_kind": "component", "manufacturer": "1X Technologies", "type": "Electric Motor", "specs": { "torque": "16 Nm", "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [ "force" ], "modality_details": { "exposed": [ "force" ], "force": { "declared": true, "torque_nm": 16, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "torque" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.google.com/search?q=1X%20Technologies%201X%20NEO%20Actuator%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACTUATOR-V2W3X4", "name": "AgiBot Actuator", "name_en": "AgiBot Actuator", "category": "actuators", "entity_kind": "component", "manufacturer": "AgiBot", "type": "Electric Motor", "specs": { "torque": "19 Nm", "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [ "force" ], "modality_details": { "exposed": [ "force" ], "force": { "declared": true, "torque_nm": 19, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "torque" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.agibot.cn/" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "semi_open" } }, { "id": "ACTUATOR-abc123", "name": "Unitree G1", "name_en": "Unitree G1", "category": "actuators", "entity_kind": "component", "manufacturer": "杭州宇树科技有限公司", "type": "伺服电机", "specs": { "torque": "未明确", "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [ "force" ], "modality_details": { "exposed": [ "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "torque" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.unitree.com/" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "semi_open" } }, { "id": "ACTUATOR-def456", "name": "Galbot G1", "name_en": "Galbot G1", "category": "actuators", "entity_kind": "component", "manufacturer": "北京银河通用机器人有限公司", "type": "伺服电机", "specs": { "torque": "未明确", "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [ "force" ], "modality_details": { "exposed": [ "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "torque" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.google.com/search?q=%E5%8C%97%E4%BA%AC%E9%93%B6%E6%B2%B3%E9%80%9A%E7%94%A8%E6%9C%BA%E5%99%A8%E4%BA%BA%E6%9C%89%E9%99%90%E5%85%AC%E5%8F%B8%20Galbot%20G1%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACTUATOR-ghi789", "name": "天工2.0", "name_en": "Tiangong 2.0", "category": "actuators", "entity_kind": "component", "manufacturer": "国地共建具身智能机器人创新中心", "type": "伺服电机", "specs": { "torque": "未明确", "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [ "force" ], "modality_details": { "exposed": [ "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "torque" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.google.com/search?q=%E5%9B%BD%E5%9C%B0%E5%85%B1%E5%BB%BA%E5%85%B7%E8%BA%AB%E6%99%BA%E8%83%BD%E6%9C%BA%E5%99%A8%E4%BA%BA%E5%88%9B%E6%96%B0%E4%B8%AD%E5%BF%83%20%E5%A4%A9%E5%B7%A52.0%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACTUATOR-jkl012", "name": "众擎PM01人形机器人", "name_en": "Zhongqing PM01 Humanoid Robot", "category": "actuators", "entity_kind": "component", "manufacturer": "未明确", "type": "伺服电机", "specs": { "torque": "未明确", "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [ "force" ], "modality_details": { "exposed": [ "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "torque" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.google.com/search?q=%E6%9C%AA%E6%98%8E%E7%A1%AE%20%E4%BC%97%E6%93%8EPM01%E4%BA%BA%E5%BD%A2%E6%9C%BA%E5%99%A8%E4%BA%BA%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACTUATOR-mno345", "name": "Figure AI执行器", "name_en": "Figure AI Actuator", "category": "actuators", "entity_kind": "component", "manufacturer": "Figure AI", "type": "伺服电机", "specs": { "torque": "未明确", "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [ "force" ], "modality_details": { "exposed": [ "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "torque" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.google.com/search?q=Figure%20AI%20Figure%20AI%E6%89%A7%E8%A1%8C%E5%99%A8%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "closed" } }, { "id": "ACTUATOR-pqr678", "name": "Agility Robotics执行器", "name_en": "Agility Robotics Actuator", "category": "actuators", "entity_kind": "component", "manufacturer": "Agility Robotics", "type": "伺服电机", "specs": { "torque": "未明确", "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [ "force" ], "modality_details": { "exposed": [ "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "torque" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.google.com/search?q=Agility%20Robotics%20Agility%20Robotics%E6%89%A7%E8%A1%8C%E5%99%A8%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACTUATOR-stu901", "name": "特斯拉执行器", "name_en": "Tesla Actuator", "category": "actuators", "entity_kind": "component", "manufacturer": "特斯拉", "type": "伺服电机", "specs": { "torque": "未明确", "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [ "force" ], "modality_details": { "exposed": [ "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "torque" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.google.com/search?q=%E7%89%B9%E6%96%AF%E6%8B%89%20%E7%89%B9%E6%96%AF%E6%8B%89%E6%89%A7%E8%A1%8C%E5%99%A8%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACTUATOR-vwx234", "name": "波士顿动力执行器", "name_en": "Boston Dynamics Actuator", "category": "actuators", "entity_kind": "component", "manufacturer": "波士顿动力", "type": "伺服电机", "specs": { "torque": "未明确", "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [ "force" ], "modality_details": { "exposed": [ "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "torque" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.google.com/search?q=%E6%B3%A2%E5%A3%AB%E9%A1%BF%E5%8A%A8%E5%8A%9B%20%E6%B3%A2%E5%A3%AB%E9%A1%BF%E5%8A%A8%E5%8A%9B%E6%89%A7%E8%A1%8C%E5%99%A8%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACTUATOR-yza567", "name": "Apptronik执行器", "name_en": "Apptronik Actuator", "category": "actuators", "entity_kind": "component", "manufacturer": "Apptronik", "type": "伺服电机", "specs": { "torque": "未明确", "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [ "force" ], "modality_details": { "exposed": [ "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "torque" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.google.com/search?q=Apptronik%20Apptronik%E6%89%A7%E8%A1%8C%E5%99%A8%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACTUATOR-bcd890", "name": "1X Technologies执行器", "name_en": "1X Technologies Actuator", "category": "actuators", "entity_kind": "component", "manufacturer": "1X Technologies", "type": "伺服电机", "specs": { "torque": "未明确", "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [ "force" ], "modality_details": { "exposed": [ "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "torque" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.google.com/search?q=1X%20Technologies%201X%20Technologies%E6%89%A7%E8%A1%8C%E5%99%A8%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACTUATOR-efg123", "name": "AgiBot执行器", "name_en": "AgiBot Actuator", "category": "actuators", "entity_kind": "component", "manufacturer": "AgiBot", "type": "伺服电机", "specs": { "torque": "未明确", "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [ "force" ], "modality_details": { "exposed": [ "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "torque" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.agibot.cn/" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "semi_open" } }, { "id": "ACT-118", "name": "MegaTorque Pro-X", "name_en": "MegaTorque Pro-X", "category": "actuators", "entity_kind": "component", "manufacturer": "RoboDrive Dynamics", "type": "Brushless DC", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.google.com/search?q=RoboDrive%20Dynamics%20MegaTorque%20Pro-X%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-119", "name": "PrecisionGrip Servo", "name_en": "PrecisionGrip Servo", "category": "actuators", "entity_kind": "component", "manufacturer": "Synthetic Motion Systems", "type": "Digital", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.google.com/search?q=Synthetic%20Motion%20Systems%20PrecisionGrip%20Servo%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-120", "name": "PowerPak Hydraulic Cylinder", "name_en": "PowerPak Hydraulic Cylinder", "category": "actuators", "entity_kind": "component", "manufacturer": "FluidForce Inc", "type": "Linear Actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.google.com/search?q=FluidForce%20Inc%20PowerPak%20Hydraulic%20Cylinder%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-121", "name": "AirLift Pneumatic Piston", "name_en": "AirLift Pneumatic Piston", "category": "actuators", "entity_kind": "component", "manufacturer": "CompressTech Solutions", "type": "Linear Actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.google.com/search?q=CompressTech%20Solutions%20AirLift%20Pneumatic%20Piston%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-122", "name": "NanoFlex SMA Wire", "name_en": "NanoFlex SMA Wire", "category": "actuators", "entity_kind": "component", "manufacturer": "Smart Materials Co", "type": "Muscle Wire", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.google.com/search?q=Smart%20Materials%20Co%20NanoFlex%20SMA%20Wire%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-123", "name": "UltraSonic Piezo Bender", "name_en": "UltraSonic Piezo Bender", "category": "actuators", "entity_kind": "component", "manufacturer": "Precision Piezo Ceramics", "type": "Bender", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.google.com/search?q=Precision%20Piezo%20Ceramics%20UltraSonic%20Piezo%20Bender%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-124", "name": "Titanium Gear Servo", "name_en": "Titanium Gear Servo", "category": "actuators", "entity_kind": "component", "manufacturer": "HeavyBot Components", "type": "High-Torque", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.google.com/search?q=HeavyBot%20Components%20Titanium%20Gear%20Servo%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-125", "name": "Vortex Hydraulic Motor", "name_en": "Vortex Hydraulic Motor", "category": "actuators", "entity_kind": "component", "manufacturer": "FluidForce Inc", "type": "Rotary", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.google.com/search?q=FluidForce%20Inc%20Vortex%20Hydraulic%20Motor%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-126", "name": "SwiftAir Pneumatic Rotary", "name_en": "SwiftAir Pneumatic Rotary", "category": "actuators", "entity_kind": "component", "manufacturer": "CompressTech Solutions", "type": "Rotary Actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.google.com/search?q=CompressTech%20Solutions%20SwiftAir%20Pneumatic%20Rotary%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-127", "name": "ShapeShift SMA Coil", "name_en": "ShapeShift SMA Coil", "category": "actuators", "entity_kind": "component", "manufacturer": "Smart Materials Co", "type": "Helical", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.google.com/search?q=Smart%20Materials%20Co%20ShapeShift%20SMA%20Coil%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-128", "name": "MicroStep Piezo Linear", "name_en": "MicroStep Piezo Linear", "category": "actuators", "entity_kind": "component", "manufacturer": "Precision Piezo Ceramics", "type": "Linear Actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.google.com/search?q=Precision%20Piezo%20Ceramics%20MicroStep%20Piezo%20Linear%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-129", "name": "StealthForce Motor", "name_en": "StealthForce Motor", "category": "actuators", "entity_kind": "component", "manufacturer": "RoboDrive Dynamics", "type": "Stepper", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.google.com/search?q=RoboDrive%20Dynamics%20StealthForce%20Motor%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-130", "name": "GyroServo 360", "name_en": "GyroServo 360", "category": "actuators", "entity_kind": "component", "manufacturer": "Synthetic Motion Systems", "type": "Continuous Rotation", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.google.com/search?q=Synthetic%20Motion%20Systems%20GyroServo%20360%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-131", "name": "PressMaster Hydraulic Press", "name_en": "PressMaster Hydraulic Press", "category": "actuators", "entity_kind": "component", "manufacturer": "FluidForce Inc", "type": "Press", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.google.com/search?q=FluidForce%20Inc%20PressMaster%20Hydraulic%20Press%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-132", "name": "Diaphragm Pneumatic Actuator", "name_en": "Diaphragm Pneumatic Actuator", "category": "actuators", "entity_kind": "component", "manufacturer": "CompressTech Solutions", "type": "Diaphragm", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.google.com/search?q=CompressTech%20Solutions%20Diaphragm%20Pneumatic%20Actuator%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-133", "name": "TorqueMaster Pro X7", "name_en": "TorqueMaster Pro X7", "category": "actuators", "entity_kind": "component", "manufacturer": "RoboDrive Systems", "type": "digital", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.google.com/search?q=RoboDrive%20Systems%20TorqueMaster%20Pro%20X7%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-134", "name": "HydraLift 5000", "name_en": "HydraLift 5000", "category": "actuators", "entity_kind": "component", "manufacturer": "HeavyMotive Inc.", "type": "linear_actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.google.com/search?q=HeavyMotive%20Inc.%20HydraLift%205000%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-135", "name": "PneuSwift Compact", "name_en": "PneuSwift Compact", "category": "actuators", "entity_kind": "component", "manufacturer": "AirLogic Dynamics", "type": "cylinder", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.google.com/search?q=AirLogic%20Dynamics%20PneuSwift%20Compact%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-136", "name": "DynoForce V12", "name_en": "DynoForce V12", "category": "actuators", "entity_kind": "component", "manufacturer": "OmniMotors", "type": "brushless_dc", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.google.com/search?q=OmniMotors%20DynoForce%20V12%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-137", "name": "FlexiWire SMA-50", "name_en": "FlexiWire SMA-50", "category": "actuators", "entity_kind": "component", "manufacturer": "Smart Materials Co.", "type": "muscle_wire", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.google.com/search?q=Smart%20Materials%20Co.%20FlexiWire%20SMA-50%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-138", "name": "NanoPiezo Z-Axis", "name_en": "NanoPiezo Z-Axis", "category": "actuators", "entity_kind": "component", "manufacturer": "Precision Micro Devices", "type": "stack_actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.google.com/search?q=Precision%20Micro%20Devices%20NanoPiezo%20Z-Axis%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-139", "name": "MicroGrip Servo", "name_en": "MicroGrip Servo", "category": "actuators", "entity_kind": "component", "manufacturer": "Microbotics LLC", "type": "analog", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.google.com/search?q=Microbotics%20LLC%20MicroGrip%20Servo%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-140", "name": "PressurMax HP-250", "name_en": "PressurMax HP-250", "category": "actuators", "entity_kind": "component", "manufacturer": "FluidPower Solutions", "type": "rotary_actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.google.com/search?q=FluidPower%20Solutions%20PressurMax%20HP-250%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-141", "name": "VacuGrip Series 4", "name_en": "VacuGrip Series 4", "category": "actuators", "entity_kind": "component", "manufacturer": "AirLogic Dynamics", "type": "vacuum_generator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.google.com/search?q=AirLogic%20Dynamics%20VacuGrip%20Series%204%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-142", "name": "StepperMax NEMA 23", "name_en": "StepperMax NEMA 23", "category": "actuators", "entity_kind": "component", "manufacturer": "OmniMotors", "type": "stepper", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.google.com/search?q=OmniMotors%20StepperMax%20NEMA%2023%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-143", "name": "SmaSpring Actuator", "name_en": "SmaSpring Actuator", "category": "actuators", "entity_kind": "component", "manufacturer": "Smart Materials Co.", "type": "spring_actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.google.com/search?q=Smart%20Materials%20Co.%20SmaSpring%20Actuator%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-144", "name": "BenderPiezo T-100", "name_en": "BenderPiezo T-100", "category": "actuators", "entity_kind": "component", "manufacturer": "Precision Micro Devices", "type": "bender_actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.google.com/search?q=Precision%20Micro%20Devices%20BenderPiezo%20T-100%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-145", "name": "HD Servo 360", "name_en": "HD Servo 360", "category": "actuators", "entity_kind": "component", "manufacturer": "RoboDrive Systems", "type": "continuous_rotation", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.google.com/search?q=RoboDrive%20Systems%20HD%20Servo%20360%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-146", "name": "FlowMaster Valve", "name_en": "FlowMaster Valve", "category": "actuators", "entity_kind": "component", "manufacturer": "HeavyMotive Inc.", "type": "proportional_valve", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.google.com/search?q=HeavyMotive%20Inc.%20FlowMaster%20Valve%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-147", "name": "TurboSpin PMDC", "name_en": "TurboSpin PMDC", "category": "actuators", "entity_kind": "component", "manufacturer": "OmniMotors", "type": "brushed_dc", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.google.com/search?q=OmniMotors%20TurboSpin%20PMDC%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "actuator-sea-001", "name": "SEA-Torque-50 串联弹性驱动器", "name_en": "SEA-Torque-50 Series Elastic Actuator", "category": "actuators", "entity_kind": "component", "manufacturer": null, "type": "SEA", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": "$2000-3500", "ros_support": null, "modalities": [ "force", "tactile" ], "modality_details": { "exposed": [ "force", "tactile" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": 0.5, "basis": [ "bionic_features" ] }, "tactile": { "declared": true, "basis": [ "bionic_features" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "actuator-sea-002", "name": "SEA-Torque-20 紧凑型串联弹性驱动器", "name_en": "SEA-Torque-20 Compact Series Elastic Actuator", "category": "actuators", "entity_kind": "component", "manufacturer": null, "type": "SEA", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": "$800-1500", "ros_support": null, "modalities": [ "force", "tactile" ], "modality_details": { "exposed": [ "force", "tactile" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": 0.2, "basis": [ "bionic_features" ] }, "tactile": { "declared": true, "basis": [ "bionic_features" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "actuator-fea-001", "name": "FlexDrive-100 柔性驱动器", "name_en": "FlexDrive-100 Flexible Actuator", "category": "actuators", "entity_kind": "component", "manufacturer": null, "type": "柔性驱动", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": "$150-400", "ros_support": null, "modalities": [ "force", "tactile" ], "modality_details": { "exposed": [ "force", "tactile" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "bionic_features" ] }, "tactile": { "declared": true, "basis": [ "bionic_features" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "actuator-sm-001", "name": "MuscleWire-10 形状记忆合金驱动器", "name_en": "MuscleWire-10 Shape Memory Alloy Actuator", "category": "actuators", "entity_kind": "component", "manufacturer": null, "type": "SMA", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": "$20-80", "ros_support": null, "modalities": [ "force", "tactile" ], "modality_details": { "exposed": [ "force", "tactile" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "bionic_features" ] }, "tactile": { "declared": true, "basis": [ "bionic_features" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "actuator-spine-001", "name": "BioSpine-7 仿生脊柱模组", "name_en": "BioSpine-7 Bionic Spine Module", "category": "actuators", "entity_kind": "component", "manufacturer": null, "type": "多自由度模组", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": "$5000-8000", "ros_support": null, "modalities": [ "force", "tactile" ], "modality_details": { "exposed": [ "force", "tactile" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "bionic_features" ] }, "tactile": { "declared": true, "basis": [ "bionic_features" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "actuator-hand-001", "name": "Shadow Dexterous Hand 影子灵巧手", "name_en": "Shadow Dexterous Hand", "category": "actuators", "entity_kind": "component", "manufacturer": null, "type": "多指灵巧手", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": "$80000-120000", "ros_support": null, "modalities": [ "force", "tactile" ], "modality_details": { "exposed": [ "force", "tactile" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "bionic_features" ] }, "tactile": { "declared": true, "basis": [ "bionic_features" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": "https://www.shadowrobot.com/" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "actuator-hand-002", "name": "Allegro Hand 四指灵巧手", "name_en": "Allegro Hand Four-Finger Dexterous Hand", "category": "actuators", "entity_kind": "component", "manufacturer": null, "type": "多指灵巧手", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": "$15000-25000", "ros_support": null, "modalities": [ "force", "tactile" ], "modality_details": { "exposed": [ "force", "tactile" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "bionic_features" ] }, "tactile": { "declared": true, "basis": [ "bionic_features" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.85, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "actuator-hand-003", "name": "QB SoftHand 柔性自适应手", "name_en": "QB SoftHand Flexible Adaptive Hand", "category": "actuators", "entity_kind": "component", "manufacturer": null, "type": "柔性自适应手", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": "$8000-15000", "ros_support": null, "modalities": [ "force", "tactile" ], "modality_details": { "exposed": [ "force", "tactile" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "bionic_features" ] }, "tactile": { "declared": true, "basis": [ "bionic_features" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": "https://qbrobotics.com/" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-001", "name": "NVIDIA Jetson Orin NX", "name_en": "NVIDIA Jetson Orin NX", "category": "chips", "entity_kind": "component", "manufacturer": "NVIDIA", "type": "SoC", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "autonomous_vehicle", "robot_vision", "edge_ai" ], "price_range": "00-600", "ros_support": true, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": true, "interop_posture": "unknown" } }, { "id": "CHIP-002", "name": "NVIDIA Jetson AGX Orin", "name_en": "NVIDIA Jetson AGX Orin", "category": "chips", "entity_kind": "component", "manufacturer": "NVIDIA", "type": "SoC", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "autonomous_vehicle", "robot_vision", "industrial_robot" ], "price_range": "600-2000", "ros_support": true, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": true, "interop_posture": "unknown" } }, { "id": "CHIP-003", "name": "Raspberry Pi 5", "name_en": "Raspberry Pi 5", "category": "chips", "entity_kind": "component", "manufacturer": "Raspberry Pi Foundation", "type": "SBC", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "hobby_robot", "education", "iot_robot" ], "price_range": "0-100", "ros_support": true, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.raspberrypi.com/products/raspberry-pi-5/" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": true, "interop_posture": "unknown" } }, { "id": "CHIP-004", "name": "STM32H743", "name_en": "STM32H743", "category": "chips", "entity_kind": "component", "manufacturer": "STMicroelectronics", "type": "MCU", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "motor_control", "sensor_hub", "realtime_control" ], "price_range": "0-20", "ros_support": false, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.88, "verified": true, "quarantine": false, "source_url": "https://www.st.com/en/microcontrollers-microprocessors/stm32h743-753.html" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": false, "interop_posture": "unknown" } }, { "id": "CHIP-005", "name": "ESP32-S3", "name_en": "ESP32-S3", "category": "chips", "entity_kind": "component", "manufacturer": "Espressif", "type": "MCU", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "iot_robot", "wifi_robot", "sensor_node" ], "price_range": "0-5", "ros_support": false, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.88, "verified": true, "quarantine": false, "source_url": "https://www.espressif.com/en/products/socs/esp32-s3" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": false, "interop_posture": "unknown" } }, { "id": "CHIP-006", "name": "Teensy 4.1", "name_en": "Teensy 4.1", "category": "chips", "entity_kind": "component", "manufacturer": "PJRC", "type": "MCU", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "motor_control", "realtime_control", "audio_robot" ], "price_range": "0-30", "ros_support": false, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.88, "verified": true, "quarantine": false, "source_url": "https://www.pjrc.com/store/teensy41.html" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": false, "interop_posture": "unknown" } }, { "id": "CHIP-007", "name": "Rockchip RK3588", "name_en": "Rockchip RK3588", "category": "chips", "entity_kind": "component", "manufacturer": "Rockchip", "type": "SoC", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "robot_vision", "edge_ai", "hobby_robot" ], "price_range": "0-150", "ros_support": true, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": true, "interop_posture": "unknown" } }, { "id": "CHIP-008", "name": "NVIDIA Jetson Thor", "name_en": "NVIDIA Jetson Thor", "category": "chips", "entity_kind": "component", "manufacturer": "NVIDIA", "type": "SoC", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid_robot", "autonomous_vehicle", "physical_ai" ], "price_range": "2000+", "ros_support": true, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": true, "interop_posture": "unknown" } }, { "id": "CHIP-009", "name": "Qualcomm RB6 (QCS6490)", "name_en": "Qualcomm RB6 (QCS6490)", "category": "chips", "entity_kind": "component", "manufacturer": "Qualcomm", "type": "SoC", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "robot_vision", "drone", "AMR" ], "price_range": "200-500", "ros_support": true, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": true, "interop_posture": "unknown" } }, { "id": "CHIP-010", "name": "Intel RealSense D455", "name_en": "Intel RealSense D455", "category": "chips", "entity_kind": "component", "manufacturer": "Intel", "type": "depth_camera", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "robot_vision", "navigation", "object_detection" ], "price_range": "200-400", "ros_support": true, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": true, "interop_posture": "unknown" } }, { "id": "CHIP-011", "name": "Hailo-8 M.2", "name_en": "Hailo-8 M.2", "category": "chips", "entity_kind": "component", "manufacturer": "Hailo", "type": "AI_accelerator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "edge_ai", "robot_vision", "object_detection" ], "price_range": "50-100", "ros_support": false, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.88, "verified": true, "quarantine": false, "source_url": "https://hailo.ai/products/ai-accelerators/hailo-8-ai-accelerator/" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": false, "interop_posture": "unknown" } }, { "id": "CHIP-012", "name": "Google Coral TPU", "name_en": "Google Coral TPU", "category": "chips", "entity_kind": "component", "manufacturer": "Google", "type": "AI_accelerator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "edge_ai", "classification", "detection" ], "price_range": "0-50", "ros_support": false, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://coral.ai/products/" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": false, "interop_posture": "unknown" } }, { "id": "CHIP-013", "name": "NXP i.MX 8M Plus", "name_en": "NXP i.MX 8M Plus", "category": "chips", "entity_kind": "component", "manufacturer": "NXP", "type": "SoC", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "industrial_robot", "vision", "motor_control" ], "price_range": "50-200", "ros_support": true, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=NXP%20NXP%20i.MX%208M%20Plus%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": true, "interop_posture": "unknown" } }, { "id": "CHIP-014", "name": "TI TDA4VM", "name_en": "TI TDA4VM", "category": "chips", "entity_kind": "component", "manufacturer": "Texas Instruments", "type": "SoC", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "automotive_vision", "robot_vision", "ADAS" ], "price_range": "100-300", "ros_support": true, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": true, "interop_posture": "unknown" } }, { "id": "CHIP-015", "name": "Infineon AURIX TC397", "name_en": "Infineon AURIX TC397", "category": "chips", "entity_kind": "component", "manufacturer": "Infineon", "type": "MCU", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "functional_safety", "motor_control", "automotive_robot" ], "price_range": "20-50", "ros_support": false, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=Infineon%20Infineon%20AURIX%20TC397%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": false, "interop_posture": "unknown" } }, { "id": "CHIP-016", "name": "Renesas RZ/V2H", "name_en": "Renesas RZ/V2H", "category": "chips", "entity_kind": "component", "manufacturer": "Renesas", "type": "SoC", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "robot_vision", "industrial_robot", "AMR" ], "price_range": "100-300", "ros_support": true, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": true, "interop_posture": "unknown" } }, { "id": "CHIP-017", "name": "AMD Xilinx Kria K26", "name_en": "AMD Xilinx Kria K26", "category": "chips", "entity_kind": "component", "manufacturer": "AMD/Xilinx", "type": "FPGA_SoC", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "vision_acceleration", "realtime_processing", "industrial_robot" ], "price_range": "200-500", "ros_support": true, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=AMD%2FXilinx%20AMD%20Xilinx%20Kria%20K26%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": true, "interop_posture": "unknown" } }, { "id": "CHIP-018", "name": "Microchip PolarFire SoC", "name_en": "Microchip PolarFire SoC", "category": "chips", "entity_kind": "component", "manufacturer": "Microchip", "type": "FPGA_SoC", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "radiation_hardened", "space_robot", "industrial" ], "price_range": "100-300", "ros_support": true, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.microchip.com/en-us/products/fpgas-and-plds/system-on-chip-fpgas/polarfire-soc-fpgas" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": true, "interop_posture": "unknown" } }, { "id": "CHIP-019", "name": "Horizon Robotics J5", "name_en": "Horizon Robotics J5", "category": "chips", "entity_kind": "component", "manufacturer": "Horizon Robotics", "type": "SoC", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "autonomous_driving", "robot_vision", "AMR" ], "price_range": "200-500", "ros_support": true, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": true, "interop_posture": "unknown" } }, { "id": "CHIP-020", "name": "Allwinner T507", "name_en": "Allwinner T507", "category": "chips", "entity_kind": "component", "manufacturer": "Allwinner", "type": "SoC", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "hobby_robot", "iot_robot", "education" ], "price_range": "0-50", "ros_support": true, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.58, "verified": false, "quarantine": false, "source_url": "https://www.allwinnertech.com/" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": true, "interop_posture": "unknown" } }, { "id": "RP-ct21x-gan-encoder", "name": "CT-Unite CT-21X GaN Magnetic Encoder", "name_en": "CT-Unite CT-21X GaN Magnetic Encoder", "category": "chips", "entity_kind": "component", "manufacturer": null, "type": "chip", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "RP-intel-core-ultra-s3", "name": "Intel Core Ultra Series 3", "name_en": "Intel Core Ultra Series 3", "category": "chips", "entity_kind": "component", "manufacturer": null, "type": "chip", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.72, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "RP-honpine-hpjm", "name": "HONPINE HPJM Integrated Joint Module", "name_en": "HONPINE HPJM Integrated Joint Module", "category": "chips", "entity_kind": "component", "manufacturer": null, "type": "actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-qualcomm-iq10", "name": "Qualcomm Dragonwing IQ10", "name_en": "Qualcomm Dragonwing IQ10", "category": "chips", "entity_kind": "component", "manufacturer": "Qualcomm", "type": "SoC", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "autonomous_vehicle", "drone" ], "price_range": "enterprise", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.72, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=Qualcomm%20Qualcomm%20Dragonwing%20IQ10%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-qualcomm-iq9", "name": "Qualcomm Dragonwing IQ9", "name_en": "Qualcomm Dragonwing IQ9", "category": "chips", "entity_kind": "component", "manufacturer": "Qualcomm", "type": "SoC", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "industrial_robot", "AMR" ], "price_range": "enterprise", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.72, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=Qualcomm%20Qualcomm%20Dragonwing%20IQ9%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-intel-core-ultra-s3-edge", "name": "Intel Core Ultra Series 3 Edge", "name_en": "Intel Core Ultra Series 3 Edge", "category": "chips", "entity_kind": "component", "manufacturer": "Intel", "type": "Edge Processor", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "edge_ai", "robotics" ], "price_range": "300-800", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.72, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=Intel%20Intel%20Core%20Ultra%20Series%203%20Edge%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-nvidia-thor-v2", "name": "NVIDIA Jetson Thor (2026 BC Award)", "name_en": "NVIDIA Jetson Thor (2026 BC Award)", "category": "chips", "entity_kind": "component", "manufacturer": "NVIDIA", "type": "SoC", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "autonomous_vehicle", "industrial_robot" ], "price_range": "1000-3000", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.72, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=NVIDIA%20NVIDIA%20Jetson%20Thor%20(2026%20BC%20Award)%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-amd-ryzen-ai-2026", "name": "AMD Ryzen AI Processor 2026", "name_en": "AMD Ryzen AI Processor 2026", "category": "chips", "entity_kind": "component", "manufacturer": "AMD", "type": "APU", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "edge_ai", "robotics", "humanoid" ], "price_range": "300-1000", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.72, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=AMD%20AMD%20Ryzen%20AI%20Processor%202026%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-microsoft-braga", "name": "Microsoft Braga AI Chip", "name_en": "Microsoft Braga AI Chip", "category": "chips", "entity_kind": "component", "manufacturer": "Microsoft", "type": "AI Accelerator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "cloud_ai", "datacenter" ], "price_range": "enterprise", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=Microsoft%20Microsoft%20Braga%20AI%20Chip%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-gigadevice-gd32h7", "name": "GigaDevice GD32H7 Series", "name_en": "GigaDevice GD32H7 Series", "category": "chips", "entity_kind": "component", "manufacturer": "GigaDevice", "type": "MCU", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "robot_joint", "motor_control", "sensor_hub" ], "price_range": "5-20", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=GigaDevice%20GigaDevice%20GD32H7%20Series%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-advantech-iq10", "name": "Advantech Qualcomm IQ10 Platform", "name_en": "Advantech Qualcomm IQ10 Platform", "category": "chips", "entity_kind": "component", "manufacturer": "Advantech/Qualcomm", "type": "SBC", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "industrial_robot", "AMR" ], "price_range": "1000-3000", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.72, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=Advantech%2FQualcomm%20Advantech%20Qualcomm%20IQ10%20Platform%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-qualcomm-rb6-v2", "name": "Qualcomm RB6 v2 (QCS8250)", "name_en": "Qualcomm RB6 v2 (QCS8250)", "category": "chips", "entity_kind": "component", "manufacturer": "Qualcomm", "type": "SoC", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "AMR", "industrial_robot", "drone" ], "price_range": "enterprise", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=Qualcomm%20Qualcomm%20RB6%20v2%20(QCS8250)%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-horizon-j6", "name": "Horizon Robotics J6", "name_en": "Horizon Robotics J6", "category": "chips", "entity_kind": "component", "manufacturer": "Horizon Robotics", "type": "SoC", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "autonomous_driving", "robotics", "humanoid" ], "price_range": "enterprise", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=Horizon%20Robotics%20Horizon%20Robotics%20J6%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-renesas-rzv2h-v2", "name": "Renesas RZ/V2H v2", "name_en": "Renesas RZ/V2H v2", "category": "chips", "entity_kind": "component", "manufacturer": "Renesas", "type": "SoC", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "industrial_robot", "humanoid", "AMR" ], "price_range": "100-500", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=Renesas%20Renesas%20RZ%2FV2H%20v2%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-ti-tda4vp", "name": "TI TDA4VP", "name_en": "TI TDA4VP", "category": "chips", "entity_kind": "component", "manufacturer": "Texas Instruments", "type": "SoC", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "AMR", "robot_vision", "industrial_robot" ], "price_range": "50-200", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.72, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=Texas%20Instruments%20TI%20TDA4VP%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-mediatek-genio-700", "name": "MediaTek Genio 700", "name_en": "MediaTek Genio 700", "category": "chips", "entity_kind": "component", "manufacturer": "MediaTek", "type": "SoC", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "robot_vision", "edge_ai" ], "price_range": "50-150", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.72, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=MediaTek%20MediaTek%20Genio%20700%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-mediatek-edge-ai-7b", "name": "MediaTek Edge AI Chip (Dual 7B)", "name_en": "MediaTek Edge AI Chip (Dual 7B)", "category": "chips", "entity_kind": "component", "manufacturer": "MediaTek", "type": "SoC", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "companion_robot", "edge_ai" ], "price_range": "200-500", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.72, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=MediaTek%20MediaTek%20Edge%20AI%20Chip%20(Dual%207B)%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-rockchip-rk3588s-v2", "name": "Rockchip RK3588S v2", "name_en": "Rockchip RK3588S v2", "category": "chips", "entity_kind": "component", "manufacturer": "Rockchip", "type": "SoC", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "robot_vision", "edge_ai", "hobby_robot" ], "price_range": "0-150", "ros_support": true, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=Rockchip%20Rockchip%20RK3588S%20v2%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": true, "interop_posture": "unknown" } }, { "id": "CHIP-amlogic-a311d2", "name": "Amlogic A311D2", "name_en": "Amlogic A311D2", "category": "chips", "entity_kind": "component", "manufacturer": "Amlogic", "type": "SoC", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "robot_vision", "edge_ai", "AMR" ], "price_range": "0-100", "ros_support": true, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=Amlogic%20Amlogic%20A311D2%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": true, "interop_posture": "unknown" } }, { "id": "CHIP-intel-core-ultra-s3-robotics", "name": "Intel Core Ultra Series 3 Robotics Edition", "name_en": "Intel Core Ultra Series 3 Robotics Edition", "category": "chips", "entity_kind": "component", "manufacturer": "Intel", "type": "Edge Processor", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "edge_ai", "service_robot", "machine_vision", "industrial_automation" ], "price_range": "300-800", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.72, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=Intel%20Intel%20Core%20Ultra%20Series%203%20Robotics%20Edition%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-qualcomm-iq10-advantech", "name": "Advantech MIC-710AI (IQ10)", "name_en": "Advantech MIC-710AI (IQ10)", "category": "chips", "entity_kind": "component", "manufacturer": "Advantech/Qualcomm", "type": "SBC", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "industrial_robot", "AMR" ], "price_range": "1000-3000", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.72, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=Advantech%2FQualcomm%20Advantech%20MIC-710AI%20(IQ10)%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-gigadevice-gd32h7-robot", "name": "GigaDevice GD32H7 Robot Edition", "name_en": "GigaDevice GD32H7 Robot Edition", "category": "chips", "entity_kind": "component", "manufacturer": "GigaDevice", "type": "MCU", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "robot_joint", "motor_control", "humanoid" ], "price_range": "5-25", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=GigaDevice%20GigaDevice%20GD32H7%20Robot%20Edition%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-nvidia-t5000", "name": "NVIDIA T5000 Robot Chip", "name_en": "NVIDIA T5000 Robot Chip", "category": "chips", "entity_kind": "component", "manufacturer": null, "type": "SoC", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.6, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-qualcomm-robotics-pc", "name": "Qualcomm Robotics PC Chip", "name_en": "Qualcomm Robotics PC Chip", "category": "chips", "entity_kind": "component", "manufacturer": null, "type": "SoC", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.6, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-intel-core-ultra-s3-robee", "name": "Intel Core Ultra Series 3 (RoBee)", "name_en": "Intel Core Ultra Series 3 (RoBee)", "category": "chips", "entity_kind": "component", "manufacturer": null, "type": "SoC", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.6, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-ms-braga-v2", "name": "Microsoft Braga AI Chip v2", "name_en": "Microsoft Braga AI Chip v2", "category": "chips", "entity_kind": "component", "manufacturer": null, "type": "AI_accelerator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.6, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-edge-ai-realtime", "name": "Edge AI Real-Time Learning Chip", "name_en": "Edge AI Real-Time Learning Chip", "category": "chips", "entity_kind": "component", "manufacturer": null, "type": "AI_accelerator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.6, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "chip-qualcomm-iq10-pro", "name": "Qualcomm Dragonwing IQ10 Pro", "name_en": "Qualcomm Dragonwing IQ10 Pro", "category": "chips", "entity_kind": "component", "manufacturer": null, "type": "robotics_processor", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.72, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "chip-nvidia-t5000-v2", "name": "NVIDIA T5000 v2 Robot Chip", "name_en": "NVIDIA T5000 v2 Robot Chip", "category": "chips", "entity_kind": "component", "manufacturer": null, "type": "robotics_processor", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.72, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "chip-mediatek-genio-700-v2", "name": "MediaTek Genio 700 v2", "name_en": "MediaTek Genio 700 v2", "category": "chips", "entity_kind": "component", "manufacturer": null, "type": "edge_ai_processor", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "chip-intel-ultra3-robotics-v2", "name": "Intel Core Ultra Series 3 Robotics v2", "name_en": "Intel Core Ultra Series 3 Robotics v2", "category": "chips", "entity_kind": "component", "manufacturer": null, "type": "edge_processor", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.72, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "chip-amd-ryzen-ai-v2", "name": "AMD Ryzen AI 2026 v2", "name_en": "AMD Ryzen AI 2026 v2", "category": "chips", "entity_kind": "component", "manufacturer": null, "type": "ai_processor", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "chip-nxp-imx95", "name": "NXP i.MX 95", "name_en": "NXP i.MX 95", "category": "chips", "entity_kind": "component", "manufacturer": null, "type": "applications_processor", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "chip-renesas-rzv2l", "name": "Renesas RZ/V2L", "name_en": "Renesas RZ/V2L", "category": "chips", "entity_kind": "component", "manufacturer": null, "type": "entry_ai_processor", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "chip-horizon-j6e", "name": "Horizon Robotics J6E", "name_en": "Horizon Robotics J6E", "category": "chips", "entity_kind": "component", "manufacturer": null, "type": "vision_processor", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-snapdragon-x2-plus", "name": "Qualcomm Snapdragon X2 Plus", "name_en": "Qualcomm Snapdragon X2 Plus", "category": "chips", "entity_kind": "component", "manufacturer": "Qualcomm", "type": "SoC", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "edge_ai", "robotics", "humanoid" ], "price_range": "200-500", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=Qualcomm%20Qualcomm%20Snapdragon%20X2%20Plus%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-intel-ces2026-ai", "name": "Intel CES 2026 AI Chip", "name_en": "Intel CES 2026 AI Chip", "category": "chips", "entity_kind": "component", "manufacturer": "Intel", "type": "Edge Processor", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "edge_ai", "robotics" ], "price_range": "300-1000", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=Intel%20Intel%20CES%202026%20AI%20Chip%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-turbox-irb10", "name": "Thundercomm TurboX IRB10", "name_en": "Thundercomm TurboX IRB10", "category": "chips", "entity_kind": "component", "manufacturer": "Thundercomm/Qualcomm", "type": "开发板", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "amr", "industrial_robot" ], "price_range": "1000-3000", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=Thundercomm%2FQualcomm%20Thundercomm%20TurboX%20IRB10%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-neura-robotics-iq10", "name": "NEURA Robotics IQ10 Platform", "name_en": "NEURA Robotics IQ10 Platform", "category": "chips", "entity_kind": "component", "manufacturer": "NEURA Robotics/Qualcomm", "type": "机器人平台", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "cognitive_robot", "humanoid", "amr" ], "price_range": "N/A", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=NEURA%20Robotics%2FQualcomm%20NEURA%20Robotics%20IQ10%20Platform%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-amd-ryzen-ai-400", "name": "AMD Ryzen AI 400 Series", "name_en": "AMD Ryzen AI 400 Series", "category": "chips", "entity_kind": "component", "manufacturer": null, "type": null, "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.6, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-nvidia-thor-robotics", "name": "NVIDIA Thor (Robotics Variant)", "name_en": "NVIDIA Thor (Robotics Variant)", "category": "chips", "entity_kind": "component", "manufacturer": "NVIDIA", "type": "Robotics SoC / Edge AI accelerator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": "PCIe Gen5, Ethernet, MIPI CSI", "position_resolution": null }, "applications": [ "humanoid", "autonomous_vehicle", "robot_perception" ], "price_range": "N/A (OEM)", "ros_support": null, "modalities": [ "geometric", "electrical" ], "modality_details": { "exposed": [ "geometric", "electrical" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": true, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "Ethernet", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-nvidia-gb10-digits", "name": "NVIDIA GB10 Grace + Blackwell (DIGITS Desktop AI)", "name_en": "NVIDIA GB10 Grace + Blackwell (DIGITS Desktop AI)", "category": "chips", "entity_kind": "component", "manufacturer": "NVIDIA", "type": "Desktop AI computing chip", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=NVIDIA%20NVIDIA%20GB10%20Grace%20%2B%20Blackwell%20(DIGITS%20Desktop%20AI)%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-a1b2c3", "name": "触觉传感芯片", "name_en": "Tactile Sensing Chip", "category": "chips", "entity_kind": "component", "manufacturer": "他山科技", "type": null, "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": true, "source_url": "https://www.google.com/search?q=%E4%BB%96%E5%B1%B1%E7%A7%91%E6%8A%80%20%E8%A7%A6%E8%A7%89%E4%BC%A0%E6%84%9F%E8%8A%AF%E7%89%87%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-66", "name": "Jetson Orin NX", "name_en": "Jetson Orin NX", "category": "chips", "entity_kind": "component", "manufacturer": "NVIDIA", "type": "System-on-Chip (SoC)", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": true, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-67", "name": "Intel RealSense D435i", "name_en": "Intel RealSense D435i", "category": "sensors", "entity_kind": "component", "manufacturer": "Intel", "type": "Depth Camera Module", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-68", "name": "Qualcomm RB5", "name_en": "Qualcomm RB5", "category": "chips", "entity_kind": "component", "manufacturer": "Qualcomm", "type": "Robotics Development Kit", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-69", "name": "AMD Aldebaran", "name_en": "AMD Aldebaran", "category": "chips", "entity_kind": "component", "manufacturer": "AMD", "type": "Graphics Processing Unit (GPU)", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-70", "name": "Jetson AGX Xavier", "name_en": "Jetson AGX Xavier", "category": "chips", "entity_kind": "component", "manufacturer": "NVIDIA", "type": "System-on-Chip (SoC)", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-71", "name": "Intel RealSense L515", "name_en": "Intel RealSense L515", "category": "sensors", "entity_kind": "component", "manufacturer": "Intel", "type": "Depth Camera Module", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-72", "name": "Qualcomm Snapdragon Flight", "name_en": "Qualcomm Snapdragon Flight", "category": "chips", "entity_kind": "component", "manufacturer": "Qualcomm", "type": "System-on-Chip (SoC)", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-73", "name": "AMD Versal AI Edge", "name_en": "AMD Versal AI Edge", "category": "chips", "entity_kind": "component", "manufacturer": "AMD", "type": "Adaptive SoC", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-74", "name": "Jetson Nano", "name_en": "Jetson Nano", "category": "chips", "entity_kind": "component", "manufacturer": "NVIDIA", "type": "System-on-Chip (SoC)", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-75", "name": "Intel Movidius Myriad X", "name_en": "Intel Movidius Myriad X", "category": "chips", "entity_kind": "component", "manufacturer": "Intel", "type": "Vision Processing Unit (VPU)", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-76", "name": "Qualcomm RB3", "name_en": "Qualcomm RB3", "category": "chips", "entity_kind": "component", "manufacturer": "Qualcomm", "type": "Robotics Development Kit", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-77", "name": "AMD Instinct MI300", "name_en": "AMD Instinct MI300", "category": "chips", "entity_kind": "component", "manufacturer": "AMD", "type": "Data Center Accelerator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-78", "name": "Jetson TX2", "name_en": "Jetson TX2", "category": "chips", "entity_kind": "component", "manufacturer": "NVIDIA", "type": "System-on-Chip (SoC)", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-79", "name": "Intel RealSense SR300", "name_en": "Intel RealSense SR300", "category": "sensors", "entity_kind": "component", "manufacturer": "Intel", "type": "Depth Camera Module", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-80", "name": "Qualcomm QRB5165", "name_en": "Qualcomm QRB5165", "category": "chips", "entity_kind": "component", "manufacturer": "Qualcomm", "type": "System-on-Chip (SoC)", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-81", "name": "Jetson Orin NX", "name_en": "Jetson Orin NX", "category": "chips", "entity_kind": "component", "manufacturer": "NVIDIA", "type": "System on Module", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-82", "name": "Jetson AGX Orin", "name_en": "Jetson AGX Orin", "category": "chips", "entity_kind": "component", "manufacturer": "NVIDIA", "type": "System on Module", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-83", "name": "RealSense D435i", "name_en": "RealSense D435i", "category": "sensors", "entity_kind": "component", "manufacturer": "Intel", "type": "Depth Camera", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-84", "name": "RealSense L515", "name_en": "RealSense L515", "category": "sensors", "entity_kind": "component", "manufacturer": "Intel", "type": "Depth Camera", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-85", "name": "Snapdragon 8 Gen 3", "name_en": "Snapdragon 8 Gen 3", "category": "chips", "entity_kind": "component", "manufacturer": "Qualcomm", "type": "System on Chip", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-86", "name": "Snapdragon X Elite", "name_en": "Snapdragon X Elite", "category": "chips", "entity_kind": "component", "manufacturer": "Qualcomm", "type": "System on Chip", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-87", "name": "AMD Ryzen AI 9 HX", "name_en": "AMD Ryzen AI 9 HX", "category": "chips", "entity_kind": "component", "manufacturer": "AMD", "type": "System on Chip", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-88", "name": "AMD Instinct MI300X", "name_en": "AMD Instinct MI300X", "category": "chips", "entity_kind": "component", "manufacturer": "AMD", "type": "GPU Accelerator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-89", "name": "NVIDIA Jetson Nano", "name_en": "NVIDIA Jetson Nano", "category": "chips", "entity_kind": "component", "manufacturer": "NVIDIA", "type": "System on Module", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-90", "name": "Intel Movidius VPU", "name_en": "Intel Movidius VPU", "category": "chips", "entity_kind": "component", "manufacturer": "Intel", "type": "Vision Processing Unit", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-91", "name": "Qualcomm RB5", "name_en": "Qualcomm RB5", "category": "chips", "entity_kind": "component", "manufacturer": "Qualcomm", "type": "Development Kit", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": true, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-92", "name": "AMD Xilinx Zynq UltraScale+ MPSoC", "name_en": "AMD Xilinx Zynq UltraScale+ MPSoC", "category": "chips", "entity_kind": "component", "manufacturer": "AMD", "type": "Programmable Logic", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-93", "name": "NVIDIA Jetson TX2", "name_en": "NVIDIA Jetson TX2", "category": "chips", "entity_kind": "component", "manufacturer": "NVIDIA", "type": "System on Module", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-94", "name": "Intel Neural Compute Stick 2", "name_en": "Intel Neural Compute Stick 2", "category": "chips", "entity_kind": "component", "manufacturer": "Intel", "type": "USB Accelerator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-95", "name": "Qualcomm QRB5165", "name_en": "Qualcomm QRB5165", "category": "chips", "entity_kind": "component", "manufacturer": "Qualcomm", "type": "Robotics Platform", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": true, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-096", "name": "Hailo-8", "name_en": "Hailo-8", "category": "chips", "entity_kind": "component", "manufacturer": "Hailo", "type": "Edge AI Accelerator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "robot_vision", "edge_ai", "autonomous_vehicle" ], "price_range": "170-298", "ros_support": true, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.88, "verified": true, "quarantine": false, "source_url": "https://hailo.ai/products/ai-accelerators/hailo-8-ai-accelerator/" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": true, "interop_posture": "unknown" } }, { "id": "CHIP-097", "name": "Hailo-10H", "name_en": "Hailo-10H", "category": "chips", "entity_kind": "component", "manufacturer": "Hailo", "type": "Edge GenAI Accelerator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "edge_ai", "robot_vision", "generative_ai" ], "price_range": "200-350", "ros_support": false, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.88, "verified": true, "quarantine": false, "source_url": "https://hailo.ai/products/ai-accelerators/hailo-10h-ai-accelerator/" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": false, "interop_posture": "unknown" } }, { "id": "CHIP-098", "name": "Google Coral Edge TPU", "name_en": "Google Coral Edge TPU", "category": "chips", "entity_kind": "component", "manufacturer": "Google", "type": "Edge TPU ASIC", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "robot_vision", "edge_ai", "iot" ], "price_range": "25-170", "ros_support": true, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://coral.ai/products/" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": true, "interop_posture": "unknown" } }, { "id": "CHIP-099", "name": "Rockchip RK3588", "name_en": "Rockchip RK3588", "category": "chips", "entity_kind": "component", "manufacturer": "Rockchip (瑞芯微)", "type": "SoC with NPU", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "amr", "robot_vision", "edge_ai", "drone" ], "price_range": "60-200", "ros_support": true, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.58, "verified": false, "quarantine": false, "source_url": "https://www.rock-chips.com/" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": true, "interop_posture": "unknown" } }, { "id": "CHIP-100", "name": "Horizon Robotics Journey J6M", "name_en": "Horizon Robotics Journey J6M", "category": "chips", "entity_kind": "component", "manufacturer": "Horizon Robotics (地平线)", "type": "AI SoC (BPU 3.5)", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "autonomous_vehicle", "robot_vision", "edge_ai" ], "price_range": "企业级", "ros_support": false, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=Horizon%20Robotics%20(%E5%9C%B0%E5%B9%B3%E7%BA%BF)%20Horizon%20Robotics%20Journey%20J6M%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": false, "interop_posture": "unknown" } }, { "id": "CHIP-101", "name": "Cambricon MLU220", "name_en": "Cambricon MLU220", "category": "chips", "entity_kind": "component", "manufacturer": "Cambricon (寒武纪)", "type": "Edge AI Accelerator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "edge_ai", "industrial_robot", "smart_manufacturing" ], "price_range": "1500-3000", "ros_support": false, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.58, "verified": false, "quarantine": false, "source_url": "https://www.cambricon.com/" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": false, "interop_posture": "unknown" } }, { "id": "CHIP-102", "name": "Huawei Ascend 310B", "name_en": "Huawei Ascend 310B", "category": "chips", "entity_kind": "component", "manufacturer": "Huawei (华为)", "type": "Edge AI SoC", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "edge_ai", "robot_vision", "smart Surveillance" ], "price_range": "1500-3000", "ros_support": false, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=Huawei%20(%E5%8D%8E%E4%B8%BA)%20Huawei%20Ascend%20310B%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": false, "interop_posture": "unknown" } }, { "id": "CHIP-103", "name": "Kinara Ara-2", "name_en": "Kinara Ara-2", "category": "chips", "entity_kind": "component", "manufacturer": "Kinara (acquired by NXP)", "type": "Edge AI Accelerator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "edge_ai", "robot_vision", "autonomous_vehicle" ], "price_range": "200-400", "ros_support": false, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=Kinara%20(acquired%20by%20NXP)%20Kinara%20Ara-2%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": false, "interop_posture": "unknown" } }, { "id": "SENS-001", "name": "LiDAR (Light Detection and Ranging)", "name_en": "LiDAR (Light Detection and Ranging)", "category": "sensors", "entity_kind": "component", "manufacturer": "Velodyne (Ouster), Luminar, Hesai, Livox, Innoviz", "type": "3D depth sensing", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=Velodyne%20(Ouster)%2C%20Luminar%2C%20Hesai%2C%20Livox%2C%20Innoviz%20LiDAR%20(Light%20Detection%20and%20Ranging)%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-002", "name": "Event Camera (Neuromorphic Vision)", "name_en": "Event Camera (Neuromorphic Vision)", "category": "sensors", "entity_kind": "component", "manufacturer": "Prophesee (Metavision), iniVation (DAVIS), CelePixel", "type": "Vision sensor", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=Prophesee%20(Metavision)%2C%20iniVation%20(DAVIS)%2C%20CelePixel%20Event%20Camera%20(Neuromorphic%20Vision)%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-003", "name": "Tactile Sensor (GelSight)", "name_en": "Tactile Sensor (GelSight)", "category": "sensors", "entity_kind": "component", "manufacturer": "GelSight (MIT spinoff), SynTouch, Pressure Profile Systems", "type": "Touch sensing", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=GelSight%20(MIT%20spinoff)%2C%20SynTouch%2C%20Pressure%20Profile%20Systems%20Tactile%20Sensor%20(GelSight)%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-004", "name": "IMU (Inertial Measurement Unit)", "name_en": "IMU (Inertial Measurement Unit)", "category": "sensors", "entity_kind": "component", "manufacturer": "Bosch, InvenSense (TDK), STMicroelectronics, Analog Devices", "type": "Motion sensing", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=Bosch%2C%20InvenSense%20(TDK)%2C%20STMicroelectronics%2C%20Analog%20Devices%20IMU%20(Inertial%20Measurement%20Unit)%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-005", "name": "Force/Torque Sensor", "name_en": "Force/Torque Sensor", "category": "sensors", "entity_kind": "component", "manufacturer": "ATI Industrial Automation, OnRobot, SCHUNK, ME-Meßsysteme", "type": "Force sensing", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=ATI%20Industrial%20Automation%2C%20OnRobot%2C%20SCHUNK%2C%20ME-Me%C3%9Fsysteme%20Force%2FTorque%20Sensor%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-006", "name": "XELA uSkin 3-Axis Tactile Sensor", "name_en": "XELA uSkin 3-Axis Tactile Sensor", "category": "sensors", "entity_kind": "component", "manufacturer": "XELA Robotics", "type": "Tactile sensing (3-axis)", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=XELA%20Robotics%20XELA%20uSkin%203-Axis%20Tactile%20Sensor%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-007", "name": "Robotiq TSF-85 Tactile Sensor Fingertips", "name_en": "Robotiq TSF-85 Tactile Sensor Fingertips", "category": "sensors", "entity_kind": "component", "manufacturer": "Robotiq", "type": "Tactile sensing (multimodal)", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-008", "name": "Tactile Foundation Model Sensor Suite", "name_en": "Tactile Foundation Model Sensor Suite", "category": "sensors", "entity_kind": "component", "manufacturer": "Multiple (Meta AI Research, XELA, academic labs)", "type": "AI-powered tactile perception system", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=Multiple%20(Meta%20AI%20Research%2C%20XELA%2C%20academic%20labs)%20Tactile%20Foundation%20Model%20Sensor%20Suite%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-009", "name": "Bioinspired Flexible Tactile Sensor", "name_en": "Bioinspired Flexible Tactile Sensor", "category": "sensors", "entity_kind": "component", "manufacturer": "Academic research (ACS Applied Materials & Interfaces 2025)", "type": "Flexible/soft tactile sensor", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=Academic%20research%20(ACS%20Applied%20Materials%20%26%20Interfaces%202025)%20Bioinspired%20Flexible%20Tactile%20Sensor%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-tesla-optimus-g3-suite", "name": "Tesla Optimus Gen 3 Sensor Suite", "name_en": "Tesla Optimus Gen 3 Sensor Suite", "category": "sensors", "entity_kind": "component", "manufacturer": "Tesla", "type": "Multi-modal robot sensor system", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": "https://tesla.com/tesla-optimus-gen-3-sensor-suite" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "closed" } }, { "id": "SENS-unitree-g1-lidar", "name": "Unitree G1 Perception System (3D LiDAR + Depth Camera)", "name_en": "Unitree G1 Perception System (3D LiDAR + Depth Camera)", "category": "sensors", "entity_kind": "component", "manufacturer": "Unitree Robotics (China)", "type": "Robot perception sensor suite", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": "https://www.unitree.com/" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "semi_open" } }, { "id": "SENS-unitree-h1-360depth", "name": "Unitree H1 360° Depth Perception System", "name_en": "Unitree H1 360° Depth Perception System", "category": "sensors", "entity_kind": "component", "manufacturer": "Unitree Robotics (China)", "type": "Multi-modal depth sensing system", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": "https://www.unitree.com/" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "semi_open" } }, { "id": "SENS-13", "name": "High-Res LiDAR Unit V2", "name_en": "High-Res LiDAR Unit V2", "category": "sensors", "entity_kind": "component", "manufacturer": null, "type": "LiDAR", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-14", "name": "9-Axis IMU Fusion Module", "name_en": "9-Axis IMU Fusion Module", "category": "sensors", "entity_kind": "component", "manufacturer": null, "type": "IMU", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-15", "name": "Pan-Tilt-Zoom Optical Camera", "name_en": "Pan-Tilt-Zoom Optical Camera", "category": "sensors", "entity_kind": "component", "manufacturer": null, "type": "Camera", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-16", "name": "Multi-Spectral Vision Array", "name_en": "Multi-Spectral Vision Array", "category": "sensors", "entity_kind": "component", "manufacturer": null, "type": "Camera", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-17", "name": "Electro-Active Tactile Skin", "name_en": "Electro-Active Tactile Skin", "category": "sensors", "entity_kind": "component", "manufacturer": null, "type": "Tactile", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-18", "name": "Gripper Contact Array", "name_en": "Gripper Contact Array", "category": "sensors", "entity_kind": "component", "manufacturer": null, "type": "Tactile", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-19", "name": "Wide-Angle Ultrasonic Array", "name_en": "Wide-Angle Ultrasonic Array", "category": "sensors", "entity_kind": "component", "manufacturer": null, "type": "Ultrasonic", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-20", "name": "6-Axis Force-Torque Sensor", "name_en": "6-Axis Force-Torque Sensor", "category": "sensors", "entity_kind": "component", "manufacturer": null, "type": "Force Torque", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-21", "name": "Solid-State LiDAR Scanner", "name_en": "Solid-State LiDAR Scanner", "category": "sensors", "entity_kind": "component", "manufacturer": null, "type": "LiDAR", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-22", "name": "Laser Vibrometer", "name_en": "Laser Vibrometer", "category": "sensors", "entity_kind": "component", "manufacturer": null, "type": "Ultrasonic", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-23", "name": "Event-Based Vision Sensor", "name_en": "Event-Based Vision Sensor", "category": "sensors", "entity_kind": "component", "manufacturer": null, "type": "Camera", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-24", "name": "3D Tactile Digit", "name_en": "3D Tactile Digit", "category": "sensors", "entity_kind": "component", "manufacturer": null, "type": "Tactile", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-25", "name": "3D Time-of-Flight Camera", "name_en": "3D Time-of-Flight Camera", "category": "sensors", "entity_kind": "component", "manufacturer": null, "type": "Camera", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-26", "name": "Microphone Array", "name_en": "Microphone Array", "category": "sensors", "entity_kind": "component", "manufacturer": null, "type": "Ultrasonic", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-27", "name": "Strain-Gauge Torque Sensor", "name_en": "Strain-Gauge Torque Sensor", "category": "sensors", "entity_kind": "component", "manufacturer": null, "type": "Force Torque", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-28", "name": "Velodyne VLP-32C LiDAR", "name_en": "Velodyne VLP-32C LiDAR", "category": "sensors", "entity_kind": "component", "manufacturer": null, "type": "LiDAR", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-29", "name": "Xsens MTi-300 IMU", "name_en": "Xsens MTi-300 IMU", "category": "sensors", "entity_kind": "component", "manufacturer": null, "type": "IMU", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-30", "name": "Intel RealSense D435i Camera", "name_en": "Intel RealSense D435i Camera", "category": "sensors", "entity_kind": "component", "manufacturer": null, "type": "Camera", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-31", "name": "Robotiq FT 300 Force-Torque Sensor", "name_en": "Robotiq FT 300 Force-Torque Sensor", "category": "sensors", "entity_kind": "component", "manufacturer": null, "type": "Force-Torque", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [ "geometric" ], "modality_details": { "exposed": [ "geometric" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [ [ "ISO 9409-1-50-4-M6", "ISO 9409-1-31.5-4-M5", "ISO 9409-1-40-4-M6" ] ] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.92, "verified": true, "quarantine": false, "source_url": "https://assets.robotiq.com/website-assets/support_documents/document/FT300-S_Sensor_Manual_OMRON_TM_PDF_20210301.pdf" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-32", "name": "MaxBotix MB7066 Ultrasonic Sensor", "name_en": "MaxBotix MB7066 Ultrasonic Sensor", "category": "sensors", "entity_kind": "component", "manufacturer": null, "type": "Ultrasonic", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-33", "name": "SynTouch BioTac Tactile Sensor", "name_en": "SynTouch BioTac Tactile Sensor", "category": "sensors", "entity_kind": "component", "manufacturer": null, "type": "Tactile", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-34", "name": "Ouster OS1-64 LiDAR", "name_en": "Ouster OS1-64 LiDAR", "category": "sensors", "entity_kind": "component", "manufacturer": null, "type": "LiDAR", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-35", "name": "Bosch BNO055 IMU", "name_en": "Bosch BNO055 IMU", "category": "sensors", "entity_kind": "component", "manufacturer": null, "type": "IMU", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-36", "name": "FLIR Blackfly S Camera", "name_en": "FLIR Blackfly S Camera", "category": "sensors", "entity_kind": "component", "manufacturer": null, "type": "Camera", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-37", "name": "ATI Mini45 Force-Torque Sensor", "name_en": "ATI Mini45 Force-Torque Sensor", "category": "sensors", "entity_kind": "component", "manufacturer": null, "type": "Force-Torque", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-38", "name": "HC-SR04 Ultrasonic Sensor", "name_en": "HC-SR04 Ultrasonic Sensor", "category": "sensors", "entity_kind": "component", "manufacturer": null, "type": "Ultrasonic", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-39", "name": "Optoforce Tactile Sensor Array", "name_en": "Optoforce Tactile Sensor Array", "category": "sensors", "entity_kind": "component", "manufacturer": null, "type": "Tactile", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-40", "name": "Livox Horizon LiDAR", "name_en": "Livox Horizon LiDAR", "category": "sensors", "entity_kind": "component", "manufacturer": null, "type": "LiDAR", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-41", "name": "Sony IMX477 Camera Module", "name_en": "Sony IMX477 Camera Module", "category": "sensors", "entity_kind": "component", "manufacturer": null, "type": "Camera", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-42", "name": "ATI Nano17 Force-Torque Sensor", "name_en": "ATI Nano17 Force-Torque Sensor", "category": "sensors", "entity_kind": "component", "manufacturer": null, "type": "Force-Torque", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "sensor-ft-001", "name": "ATI Nano43 六维力/力矩传感器", "name_en": "ATI Nano43 6-Axis Force/Torque Sensor", "category": "sensors", "entity_kind": "component", "manufacturer": null, "type": "力/力矩传感器", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": "$3000-5000", "ros_support": null, "modalities": [ "force", "tactile" ], "modality_details": { "exposed": [ "force", "tactile" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "bionic_features" ] }, "tactile": { "declared": true, "basis": [ "bionic_features" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": "https://www.ati-ia.com/" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "sensor-ft-002", "name": "坤维 KWR46B 六维力传感器", "name_en": "Kunwei KWR46B 6-Axis Force Sensor", "category": "sensors", "entity_kind": "component", "manufacturer": null, "type": "力/力矩传感器", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": "$2000-4000", "ros_support": null, "modalities": [ "force", "tactile" ], "modality_details": { "exposed": [ "force", "tactile" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "bionic_features" ] }, "tactile": { "declared": true, "basis": [ "bionic_features" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "C", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "sensor-tactile-001", "name": "SynTouch BioTac 仿生触觉传感器", "name_en": "SynTouch BioTac Bio-inspired Tactile Sensor", "category": "sensors", "entity_kind": "component", "manufacturer": null, "type": "仿生触觉", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": "$5000-8000", "ros_support": null, "modalities": [ "force", "tactile" ], "modality_details": { "exposed": [ "force", "tactile" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "bionic_features" ] }, "tactile": { "declared": true, "basis": [ "bionic_features" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": "https://www.syntouchllc.com/" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "sensor-imu-001", "name": "Xsens MTi-30 惯性测量单元", "name_en": "Xsens MTi-30 Inertial Measurement Unit", "category": "sensors", "entity_kind": "component", "manufacturer": null, "type": "惯性测量单元", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": "$1000-2000", "ros_support": null, "modalities": [ "force", "tactile" ], "modality_details": { "exposed": [ "force", "tactile" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "bionic_features" ] }, "tactile": { "declared": true, "basis": [ "bionic_features" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": "https://www.movella.com/" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-047", "name": "ATI Mini40 六轴力/力矩传感器", "name_en": "ATI Mini40 Force-Torque Sensor", "category": "sensors", "entity_kind": "component", "manufacturer": "ATI Industrial Automation (Novanta)", "type": "Force-Torque", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=ATI%20Industrial%20Automation%20(Novanta)%20ATI%20Mini40%20%E5%85%AD%E8%BD%B4%E5%8A%9B%2F%E5%8A%9B%E7%9F%A9%E4%BC%A0%E6%84%9F%E5%99%A8%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-048", "name": "ATI Mini45 六轴力/力矩传感器", "name_en": "ATI Mini45 Force-Torque Sensor", "category": "sensors", "entity_kind": "component", "manufacturer": "ATI Industrial Automation (Novanta)", "type": "Force-Torque", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=ATI%20Industrial%20Automation%20(Novanta)%20ATI%20Mini45%20%E5%85%AD%E8%BD%B4%E5%8A%9B%2F%E5%8A%9B%E7%9F%A9%E4%BC%A0%E6%84%9F%E5%99%A8%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-049", "name": "OnRobot HEX-E 六轴力/力矩传感器", "name_en": "OnRobot HEX-E Force-Torque Sensor", "category": "sensors", "entity_kind": "component", "manufacturer": "OnRobot", "type": "Force-Torque", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=OnRobot%20OnRobot%20HEX-E%20%E5%85%AD%E8%BD%B4%E5%8A%9B%2F%E5%8A%9B%E7%9F%A9%E4%BC%A0%E6%84%9F%E5%99%A8%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-050", "name": "Bota Systems MiniONE 六轴力传感器", "name_en": "Bota Systems MiniONE Force-Torque Sensor", "category": "sensors", "entity_kind": "component", "manufacturer": "Bota Systems", "type": "Force-Torque", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=Bota%20Systems%20Bota%20Systems%20MiniONE%20%E5%85%AD%E8%BD%B4%E5%8A%9B%E4%BC%A0%E6%84%9F%E5%99%A8%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-051", "name": "蓝点触控六维力传感器", "name_en": "LinkTouch 6-Axis Force/Torque Sensor", "category": "sensors", "entity_kind": "component", "manufacturer": "蓝点触控 (LinkTouch)", "type": "Force-Torque", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E8%93%9D%E7%82%B9%E8%A7%A6%E6%8E%A7%20(LinkTouch)%20%E8%93%9D%E7%82%B9%E8%A7%A6%E6%8E%A7%E5%85%AD%E7%BB%B4%E5%8A%9B%E4%BC%A0%E6%84%9F%E5%99%A8%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-052", "name": "宇立仪器 M4313SXX 多轴力传感器", "name_en": "Sunrise SRI M4313SXX Multi-Axis Force Sensor", "category": "sensors", "entity_kind": "component", "manufacturer": "宇立仪器 (Sunrise SRI)", "type": "Force-Torque", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=%E5%AE%87%E7%AB%8B%E4%BB%AA%E5%99%A8%20(Sunrise%20SRI)%20%E5%AE%87%E7%AB%8B%E4%BB%AA%E5%99%A8%20M4313SXX%20%E5%A4%9A%E8%BD%B4%E5%8A%9B%E4%BC%A0%E6%84%9F%E5%99%A8%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-053", "name": "GelSight Mini 视触觉传感器", "name_en": "GelSight Mini Vision-Based Tactile Sensor", "category": "sensors", "entity_kind": "component", "manufacturer": "GelSight Inc. (MIT)", "type": "Tactile", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=GelSight%20Inc.%20(MIT)%20GelSight%20Mini%20%E8%A7%86%E8%A7%A6%E8%A7%89%E4%BC%A0%E6%84%9F%E5%99%A8%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-054", "name": "Meta DIGIT 视触觉传感器", "name_en": "Meta DIGIT Vision-Based Tactile Sensor", "category": "sensors", "entity_kind": "component", "manufacturer": "Meta AI Research", "type": "Tactile", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=Meta%20AI%20Research%20Meta%20DIGIT%20%E8%A7%86%E8%A7%A6%E8%A7%89%E4%BC%A0%E6%84%9F%E5%99%A8%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-055", "name": "TacTip 仿生光学触觉传感器", "name_en": "TacTip Bio-inspired Optical Tactile Sensor", "category": "sensors", "entity_kind": "component", "manufacturer": "Bristol Robotics Laboratory", "type": "Tactile", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=Bristol%20Robotics%20Laboratory%20TacTip%20%E4%BB%BF%E7%94%9F%E5%85%89%E5%AD%A6%E8%A7%A6%E8%A7%89%E4%BC%A0%E6%84%9F%E5%99%A8%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-056", "name": "SynTouch BioTac 仿生触觉传感器", "name_en": "SynTouch BioTac Biomimetic Tactile Sensor", "category": "sensors", "entity_kind": "component", "manufacturer": "SynTouch LLC", "type": "Tactile", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=SynTouch%20LLC%20SynTouch%20BioTac%20%E4%BB%BF%E7%94%9F%E8%A7%A6%E8%A7%89%E4%BC%A0%E6%84%9F%E5%99%A8%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-057", "name": "戴盟机器人 DM-Tac W2 视触觉传感器", "name_en": "Daimon Robotics DM-Tac W2 Tactile Sensor", "category": "sensors", "entity_kind": "component", "manufacturer": "戴盟机器人 (Daimon Robotics)", "type": "Tactile", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=%E6%88%B4%E7%9B%9F%E6%9C%BA%E5%99%A8%E4%BA%BA%20(Daimon%20Robotics)%20%E6%88%B4%E7%9B%9F%E6%9C%BA%E5%99%A8%E4%BA%BA%20DM-Tac%20W2%20%E8%A7%86%E8%A7%A6%E8%A7%89%E4%BC%A0%E6%84%9F%E5%99%A8%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-058", "name": "帕西尼 PX-6AX 多维触觉传感器", "name_en": "PaXini PX-6AX Multi-Dimensional Tactile Sensor", "category": "sensors", "entity_kind": "component", "manufacturer": "帕西尼感知科技 (PaXini)", "type": "Tactile", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E5%B8%95%E8%A5%BF%E5%B0%BC%E6%84%9F%E7%9F%A5%E7%A7%91%E6%8A%80%20(PaXini)%20%E5%B8%95%E8%A5%BF%E5%B0%BC%20PX-6AX%20%E5%A4%9A%E7%BB%B4%E8%A7%A6%E8%A7%89%E4%BC%A0%E6%84%9F%E5%99%A8%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-059", "name": "Tekscan I-Scan 压力分布传感器", "name_en": "Tekscan I-Scan Pressure Mapping System", "category": "sensors", "entity_kind": "component", "manufacturer": "Tekscan", "type": "Pressure Distribution", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=Tekscan%20Tekscan%20I-Scan%20%E5%8E%8B%E5%8A%9B%E5%88%86%E5%B8%83%E4%BC%A0%E6%84%9F%E5%99%A8%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-060", "name": "PPS TactArray 触觉压力分布传感器", "name_en": "PPS TactArray Pressure Distribution Sensor", "category": "sensors", "entity_kind": "component", "manufacturer": "Pressure Profile Systems (PPS)", "type": "Pressure Distribution", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=Pressure%20Profile%20Systems%20(PPS)%20PPS%20TactArray%20%E8%A7%A6%E8%A7%89%E5%8E%8B%E5%8A%9B%E5%88%86%E5%B8%83%E4%BC%A0%E6%84%9F%E5%99%A8%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-061", "name": "汉威/能斯达 ZNS-01 柔性电子皮肤", "name_en": "Hanwei/Nexsense ZNS-01 Flexible Electronic Skin", "category": "sensors", "entity_kind": "component", "manufacturer": "汉威科技/能斯达电子", "type": "Electronic Skin", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=%E6%B1%89%E5%A8%81%E7%A7%91%E6%8A%80%2F%E8%83%BD%E6%96%AF%E8%BE%BE%E7%94%B5%E5%AD%90%20%E6%B1%89%E5%A8%81%2F%E8%83%BD%E6%96%AF%E8%BE%BE%20ZNS-01%20%E6%9F%94%E6%80%A7%E7%94%B5%E5%AD%90%E7%9A%AE%E8%82%A4%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-062", "name": "他山科技 SNN触觉芯片", "name_en": "Tashan Tech SNN Tactile Chip", "category": "sensors", "entity_kind": "component", "manufacturer": "他山科技 (清华系)", "type": "Electronic Skin", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E4%BB%96%E5%B1%B1%E7%A7%91%E6%8A%80%20(%E6%B8%85%E5%8D%8E%E7%B3%BB)%20%E4%BB%96%E5%B1%B1%E7%A7%91%E6%8A%80%20SNN%E8%A7%A6%E8%A7%89%E8%8A%AF%E7%89%87%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "RPLAT-001", "name": "Boston Dynamics Atlas", "name_en": "Boston Dynamics Atlas", "category": "platforms", "entity_kind": "component", "manufacturer": "Boston Dynamics (Hyundai)", "type": "Humanoid robot platform", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.88, "verified": true, "quarantine": false, "source_url": "https://bostondynamics.com/atlas/" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "RPLAT-002", "name": "Tesla Optimus (Bot)", "name_en": "Tesla Optimus (Bot)", "category": "platforms", "entity_kind": "component", "manufacturer": "Tesla", "type": "Humanoid robot platform", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "closed" } }, { "id": "RPLAT-003", "name": "Figure 02", "name_en": "Figure 02", "category": "platforms", "entity_kind": "component", "manufacturer": "Figure AI", "type": "Humanoid robot platform", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "closed" } }, { "id": "RPLAT-004", "name": "Unitree G1/H1", "name_en": "Unitree G1/H1", "category": "platforms", "entity_kind": "component", "manufacturer": "Unitree Robotics", "type": "Humanoid robot platform", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.88, "verified": true, "quarantine": false, "source_url": "https://www.unitree.com/g1" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "semi_open" } }, { "id": "RPLAT-005", "name": "ANYmal (ANYbotics)", "name_en": "ANYmal (ANYbotics)", "category": "platforms", "entity_kind": "component", "manufacturer": "ANYbotics (ETH Zurich spinoff)", "type": "Quadruped robot platform", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.88, "verified": true, "quarantine": false, "source_url": "https://www.anybotics.com/robotics/anymal/" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "RPLAT-006", "name": "DJI Matrice 350 RTK", "name_en": "DJI Matrice 350 RTK", "category": "platforms", "entity_kind": "component", "manufacturer": "DJI", "type": "Aerial robot platform", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.88, "verified": true, "quarantine": false, "source_url": "https://enterprise.dji.com/matrice-350-rtk" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "RPLAT-007", "name": "Figure 03", "name_en": "Figure 03", "category": "platforms", "entity_kind": "component", "manufacturer": "Figure AI", "type": "General-purpose humanoid robot", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": "N/A (commercial)", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "closed" } }, { "id": "RPLAT-008", "name": "Embodied Tien Kung 3.0", "name_en": "Embodied Tien Kung 3.0", "category": "platforms", "entity_kind": "component", "manufacturer": "X-Humanoid", "type": "Full-size general-purpose humanoid robot", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": "N/A", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=X-Humanoid%20Embodied%20Tien%20Kung%203.0%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "RPLAT-009", "name": "Tesla Optimus Gen 3", "name_en": "Tesla Optimus Gen 3", "category": "platforms", "entity_kind": "component", "manufacturer": "Tesla", "type": "General-purpose humanoid robot", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": "N/A (targeting affordable)", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": true, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "closed" } }, { "id": "RPLAT-010", "name": "Tesla Optimus Gen 3", "name_en": "Tesla Optimus Gen 3", "category": "platforms", "entity_kind": "component", "manufacturer": "Tesla", "type": "General-purpose humanoid robot", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": "Targeting affordable (mass production)", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "closed" } }, { "id": "RPLAT-011", "name": "EngineAI T800 Humanoid Robot", "name_en": "EngineAI T800 Humanoid Robot", "category": "platforms", "entity_kind": "component", "manufacturer": "EngineAI (China)", "type": "Full-size general-purpose humanoid robot", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": "N/A", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "RPLAT-012", "name": "Unitree G1 Humanoid Robot", "name_en": "Unitree G1 Humanoid Robot", "category": "platforms", "entity_kind": "component", "manufacturer": "Unitree Robotics (China)", "type": "Compact humanoid robot (AI avatar)", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": "From $13,500", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.6, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "semi_open" } }, { "id": "RPLAT-013", "name": "Unitree H1 Humanoid Robot", "name_en": "Unitree H1 Humanoid Robot", "category": "platforms", "entity_kind": "component", "manufacturer": "Unitree Robotics (China)", "type": "Full-size humanoid robot", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": "N/A", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.6, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "semi_open" } }, { "id": "RPLAT-014", "name": "NVIDIA Isaac GR00T Reference Humanoid Robot", "name_en": "NVIDIA Isaac GR00T Reference Humanoid Robot", "category": "platforms", "entity_kind": "component", "manufacturer": "NVIDIA (with Unitree)", "type": "Open humanoid robot reference design", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": "N/A (reference design)", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.88, "verified": true, "quarantine": false, "source_url": "https://developer.nvidia.com/isaac/gr00t" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "semi_open" } }, { "id": "FA-001", "name": "DEKA Luke Arm", "name_en": "DEKA Luke Arm", "category": "flexible_actuators", "entity_kind": "component", "manufacturer": "DEKA", "type": "Multi-DOF Hand", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [ "tactile" ], "modality_details": { "exposed": [ "tactile" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": true, "basis": [ "category:flexible_actuators" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=DEKA%20DEKA%20Luke%20Arm%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "FA-002", "name": " Festo DHEF", "name_en": " Festo DHEF", "category": "flexible_actuators", "entity_kind": "component", "manufacturer": "Festo", "type": "Flexible Actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [ "tactile" ], "modality_details": { "exposed": [ "tactile" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": true, "basis": [ "category:flexible_actuators" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=Festo%20%20Festo%20DHEF%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "FA-003", "name": "QMC Soft Gripper", "name_en": "QMC Soft Gripper", "category": "flexible_actuators", "entity_kind": "component", "manufacturer": "QMC", "type": "Soft Gripper", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [ "tactile" ], "modality_details": { "exposed": [ "tactile" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": true, "basis": [ "category:flexible_actuators" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=QMC%20QMC%20Soft%20Gripper%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "FA-004", "name": "PESCO Soft Actuator", "name_en": "PESCO Soft Actuator", "category": "flexible_actuators", "entity_kind": "component", "manufacturer": "Shadow Robot", "type": "Pneumatic Muscle", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [ "tactile" ], "modality_details": { "exposed": [ "tactile" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": true, "basis": [ "category:flexible_actuators" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "FA-005", "name": "Shape Memory Alloy Actuator", "name_en": "Shape Memory Alloy Actuator", "category": "flexible_actuators", "entity_kind": "component", "manufacturer": "Various", "type": "SMA Actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [ "tactile" ], "modality_details": { "exposed": [ "tactile" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": true, "basis": [ "category:flexible_actuators" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=Various%20Shape%20Memory%20Alloy%20Actuator%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "FA-006", "name": "HASEL Actuator", "name_en": "HASEL Actuator", "category": "flexible_actuators", "entity_kind": "component", "manufacturer": "CU Boulder", "type": "Electrohydraulic", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [ "tactile" ], "modality_details": { "exposed": [ "tactile" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": true, "basis": [ "category:flexible_actuators" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=CU%20Boulder%20HASEL%20Actuator%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "DATA-001", "name": "ALOHA (LeRobot)", "name_en": "ALOHA (LeRobot)", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "Stanford University", "type": "teleoperation", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "data_collection", "imitation_learning", "vla_training" ], "price_range": "3000-4000", "ros_support": null, "modalities": [ "vision" ], "modality_details": { "exposed": [ "vision" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": true, "note": "该零件/系统自带视觉/位姿观测模态（来自 data_modalities）" } }, "evidence": { "source_tier": "A", "confidence": 0.88, "verified": true, "quarantine": false, "source_url": "https://tonyzhaozh.github.io/aloha/" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "DATA-002", "name": "UMI (Universal Manipulation Interface)", "name_en": "UMI (Universal Manipulation Interface)", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "Stanford University", "type": "teleoperation", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "data_collection", "imitation_learning" ], "price_range": "800", "ros_support": null, "modalities": [ "vision" ], "modality_details": { "exposed": [ "vision" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": true, "note": "该零件/系统自带视觉/位姿观测模态（来自 data_modalities）" } }, "evidence": { "source_tier": "A", "confidence": 0.88, "verified": true, "quarantine": false, "source_url": "https://umi-gripper.github.io/" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "DATA-003", "name": "GELLO", "name_en": "GELLO", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "UC Berkeley", "type": "teleoperation", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "data_collection", "teleoperation" ], "price_range": "300", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.88, "verified": true, "quarantine": false, "source_url": "https://wuphilipp.github.io/gello_site/" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "DATA-004", "name": "DexCap", "name_en": "DexCap", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "Stanford University", "type": "motion_capture", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "data_collection", "dexterous_manipulation" ], "price_range": "3606", "ros_support": null, "modalities": [ "vision" ], "modality_details": { "exposed": [ "vision" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": true, "note": "该零件/系统自带视觉/位姿观测模态（来自 data_modalities）" } }, "evidence": { "source_tier": "A", "confidence": 0.88, "verified": true, "quarantine": false, "source_url": "https://dex-cap.github.io/" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "DATA-005", "name": "DexTele", "name_en": "DexTele", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "DexRobot", "type": "teleoperation", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "data_collection", "dexterous_manipulation", "humanoid_research" ], "price_range": "企业级", "ros_support": null, "modalities": [ "tactile", "vision" ], "modality_details": { "exposed": [ "tactile", "vision" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": true, "basis": [ "data_modalities:tactile" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": true, "note": "该零件/系统自带视觉/位姿观测模态（来自 data_modalities）" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=DexRobot%20DexTele%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "DATA-006", "name": "OptiTrack", "name_en": "OptiTrack", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "NaturalPoint (OptiTrack)", "type": "motion_capture", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "robot_localization", "navigation", "research" ], "price_range": "100000-500000", "ros_support": null, "modalities": [ "vision" ], "modality_details": { "exposed": [ "vision" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": true, "note": "该零件/系统自带视觉/位姿观测模态（来自 data_modalities）" } }, "evidence": { "source_tier": "A", "confidence": 0.88, "verified": true, "quarantine": false, "source_url": "https://optitrack.com/" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "DATA-007", "name": "Vicon", "name_en": "Vicon", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "Vicon Motion Systems", "type": "motion_capture", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "research", "film", "sports_science" ], "price_range": "500000-1000000", "ros_support": null, "modalities": [ "vision" ], "modality_details": { "exposed": [ "vision" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": true, "note": "该零件/系统自带视觉/位姿观测模态（来自 data_modalities）" } }, "evidence": { "source_tier": "A", "confidence": 0.88, "verified": true, "quarantine": false, "source_url": "https://www.vicon.com/" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "DATA-008", "name": "NOKOV", "name_en": "NOKOV", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "NOKOV (北京度量科技)", "type": "motion_capture", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "robot_localization", "aerospace", "defense" ], "price_range": "300000-800000", "ros_support": null, "modalities": [ "vision" ], "modality_details": { "exposed": [ "vision" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": true, "note": "该零件/系统自带视觉/位姿观测模态（来自 data_modalities）" } }, "evidence": { "source_tier": "A", "confidence": 0.88, "verified": true, "quarantine": false, "source_url": "https://www.nokov.com/" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "DATA-009", "name": "GelSight Mini", "name_en": "GelSight Mini", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "GelSight Inc. (MIT)", "type": "tactile_sensor", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "dexterous_manipulation", "vla_training", "quality_inspection" ], "price_range": "350-560", "ros_support": null, "modalities": [ "tactile" ], "modality_details": { "exposed": [ "tactile" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": true, "basis": [ "data_modalities:tactile" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "DATA-010", "name": "Meta DIGIT", "name_en": "Meta DIGIT", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "Meta AI Research", "type": "tactile_sensor", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "dexterous_manipulation", "research" ], "price_range": "150-300", "ros_support": null, "modalities": [ "tactile" ], "modality_details": { "exposed": [ "tactile" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": true, "basis": [ "data_modalities:tactile" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "DATA-011", "name": "DM-Tac W系列", "name_en": "DM-Tac W Series", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "Daimon Robotics (戴盟机器人)", "type": "tactile_sensor", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "dexterous_manipulation", "industrial_inspection" ], "price_range": "1299+", "ros_support": null, "modalities": [ "tactile" ], "modality_details": { "exposed": [ "tactile" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": true, "basis": [ "data_modalities:tactile" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=Daimon%20Robotics%20(%E6%88%B4%E7%9B%9F%E6%9C%BA%E5%99%A8%E4%BA%BA)%20DM-Tac%20W%E7%B3%BB%E5%88%97%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "DATA-012", "name": "TachinGlove", "name_en": "TachinGlove", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "TachinTech (途见科技)", "type": "tactile_glove", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "data_collection", "vla_training" ], "price_range": "未公开", "ros_support": null, "modalities": [ "tactile", "vision" ], "modality_details": { "exposed": [ "tactile", "vision" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": true, "basis": [ "data_modalities:tactile" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": true, "note": "该零件/系统自带视觉/位姿观测模态（来自 data_modalities）" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=TachinTech%20(%E9%80%94%E8%A7%81%E7%A7%91%E6%8A%80)%20TachinGlove%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "DATA-013", "name": "TacUMI", "name_en": "TacUMI", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "TUM + Agile Robots + NJU + SHU", "type": "multimodal", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "data_collection", "contact_rich_manipulation" ], "price_range": "1000-2000", "ros_support": null, "modalities": [ "force", "tactile", "vision" ], "modality_details": { "exposed": [ "force", "tactile", "vision" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "data_modalities" ] }, "tactile": { "declared": true, "basis": [ "data_modalities:tactile/force_torque" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": true, "note": "该零件/系统自带视觉/位姿观测模态（来自 data_modalities）" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=TUM%20%2B%20Agile%20Robots%20%2B%20NJU%20%2B%20SHU%20TacUMI%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "DATA-014", "name": "PolyUMI", "name_en": "PolyUMI", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "Academic Research (ICRA 2026)", "type": "multimodal", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "data_collection", "contact_rich_manipulation" ], "price_range": "研究级", "ros_support": null, "modalities": [ "tactile", "vision" ], "modality_details": { "exposed": [ "tactile", "vision" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": true, "basis": [ "data_modalities:tactile" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": true, "note": "该零件/系统自带视觉/位姿观测模态（来自 data_modalities）" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=Academic%20Research%20(ICRA%202026)%20PolyUMI%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "DATA-015", "name": "GelFinger GF225", "name_en": "GelFinger GF225", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "纬钛机器人 (MIT Adelson lab)", "type": "tactile_sensor", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "precision_assembly", "flexible_grasping" ], "price_range": "未公开", "ros_support": null, "modalities": [ "tactile" ], "modality_details": { "exposed": [ "tactile" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": true, "basis": [ "data_modalities:tactile" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E7%BA%AC%E9%92%9B%E6%9C%BA%E5%99%A8%E4%BA%BA%20(MIT%20Adelson%20lab)%20GelFinger%20GF225%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-hd-leaderdrive-lcs", "name": "绿的谐波 LCS 系列谐波减速器", "name_en": "LeaderDrive LCS Series Harmonic Reducer", "category": "actuators", "entity_kind": "component", "manufacturer": "苏州绿的谐波传动科技 (LeaderDrive, 688017.SH)", "type": "harmonic_reducer", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "manipulator", "cobot" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E8%8B%8F%E5%B7%9E%E7%BB%BF%E7%9A%84%E8%B0%90%E6%B3%A2%E4%BC%A0%E5%8A%A8%E7%A7%91%E6%8A%80%20(LeaderDrive%2C%20688017.SH)%20%E7%BB%BF%E7%9A%84%E8%B0%90%E6%B3%A2%20LCS%20%E7%B3%BB%E5%88%97%E8%B0%90%E6%B3%A2%E5%87%8F%E9%80%9F%E5%99%A8%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-hd-leaderdrive-lcd", "name": "绿的谐波 LCD 超薄型谐波减速器", "name_en": "LeaderDrive LCD Ultra-thin Harmonic Reducer", "category": "actuators", "entity_kind": "component", "manufacturer": "苏州绿的谐波传动科技 (LeaderDrive, 688017.SH)", "type": "harmonic_reducer", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "cobot" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E8%8B%8F%E5%B7%9E%E7%BB%BF%E7%9A%84%E8%B0%90%E6%B3%A2%E4%BC%A0%E5%8A%A8%E7%A7%91%E6%8A%80%20(LeaderDrive%2C%20688017.SH)%20%E7%BB%BF%E7%9A%84%E8%B0%90%E6%B3%A2%20LCD%20%E8%B6%85%E8%96%84%E5%9E%8B%E8%B0%90%E6%B3%A2%E5%87%8F%E9%80%9F%E5%99%A8%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-hd-leaderdrive-csg", "name": "绿的谐波 CSG 高扭矩型谐波减速器", "name_en": "LeaderDrive CSG High-Torque Harmonic Reducer", "category": "actuators", "entity_kind": "component", "manufacturer": "苏州绿的谐波传动科技 (LeaderDrive, 688017.SH)", "type": "harmonic_reducer", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "quadruped" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E8%8B%8F%E5%B7%9E%E7%BB%BF%E7%9A%84%E8%B0%90%E6%B3%A2%E4%BC%A0%E5%8A%A8%E7%A7%91%E6%8A%80%20(LeaderDrive%2C%20688017.SH)%20%E7%BB%BF%E7%9A%84%E8%B0%90%E6%B3%A2%20CSG%20%E9%AB%98%E6%89%AD%E7%9F%A9%E5%9E%8B%E8%B0%90%E6%B3%A2%E5%87%8F%E9%80%9F%E5%99%A8%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-hd-leaderdrive-micro", "name": "绿的谐波微型谐波减速器", "name_en": "LeaderDrive Micro Harmonic Reducer", "category": "actuators", "entity_kind": "component", "manufacturer": "苏州绿的谐波传动科技 (LeaderDrive, 688017.SH)", "type": "harmonic_reducer", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "dexterous_hand", "humanoid" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-hd-harmonicdrive-csg2uh", "name": "Harmonic Drive CSG-2UH 系列谐波减速器", "name_en": "Harmonic Drive Systems CSG-2UH Series", "category": "actuators", "entity_kind": "component", "manufacturer": "Harmonic Drive Systems Inc. (哈默纳科, 日本)", "type": "harmonic_reducer", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "manipulator", "cobot", "aerospace" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=Harmonic%20Drive%20Systems%20Inc.%20(%E5%93%88%E9%BB%98%E7%BA%B3%E7%A7%91%2C%20%E6%97%A5%E6%9C%AC)%20Harmonic%20Drive%20CSG-2UH%20%E7%B3%BB%E5%88%97%E8%B0%90%E6%B3%A2%E5%87%8F%E9%80%9F%E5%99%A8%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-hd-laifual-series", "name": "来福谐波减速器系列", "name_en": "Laifual Harmonic Reducer Series", "category": "actuators", "entity_kind": "component", "manufacturer": "浙江来福谐波传动 (Laifual)", "type": "harmonic_reducer", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "manipulator", "cobot", "humanoid" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E6%B5%99%E6%B1%9F%E6%9D%A5%E7%A6%8F%E8%B0%90%E6%B3%A2%E4%BC%A0%E5%8A%A8%20(Laifual)%20%E6%9D%A5%E7%A6%8F%E8%B0%90%E6%B3%A2%E5%87%8F%E9%80%9F%E5%99%A8%E7%B3%BB%E5%88%97%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-hd-tongchuan-series", "name": "同川科技谐波减速器系列", "name_en": "Tongchuan Harmonic Reducer Series", "category": "actuators", "entity_kind": "component", "manufacturer": "同川科技 (Tongchuan)", "type": "harmonic_reducer", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "manipulator", "cobot" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E5%90%8C%E5%B7%9D%E7%A7%91%E6%8A%80%20(Tongchuan)%20%E5%90%8C%E5%B7%9D%E7%A7%91%E6%8A%80%E8%B0%90%E6%B3%A2%E5%87%8F%E9%80%9F%E5%99%A8%E7%B3%BB%E5%88%97%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-hd-shanchuan-hans", "name": "杉川谐波减速器（大族激光子公司）", "name_en": "Shanchuan Harmonic Reducer (Han's Laser subsidiary)", "category": "actuators", "entity_kind": "component", "manufacturer": "杉川谐波 / 大族激光 (002008.SZ)", "type": "harmonic_reducer", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "cobot", "humanoid" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E6%9D%89%E5%B7%9D%E8%B0%90%E6%B3%A2%20%2F%20%E5%A4%A7%E6%97%8F%E6%BF%80%E5%85%89%20(002008.SZ)%20%E6%9D%89%E5%B7%9D%E8%B0%90%E6%B3%A2%E5%87%8F%E9%80%9F%E5%99%A8%EF%BC%88%E5%A4%A7%E6%97%8F%E6%BF%80%E5%85%89%E5%AD%90%E5%85%AC%E5%8F%B8%EF%BC%89%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-prs-wuzhou-reverse", "name": "五洲新春 反向式行星滚柱丝杠", "name_en": "Wuzhou Xinchun Inverted Planetary Roller Screw", "category": "actuators", "entity_kind": "component", "manufacturer": "五洲新春集团 (603667.SH)", "type": "planetary_roller_screw", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "linear_joint", "legged" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E4%BA%94%E6%B4%B2%E6%96%B0%E6%98%A5%E9%9B%86%E5%9B%A2%20(603667.SH)%20%E4%BA%94%E6%B4%B2%E6%96%B0%E6%98%A5%20%E5%8F%8D%E5%90%91%E5%BC%8F%E8%A1%8C%E6%98%9F%E6%BB%9A%E6%9F%B1%E4%B8%9D%E6%9D%A0%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-prs-henglihydraulic", "name": "恒立液压 行星滚柱丝杠 / 线性驱动器", "name_en": "Hengli Hydraulic Planetary Roller Screw & Linear Actuator", "category": "actuators", "entity_kind": "component", "manufacturer": "江苏恒立液压 (601100.SH)", "type": "planetary_roller_screw", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "linear_joint", "machine_tool" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E6%B1%9F%E8%8B%8F%E6%81%92%E7%AB%8B%E6%B6%B2%E5%8E%8B%20(601100.SH)%20%E6%81%92%E7%AB%8B%E6%B6%B2%E5%8E%8B%20%E8%A1%8C%E6%98%9F%E6%BB%9A%E6%9F%B1%E4%B8%9D%E6%9D%A0%20%2F%20%E7%BA%BF%E6%80%A7%E9%A9%B1%E5%8A%A8%E5%99%A8%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-prs-best-yuhua-c0", "name": "贝斯特 宇华精机 C0 级行星滚柱丝杠", "name_en": "BEST / Yuhua Precision C0-Grade Planetary Roller Screw", "category": "actuators", "entity_kind": "component", "manufacturer": "无锡贝斯特精机 (300580.SZ) 子公司宇华精机", "type": "planetary_roller_screw", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "linear_joint", "machine_tool" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E6%97%A0%E9%94%A1%E8%B4%9D%E6%96%AF%E7%89%B9%E7%B2%BE%E6%9C%BA%20(300580.SZ)%20%E5%AD%90%E5%85%AC%E5%8F%B8%E5%AE%87%E5%8D%8E%E7%B2%BE%E6%9C%BA%20%E8%B4%9D%E6%96%AF%E7%89%B9%20%E5%AE%87%E5%8D%8E%E7%B2%BE%E6%9C%BA%20C0%20%E7%BA%A7%E8%A1%8C%E6%98%9F%E6%BB%9A%E6%9F%B1%E4%B8%9D%E6%9D%A0%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-prs-qinchuan-machine", "name": "秦川机床 行星滚柱丝杠", "name_en": "Qinchuan Machine Tool Planetary Roller Screw", "category": "actuators", "entity_kind": "component", "manufacturer": "秦川机床工具集团 (000837.SZ)", "type": "planetary_roller_screw", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "aerospace", "heavy_load_robot", "machine_tool" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E7%A7%A6%E5%B7%9D%E6%9C%BA%E5%BA%8A%E5%B7%A5%E5%85%B7%E9%9B%86%E5%9B%A2%20(000837.SZ)%20%E7%A7%A6%E5%B7%9D%E6%9C%BA%E5%BA%8A%20%E8%A1%8C%E6%98%9F%E6%BB%9A%E6%9F%B1%E4%B8%9D%E6%9D%A0%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-prs-beite-c5", "name": "北特科技 C5 级行星滚柱丝杠", "name_en": "Beite Technology C5-Grade Planetary Roller Screw", "category": "actuators", "entity_kind": "component", "manufacturer": "上海北特科技 (603009.SH)", "type": "planetary_roller_screw", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "dexterous_hand", "automotive" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E4%B8%8A%E6%B5%B7%E5%8C%97%E7%89%B9%E7%A7%91%E6%8A%80%20(603009.SH)%20%E5%8C%97%E7%89%B9%E7%A7%91%E6%8A%80%20C5%20%E7%BA%A7%E8%A1%8C%E6%98%9F%E6%BB%9A%E6%9F%B1%E4%B8%9D%E6%9D%A0%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-prs-dingzhi-micro", "name": "鼎智科技 微型行星滚柱丝杠", "name_en": "Dingzhi Technology Micro Planetary Roller Screw", "category": "actuators", "entity_kind": "component", "manufacturer": "常州鼎智机电 (Dingzhi, 江苏雷利子公司)", "type": "planetary_roller_screw", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "dexterous_hand", "humanoid", "medical" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E5%B8%B8%E5%B7%9E%E9%BC%8E%E6%99%BA%E6%9C%BA%E7%94%B5%20(Dingzhi%2C%20%E6%B1%9F%E8%8B%8F%E9%9B%B7%E5%88%A9%E5%AD%90%E5%85%AC%E5%8F%B8)%20%E9%BC%8E%E6%99%BA%E7%A7%91%E6%8A%80%20%E5%BE%AE%E5%9E%8B%E8%A1%8C%E6%98%9F%E6%BB%9A%E6%9F%B1%E4%B8%9D%E6%9D%A0%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-prs-shuanglin-inverted", "name": "双林股份 反向式行星滚柱丝杠", "name_en": "Shuanglin Auto Parts Inverted Planetary Roller Screw", "category": "actuators", "entity_kind": "component", "manufacturer": "宁波双林汽车部件 (300100.SZ)", "type": "planetary_roller_screw", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "linear_joint", "automotive" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E5%AE%81%E6%B3%A2%E5%8F%8C%E6%9E%97%E6%B1%BD%E8%BD%A6%E9%83%A8%E4%BB%B6%20(300100.SZ)%20%E5%8F%8C%E6%9E%97%E8%82%A1%E4%BB%BD%20%E5%8F%8D%E5%90%91%E5%BC%8F%E8%A1%8C%E6%98%9F%E6%BB%9A%E6%9F%B1%E4%B8%9D%E6%9D%A0%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-prs-rollvis-rvr", "name": "Rollvis RVR / RVD 行星滚柱丝杠", "name_en": "Rollvis RVR Recirculating / RVD Differential Roller Screw", "category": "actuators", "entity_kind": "component", "manufacturer": "Rollvis SA (瑞士, 2016 年被 GSA 并购)", "type": "planetary_roller_screw", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "precision_optics", "medical", "aerospace" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=Rollvis%20SA%20(%E7%91%9E%E5%A3%AB%2C%202016%20%E5%B9%B4%E8%A2%AB%20GSA%20%E5%B9%B6%E8%B4%AD)%20Rollvis%20RVR%20%2F%20RVD%20%E8%A1%8C%E6%98%9F%E6%BB%9A%E6%9F%B1%E4%B8%9D%E6%9D%A0%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-prs-gsa-swiss", "name": "GSA 行星滚柱丝杠", "name_en": "GSA (Groupe SA) Planetary Roller Screw", "category": "actuators", "entity_kind": "component", "manufacturer": "GSA (瑞士)", "type": "planetary_roller_screw", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "defense", "aerospace" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=GSA%20(%E7%91%9E%E5%A3%AB)%20GSA%20%E8%A1%8C%E6%98%9F%E6%BB%9A%E6%9F%B1%E4%B8%9D%E6%9D%A0%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-prs-ewellix-sr", "name": "Ewellix 行星滚柱丝杠（SR/SRA 系列）", "name_en": "Ewellix Planetary Roller Screw (SR/SRA Series)", "category": "actuators", "entity_kind": "component", "manufacturer": "Ewellix (瑞典, 2022 年被舍弗勒 Schaeffler 收购)", "type": "planetary_roller_screw", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "industrial_automation", "automotive", "humanoid" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=Ewellix%20(%E7%91%9E%E5%85%B8%2C%202022%20%E5%B9%B4%E8%A2%AB%E8%88%8D%E5%BC%97%E5%8B%92%20Schaeffler%20%E6%94%B6%E8%B4%AD)%20Ewellix%20%E8%A1%8C%E6%98%9F%E6%BB%9A%E6%9F%B1%E4%B8%9D%E6%9D%A0%EF%BC%88SR%2FSRA%20%E7%B3%BB%E5%88%97%EF%BC%89%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-prs-skf-heavyload", "name": "SKF 行星滚柱丝杠（重载系列）", "name_en": "SKF Planetary Roller Screw (Heavy-Load Series)", "category": "actuators", "entity_kind": "component", "manufacturer": "SKF (瑞典)", "type": "planetary_roller_screw", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "industrial", "humanoid", "heavy_load" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=SKF%20(%E7%91%9E%E5%85%B8)%20SKF%20%E8%A1%8C%E6%98%9F%E6%BB%9A%E6%9F%B1%E4%B8%9D%E6%9D%A0%EF%BC%88%E9%87%8D%E8%BD%BD%E7%B3%BB%E5%88%97%EF%BC%89%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-prs-bosch-rexroth", "name": "博世力士乐 行星滚柱丝杠", "name_en": "Bosch Rexroth Planetary Roller Screw", "category": "actuators", "entity_kind": "component", "manufacturer": "Bosch Rexroth (德国)", "type": "planetary_roller_screw", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "industrial", "machine_tool", "humanoid" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=Bosch%20Rexroth%20(%E5%BE%B7%E5%9B%BD)%20%E5%8D%9A%E4%B8%96%E5%8A%9B%E5%A3%AB%E4%B9%90%20%E8%A1%8C%E6%98%9F%E6%BB%9A%E6%9F%B1%E4%B8%9D%E6%9D%A0%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-fm-kinco-fmk", "name": "步科股份 FMK 系列无框力矩电机（第四代）", "name_en": "Kinco FMK Series Frameless Torque Motor (Gen-4)", "category": "actuators", "entity_kind": "component", "manufacturer": "上海步科自动化 (Kinco, 688160.SH)", "type": "frameless_torque_motor", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "cobot" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E4%B8%8A%E6%B5%B7%E6%AD%A5%E7%A7%91%E8%87%AA%E5%8A%A8%E5%8C%96%20(Kinco%2C%20688160.SH)%20%E6%AD%A5%E7%A7%91%E8%82%A1%E4%BB%BD%20FMK%20%E7%B3%BB%E5%88%97%E6%97%A0%E6%A1%86%E5%8A%9B%E7%9F%A9%E7%94%B5%E6%9C%BA%EF%BC%88%E7%AC%AC%E5%9B%9B%E4%BB%A3%EF%BC%89%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-fm-kinco-fmc", "name": "步科股份 FMC 系列无框中空力矩电机", "name_en": "Kinco FMC Series Frameless Hollow-Shaft Torque Motor", "category": "actuators", "entity_kind": "component", "manufacturer": "上海步科自动化 (Kinco, 688160.SH)", "type": "frameless_torque_motor", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "cobot" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-fm-leisai-fm2", "name": "雷赛智能 FM2 系列超高密度无框力矩电机", "name_en": "Leadshine FM2 Series Ultra-High-Density Frameless Torque Motor", "category": "actuators", "entity_kind": "component", "manufacturer": "深圳雷赛智能 (Leadshine, 002979.SZ) / 上海雷赛机器人", "type": "frameless_torque_motor", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "cobot", "quadruped" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E6%B7%B1%E5%9C%B3%E9%9B%B7%E8%B5%9B%E6%99%BA%E8%83%BD%20(Leadshine%2C%20002979.SZ)%20%2F%20%E4%B8%8A%E6%B5%B7%E9%9B%B7%E8%B5%9B%E6%9C%BA%E5%99%A8%E4%BA%BA%20%E9%9B%B7%E8%B5%9B%E6%99%BA%E8%83%BD%20FM2%20%E7%B3%BB%E5%88%97%E8%B6%85%E9%AB%98%E5%AF%86%E5%BA%A6%E6%97%A0%E6%A1%86%E5%8A%9B%E7%9F%A9%E7%94%B5%E6%9C%BA%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-fm-leisai-fm1", "name": "雷赛智能 FM1 系列高密度无框力矩电机", "name_en": "Leadshine FM1 Series High-Density Frameless Torque Motor", "category": "actuators", "entity_kind": "component", "manufacturer": "深圳雷赛智能 (Leadshine, 002979.SZ)", "type": "frameless_torque_motor", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "cobot", "humanoid", "industrial" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-fm-hcfa-humdb", "name": "禾川科技 Hu-MDB 系列无框力矩电机", "name_en": "HCFA Hu-MDB Series Frameless Torque Motor", "category": "actuators", "entity_kind": "component", "manufacturer": "浙江禾川科技 (HCFA, 688320.SH)", "type": "frameless_torque_motor", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "cobot", "quadruped" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-fm-inovance-mx-tmb", "name": "汇川技术 MX / TMB 系列无框力矩电机", "name_en": "Inovance MX / TMB Series Frameless Torque Motor", "category": "actuators", "entity_kind": "component", "manufacturer": "深圳汇川技术 (Inovance, 300124.SZ)", "type": "frameless_torque_motor", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "cobot", "industrial" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E6%B7%B1%E5%9C%B3%E6%B1%87%E5%B7%9D%E6%8A%80%E6%9C%AF%20(Inovance%2C%20300124.SZ)%20%E6%B1%87%E5%B7%9D%E6%8A%80%E6%9C%AF%20MX%20%2F%20TMB%20%E7%B3%BB%E5%88%97%E6%97%A0%E6%A1%86%E5%8A%9B%E7%9F%A9%E7%94%B5%E6%9C%BA%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-fm-haozhi-frameless", "name": "昊志机电 无框力矩电机", "name_en": "Haozhi Electromechanical Frameless Torque Motor", "category": "actuators", "entity_kind": "component", "manufacturer": "广州昊志机电 (300503.SZ)", "type": "frameless_torque_motor", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "cobot", "massage_robot" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-fm-veichi-micro", "name": "伟创电气 微型无框力矩电机", "name_en": "VEICHI Micro Frameless Torque Motor", "category": "actuators", "entity_kind": "component", "manufacturer": "苏州伟创电气 (688698.SH)", "type": "frameless_torque_motor", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "dexterous_hand", "humanoid", "micro_joint" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E8%8B%8F%E5%B7%9E%E4%BC%9F%E5%88%9B%E7%94%B5%E6%B0%94%20(688698.SH)%20%E4%BC%9F%E5%88%9B%E7%94%B5%E6%B0%94%20%E5%BE%AE%E5%9E%8B%E6%97%A0%E6%A1%86%E5%8A%9B%E7%9F%A9%E7%94%B5%E6%9C%BA%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-fm-wolong-frameless", "name": "卧龙电驱 无框力矩电机 / 高爆发关节模组", "name_en": "Wolong Electric Frameless Torque Motor & High-Burst Joint Module", "category": "actuators", "entity_kind": "component", "manufacturer": "卧龙电气驱动集团 (600580.SH)", "type": "frameless_torque_motor", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "quadruped", "industrial" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E5%8D%A7%E9%BE%99%E7%94%B5%E6%B0%94%E9%A9%B1%E5%8A%A8%E9%9B%86%E5%9B%A2%20(600580.SH)%20%E5%8D%A7%E9%BE%99%E7%94%B5%E9%A9%B1%20%E6%97%A0%E6%A1%86%E5%8A%9B%E7%9F%A9%E7%94%B5%E6%9C%BA%20%2F%20%E9%AB%98%E7%88%86%E5%8F%91%E5%85%B3%E8%8A%82%E6%A8%A1%E7%BB%84%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-fm-hanslaser-frameless", "name": "大族电机 无框力矩电机", "name_en": "Han's Motor Frameless Torque Motor", "category": "actuators", "entity_kind": "component", "manufacturer": "大族电机 / 大族激光 (002008.SZ)", "type": "frameless_torque_motor", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "cobot", "industrial" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E5%A4%A7%E6%97%8F%E7%94%B5%E6%9C%BA%20%2F%20%E5%A4%A7%E6%97%8F%E6%BF%80%E5%85%89%20(002008.SZ)%20%E5%A4%A7%E6%97%8F%E7%94%B5%E6%9C%BA%20%E6%97%A0%E6%A1%86%E5%8A%9B%E7%9F%A9%E7%94%B5%E6%9C%BA%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-fm-qianghe-u-series", "name": "强和电机 U 系列无框力矩电机", "name_en": "Qianghe Motor U-Series Frameless Torque Motor", "category": "actuators", "entity_kind": "component", "manufacturer": "深圳市强和电机有限公司", "type": "frameless_torque_motor", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "cobot", "humanoid", "medical", "semiconductor" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E6%B7%B1%E5%9C%B3%E5%B8%82%E5%BC%BA%E5%92%8C%E7%94%B5%E6%9C%BA%E6%9C%89%E9%99%90%E5%85%AC%E5%8F%B8%20%E5%BC%BA%E5%92%8C%E7%94%B5%E6%9C%BA%20U%20%E7%B3%BB%E5%88%97%E6%97%A0%E6%A1%86%E5%8A%9B%E7%9F%A9%E7%94%B5%E6%9C%BA%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-fm-mingzhi-coreless", "name": "鸣志电器 空心杯微型伺服电机（灵巧手）", "name_en": "MOONS' Coreless Micro Servo Motor for Dexterous Hands", "category": "actuators", "entity_kind": "component", "manufacturer": "上海鸣志电器 (603728.SH)", "type": "coreless_motor", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "dexterous_hand", "humanoid", "medical" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E4%B8%8A%E6%B5%B7%E9%B8%A3%E5%BF%97%E7%94%B5%E5%99%A8%20(603728.SH)%20%E9%B8%A3%E5%BF%97%E7%94%B5%E5%99%A8%20%E7%A9%BA%E5%BF%83%E6%9D%AF%E5%BE%AE%E5%9E%8B%E4%BC%BA%E6%9C%8D%E7%94%B5%E6%9C%BA%EF%BC%88%E7%81%B5%E5%B7%A7%E6%89%8B%EF%BC%89%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-ft-sri-m35xx", "name": "宇立仪器 M35XX 超薄型六维力传感器", "name_en": "SRI M35XX Ultra-thin 6-Axis Force/Torque Sensor", "category": "sensors", "entity_kind": "component", "manufacturer": "宇立仪器 (Sunrise Instruments / SRI)", "type": "force_torque_6axis", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "prosthetics", "biomechanics" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-ft-sri-c025xx", "name": "宇立仪器 C025XX-C060XX 人形机器人六维力传感器", "name_en": "SRI C025XX-C060XX Humanoid 6-Axis F/T Sensor", "category": "sensors", "entity_kind": "component", "manufacturer": "宇立仪器 (Sunrise Instruments / SRI)", "type": "force_torque_6axis", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "wrist_joint" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-ft-sri-c075xx", "name": "宇立仪器 C075XX 协作机器人六维力传感器", "name_en": "SRI C075XX Collaborative Robot 6-Axis F/T Sensor", "category": "sensors", "entity_kind": "component", "manufacturer": "宇立仪器 (Sunrise Instruments / SRI)", "type": "force_torque_6axis", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "cobot", "humanoid", "medical", "industrial" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-ft-sri-m221x", "name": "宇立仪器 M221X 关节扭矩传感器", "name_en": "SRI M221X Joint Torque Sensor", "category": "sensors", "entity_kind": "component", "manufacturer": "宇立仪器 (Sunrise Instruments / SRI)", "type": "joint_torque_sensor", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "cobot", "humanoid", "joint_torque_control" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-ft-sri-m37xx", "name": "宇立仪器 M37XX / M47XX 六维力传感器", "name_en": "SRI M37XX / M47XX 6-Axis Force/Torque Sensor", "category": "sensors", "entity_kind": "component", "manufacturer": "宇立仪器 (Sunrise Instruments / SRI)", "type": "force_torque_6axis", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "manipulator", "cobot", "testing", "humanoid" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-ft-kunwei-kwr-n", "name": "坤维科技 KWR-N 高精度六维力传感器", "name_en": "KunWei KWR-N High-Precision 6-Axis F/T Sensor", "category": "sensors", "entity_kind": "component", "manufacturer": "常州坤维科技 (KunWei)", "type": "force_torque_6axis", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "cobot", "humanoid", "testing", "industrial" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E5%B8%B8%E5%B7%9E%E5%9D%A4%E7%BB%B4%E7%A7%91%E6%8A%80%20(KunWei)%20%E5%9D%A4%E7%BB%B4%E7%A7%91%E6%8A%80%20KWR-N%20%E9%AB%98%E7%B2%BE%E5%BA%A6%E5%85%AD%E7%BB%B4%E5%8A%9B%E4%BC%A0%E6%84%9F%E5%99%A8%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-ft-hipersen-hpsft", "name": "海伯森 HPS-FT 系列六维力传感器", "name_en": "Hipersen HPS-FT Series 6-Axis F/T Sensor", "category": "sensors", "entity_kind": "component", "manufacturer": "深圳海伯森技术 (Hipersen)", "type": "force_torque_6axis", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "3c_electronics", "light_load_robot", "cobot" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E6%B7%B1%E5%9C%B3%E6%B5%B7%E4%BC%AF%E6%A3%AE%E6%8A%80%E6%9C%AF%20(Hipersen)%20%E6%B5%B7%E4%BC%AF%E6%A3%AE%20HPS-FT%20%E7%B3%BB%E5%88%97%E5%85%AD%E7%BB%B4%E5%8A%9B%E4%BC%A0%E6%84%9F%E5%99%A8%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-ft-xjc-ft", "name": "鑫精诚 XJC-FT 系列六维力传感器", "name_en": "XJC XJC-FT Series 6-Axis F/T Sensor", "category": "sensors", "entity_kind": "component", "manufacturer": "深圳鑫精诚传感技术 (XJC)", "type": "force_torque_6axis", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "3c_electronics", "cobot", "cost_sensitive" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E6%B7%B1%E5%9C%B3%E9%91%AB%E7%B2%BE%E8%AF%9A%E4%BC%A0%E6%84%9F%E6%8A%80%E6%9C%AF%20(XJC)%20%E9%91%AB%E7%B2%BE%E8%AF%9A%20XJC-FT%20%E7%B3%BB%E5%88%97%E5%85%AD%E7%BB%B4%E5%8A%9B%E4%BC%A0%E6%84%9F%E5%99%A8%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-ft-sysgroup-sysft", "name": "神源生 SYS-FT 系列六维力传感器", "name_en": "SYS SYS-FT Series 6-Axis F/T Sensor", "category": "sensors", "entity_kind": "component", "manufacturer": "南京神源生智能科技 (SYS)", "type": "force_torque_6axis", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "research", "education", "cobot" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E5%8D%97%E4%BA%AC%E7%A5%9E%E6%BA%90%E7%94%9F%E6%99%BA%E8%83%BD%E7%A7%91%E6%8A%80%20(SYS)%20%E7%A5%9E%E6%BA%90%E7%94%9F%20SYS-FT%20%E7%B3%BB%E5%88%97%E5%85%AD%E7%BB%B4%E5%8A%9B%E4%BC%A0%E6%84%9F%E5%99%A8%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-ft-me-k3d", "name": "ME-Systeme K3D 系列多轴力传感器", "name_en": "ME-Systeme K3D Series Multi-Axis Force Sensor", "category": "sensors", "entity_kind": "component", "manufacturer": "ME-Meßsysteme GmbH (德国)", "type": "force_torque_multiaxis", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "automotive_testing", "aerospace", "research" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=ME-Me%C3%9Fsysteme%20GmbH%20(%E5%BE%B7%E5%9B%BD)%20ME-Systeme%20K3D%20%E7%B3%BB%E5%88%97%E5%A4%9A%E8%BD%B4%E5%8A%9B%E4%BC%A0%E6%84%9F%E5%99%A8%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-ft-haozhi-6axis", "name": "昊志机电 六维力矩传感器", "name_en": "Haozhi 6-Axis Force/Torque Sensor", "category": "sensors", "entity_kind": "component", "manufacturer": "广州昊志机电 (300503.SZ)", "type": "force_torque_6axis", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "cobot", "joint_module" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E5%B9%BF%E5%B7%9E%E6%98%8A%E5%BF%97%E6%9C%BA%E7%94%B5%20(300503.SZ)%20%E6%98%8A%E5%BF%97%E6%9C%BA%E7%94%B5%20%E5%85%AD%E7%BB%B4%E5%8A%9B%E7%9F%A9%E4%BC%A0%E6%84%9F%E5%99%A8%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-jm-leaderdrive-mechatronic", "name": "绿的谐波 机电一体化关节模组", "name_en": "LeaderDrive Mechatronic Integrated Joint Module", "category": "actuators", "entity_kind": "component", "manufacturer": "苏州绿的谐波传动科技 (LeaderDrive, 688017.SH)", "type": "integrated_joint_module", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "cobot", "torso", "limb" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E8%8B%8F%E5%B7%9E%E7%BB%BF%E7%9A%84%E8%B0%90%E6%B3%A2%E4%BC%A0%E5%8A%A8%E7%A7%91%E6%8A%80%20(LeaderDrive%2C%20688017.SH)%20%E7%BB%BF%E7%9A%84%E8%B0%90%E6%B3%A2%20%E6%9C%BA%E7%94%B5%E4%B8%80%E4%BD%93%E5%8C%96%E5%85%B3%E8%8A%82%E6%A8%A1%E7%BB%84%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-jm-haozhi-integrated", "name": "昊志机电 一体化关节模组", "name_en": "Haozhi Integrated Joint Module", "category": "actuators", "entity_kind": "component", "manufacturer": "广州昊志机电 (300503.SZ)", "type": "integrated_joint_module", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "cobot", "wrist", "torso" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E5%B9%BF%E5%B7%9E%E6%98%8A%E5%BF%97%E6%9C%BA%E7%94%B5%20(300503.SZ)%20%E6%98%8A%E5%BF%97%E6%9C%BA%E7%94%B5%20%E4%B8%80%E4%BD%93%E5%8C%96%E5%85%B3%E8%8A%82%E6%A8%A1%E7%BB%84%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-jm-kinco-triple", "name": "步科股份 电机-驱动-编码器三合一驱控模组", "name_en": "Kinco 3-in-1 Motor-Drive-Encoder Joint Module", "category": "actuators", "entity_kind": "component", "manufacturer": "上海步科自动化 (Kinco, 688160.SH)", "type": "integrated_joint_module", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "cobot", "service_robot" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E4%B8%8A%E6%B5%B7%E6%AD%A5%E7%A7%91%E8%87%AA%E5%8A%A8%E5%8C%96%20(Kinco%2C%20688160.SH)%20%E6%AD%A5%E7%A7%91%E8%82%A1%E4%BB%BD%20%E7%94%B5%E6%9C%BA-%E9%A9%B1%E5%8A%A8-%E7%BC%96%E7%A0%81%E5%99%A8%E4%B8%89%E5%90%88%E4%B8%80%E9%A9%B1%E6%8E%A7%E6%A8%A1%E7%BB%84%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-jm-leisai-module", "name": "雷赛智能 超高密度关节模组", "name_en": "Leadshine Ultra-High-Density Joint Module", "category": "actuators", "entity_kind": "component", "manufacturer": "上海雷赛机器人科技（雷赛智能 002979.SZ 子公司）", "type": "integrated_joint_module", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "cobot", "dexterous_hand" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E4%B8%8A%E6%B5%B7%E9%9B%B7%E8%B5%9B%E6%9C%BA%E5%99%A8%E4%BA%BA%E7%A7%91%E6%8A%80%EF%BC%88%E9%9B%B7%E8%B5%9B%E6%99%BA%E8%83%BD%20002979.SZ%20%E5%AD%90%E5%85%AC%E5%8F%B8%EF%BC%89%20%E9%9B%B7%E8%B5%9B%E6%99%BA%E8%83%BD%20%E8%B6%85%E9%AB%98%E5%AF%86%E5%BA%A6%E5%85%B3%E8%8A%82%E6%A8%A1%E7%BB%84%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-jm-tuopu-linear", "name": "拓普集团 直线执行器总成", "name_en": "Tuopu Group Linear Actuator Assembly", "category": "actuators", "entity_kind": "component", "manufacturer": "宁波拓普集团 (601689.SH)", "type": "integrated_linear_actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "linear_joint", "automotive" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E5%AE%81%E6%B3%A2%E6%8B%93%E6%99%AE%E9%9B%86%E5%9B%A2%20(601689.SH)%20%E6%8B%93%E6%99%AE%E9%9B%86%E5%9B%A2%20%E7%9B%B4%E7%BA%BF%E6%89%A7%E8%A1%8C%E5%99%A8%E6%80%BB%E6%88%90%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-jm-sanhua-actuator", "name": "三花智控 机电执行器总成", "name_en": "Sanhua Intelligent Controls Electromechanical Actuator Assembly", "category": "actuators", "entity_kind": "component", "manufacturer": "浙江三花智能控制 (002050.SZ)", "type": "integrated_joint_module", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "rotary_actuator", "linear_actuator" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E6%B5%99%E6%B1%9F%E4%B8%89%E8%8A%B1%E6%99%BA%E8%83%BD%E6%8E%A7%E5%88%B6%20(002050.SZ)%20%E4%B8%89%E8%8A%B1%E6%99%BA%E6%8E%A7%20%E6%9C%BA%E7%94%B5%E6%89%A7%E8%A1%8C%E5%99%A8%E6%80%BB%E6%88%90%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-jm-zhaowei-micro", "name": "兆威机电 微型精密传动关节模组", "name_en": "Zhaowei Machinery Micro Precision Transmission Joint Module", "category": "actuators", "entity_kind": "component", "manufacturer": "深圳兆威机电 (003021.SZ)", "type": "integrated_joint_module", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "dexterous_hand", "humanoid", "micro_joint" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E6%B7%B1%E5%9C%B3%E5%85%86%E5%A8%81%E6%9C%BA%E7%94%B5%20(003021.SZ)%20%E5%85%86%E5%A8%81%E6%9C%BA%E7%94%B5%20%E5%BE%AE%E5%9E%8B%E7%B2%BE%E5%AF%86%E4%BC%A0%E5%8A%A8%E5%85%B3%E8%8A%82%E6%A8%A1%E7%BB%84%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-jm-topband-hand", "name": "拓邦股份 灵巧手一体化驱动模组", "name_en": "Topband Dexterous Hand Integrated Drive Module", "category": "actuators", "entity_kind": "component", "manufacturer": "深圳拓邦股份 (002139.SZ)", "type": "integrated_joint_module", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "dexterous_hand", "humanoid" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E6%B7%B1%E5%9C%B3%E6%8B%93%E9%82%A6%E8%82%A1%E4%BB%BD%20(002139.SZ)%20%E6%8B%93%E9%82%A6%E8%82%A1%E4%BB%BD%20%E7%81%B5%E5%B7%A7%E6%89%8B%E4%B8%80%E4%BD%93%E5%8C%96%E9%A9%B1%E5%8A%A8%E6%A8%A1%E7%BB%84%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "DATA-tele-mobile-aloha", "name": "Mobile ALOHA 移动双臂遥操作采集平台", "name_en": "Mobile ALOHA", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "Stanford University（开源硬件，社区可自建）", "type": "teleoperation", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "mobile_manipulation", "imitation_learning", "household_task" ], "price_range": null, "ros_support": null, "modalities": [ "vision" ], "modality_details": { "exposed": [ "vision" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": true, "note": "该零件/系统自带视觉/位姿观测模态（来自 data_modalities）" } }, "evidence": { "source_tier": "A", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=Stanford%20University%EF%BC%88%E5%BC%80%E6%BA%90%E7%A1%AC%E4%BB%B6%EF%BC%8C%E7%A4%BE%E5%8C%BA%E5%8F%AF%E8%87%AA%E5%BB%BA%EF%BC%89%20Mobile%20ALOHA%20%E7%A7%BB%E5%8A%A8%E5%8F%8C%E8%87%82%E9%81%A5%E6%93%8D%E4%BD%9C%E9%87%87%E9%9B%86%E5%B9%B3%E5%8F%B0%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "DATA-tele-open-television", "name": "Open-TeleVision 沉浸式 VR 遥操作系统", "name_en": "Open-TeleVision", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "UC San Diego / MIT（开源）", "type": "teleoperation", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "dexterous_hand", "remote_teleoperation", "imitation_learning" ], "price_range": null, "ros_support": null, "modalities": [ "vision" ], "modality_details": { "exposed": [ "vision" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": true, "note": "该零件/系统自带视觉/位姿观测模态（来自 data_modalities）" } }, "evidence": { "source_tier": "A", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=UC%20San%20Diego%20%2F%20MIT%EF%BC%88%E5%BC%80%E6%BA%90%EF%BC%89%20Open-TeleVision%20%E6%B2%89%E6%B5%B8%E5%BC%8F%20VR%20%E9%81%A5%E6%93%8D%E4%BD%9C%E7%B3%BB%E7%BB%9F%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "DATA-exo-airexo2", "name": "AirExo-2 低成本可穿戴外骨骼采集装置", "name_en": "AirExo-2", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "上海交通大学（开源硬件）", "type": "exoskeleton_capture", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "in_the_wild_capture", "imitation_learning", "manipulator" ], "price_range": null, "ros_support": null, "modalities": [ "vision" ], "modality_details": { "exposed": [ "vision" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": true, "note": "该零件/系统自带视觉/位姿观测模态（来自 data_modalities）" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E4%B8%8A%E6%B5%B7%E4%BA%A4%E9%80%9A%E5%A4%A7%E5%AD%A6%EF%BC%88%E5%BC%80%E6%BA%90%E7%A1%AC%E4%BB%B6%EF%BC%89%20AirExo-2%20%E4%BD%8E%E6%88%90%E6%9C%AC%E5%8F%AF%E7%A9%BF%E6%88%B4%E5%A4%96%E9%AA%A8%E9%AA%BC%E9%87%87%E9%9B%86%E8%A3%85%E7%BD%AE%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "DATA-tele-bunny-visionpro", "name": "Bunny-VisionPro 双手实时遥操作系统", "name_en": "Bunny-VisionPro", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "UC San Diego（开源）", "type": "teleoperation", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "bimanual_manipulation", "dexterous_hand", "imitation_learning" ], "price_range": null, "ros_support": null, "modalities": [ "tactile", "vision" ], "modality_details": { "exposed": [ "tactile", "vision" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": true, "basis": [ "data_modalities:haptic_feedback" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": true, "note": "该零件/系统自带视觉/位姿观测模态（来自 data_modalities）" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=UC%20San%20Diego%EF%BC%88%E5%BC%80%E6%BA%90%EF%BC%89%20Bunny-VisionPro%20%E5%8F%8C%E6%89%8B%E5%AE%9E%E6%97%B6%E9%81%A5%E6%93%8D%E4%BD%9C%E7%B3%BB%E7%BB%9F%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "DATA-exo-ace-teleop", "name": "ACE 跨平台视觉-外骨骼遥操作系统", "name_en": "ACE (A Cross-platform Visual-Exoskeleton System)", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "UC San Diego（开源硬件）", "type": "exoskeleton_capture", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "cross_embodiment", "humanoid", "imitation_learning" ], "price_range": null, "ros_support": null, "modalities": [ "vision" ], "modality_details": { "exposed": [ "vision" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": true, "note": "该零件/系统自带视觉/位姿观测模态（来自 data_modalities）" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=UC%20San%20Diego%EF%BC%88%E5%BC%80%E6%BA%90%E7%A1%AC%E4%BB%B6%EF%BC%89%20ACE%20%E8%B7%A8%E5%B9%B3%E5%8F%B0%E8%A7%86%E8%A7%89-%E5%A4%96%E9%AA%A8%E9%AA%BC%E9%81%A5%E6%93%8D%E4%BD%9C%E7%B3%BB%E7%BB%9F%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "DATA-glove-doglove", "name": "DOGlove 力反馈数据手套", "name_en": "DOGlove", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "上海交通大学（开源硬件）", "type": "tactile_glove", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "dexterous_hand", "force_teleoperation", "imitation_learning" ], "price_range": null, "ros_support": null, "modalities": [ "force", "tactile", "vision" ], "modality_details": { "exposed": [ "force", "tactile", "vision" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "data_modalities" ] }, "tactile": { "declared": true, "basis": [ "data_modalities:grasp_force/haptic_feedback" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": true, "note": "该零件/系统自带视觉/位姿观测模态（来自 data_modalities）" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E4%B8%8A%E6%B5%B7%E4%BA%A4%E9%80%9A%E5%A4%A7%E5%AD%A6%EF%BC%88%E5%BC%80%E6%BA%90%E7%A1%AC%E4%BB%B6%EF%BC%89%20DOGlove%20%E5%8A%9B%E5%8F%8D%E9%A6%88%E6%95%B0%E6%8D%AE%E6%89%8B%E5%A5%97%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "DATA-glove-manus-quantum", "name": "Manus Quantum Metagloves 动捕手套", "name_en": "Manus Quantum Metagloves", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "Manus（荷兰）", "type": "tactile_glove", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "dexterous_hand", "motion_capture", "teleoperation" ], "price_range": "商用报价（万元级/套，需询价）", "ros_support": null, "modalities": [ "vision" ], "modality_details": { "exposed": [ "vision" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": true, "note": "该零件/系统自带视觉/位姿观测模态（来自 data_modalities）" } }, "evidence": { "source_tier": "A", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=Manus%EF%BC%88%E8%8D%B7%E5%85%B0%EF%BC%89%20Manus%20Quantum%20Metagloves%20%E5%8A%A8%E6%8D%95%E6%89%8B%E5%A5%97%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "DATA-mocap-rokoko-smartsuit2", "name": "Rokoko Smartsuit Pro II 惯性动捕服", "name_en": "Rokoko Smartsuit Pro II", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "Rokoko（丹麦）", "type": "motion_capture", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "whole_body_retargeting", "motion_capture" ], "price_range": "商用（万元级/套）", "ros_support": null, "modalities": [ "vision" ], "modality_details": { "exposed": [ "vision" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": true, "note": "该零件/系统自带视觉/位姿观测模态（来自 data_modalities）" } }, "evidence": { "source_tier": "A", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=Rokoko%EF%BC%88%E4%B8%B9%E9%BA%A6%EF%BC%89%20Rokoko%20Smartsuit%20Pro%20II%20%E6%83%AF%E6%80%A7%E5%8A%A8%E6%8D%95%E6%9C%8D%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "DATA-mocap-noitom-pn-studio", "name": "诺亦腾 Perception Neuron Studio 惯性动捕系统", "name_en": "Noitom Perception Neuron Studio", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "北京诺亦腾科技 (Noitom)", "type": "motion_capture", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "whole_body_retargeting", "motion_capture" ], "price_range": null, "ros_support": null, "modalities": [ "vision" ], "modality_details": { "exposed": [ "vision" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": true, "note": "该零件/系统自带视觉/位姿观测模态（来自 data_modalities）" } }, "evidence": { "source_tier": "A", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E5%8C%97%E4%BA%AC%E8%AF%BA%E4%BA%A6%E8%85%BE%E7%A7%91%E6%8A%80%20(Noitom)%20%E8%AF%BA%E4%BA%A6%E8%85%BE%20Perception%20Neuron%20Studio%20%E6%83%AF%E6%80%A7%E5%8A%A8%E6%8D%95%E7%B3%BB%E7%BB%9F%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "DATA-umi-fastumi", "name": "FastUMI 快速部署型 UMI 采集装置", "name_en": "FastUMI", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "开源社区 / 学术团队", "type": "handheld_gripper_capture", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "in_the_wild_capture", "manipulator", "imitation_learning" ], "price_range": null, "ros_support": null, "modalities": [ "vision" ], "modality_details": { "exposed": [ "vision" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": true, "note": "该零件/系统自带视觉/位姿观测模态（来自 data_modalities）" } }, "evidence": { "source_tier": "A", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E5%BC%80%E6%BA%90%E7%A4%BE%E5%8C%BA%20%2F%20%E5%AD%A6%E6%9C%AF%E5%9B%A2%E9%98%9F%20FastUMI%20%E5%BF%AB%E9%80%9F%E9%83%A8%E7%BD%B2%E5%9E%8B%20UMI%20%E9%87%87%E9%9B%86%E8%A3%85%E7%BD%AE%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "DATA-humanoid-humanplus", "name": "HumanPlus 人形影子学习采集系统", "name_en": "HumanPlus", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "Stanford University（开源）", "type": "teleoperation", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "whole_body_retargeting", "imitation_learning" ], "price_range": null, "ros_support": null, "modalities": [ "vision" ], "modality_details": { "exposed": [ "vision" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": true, "note": "该零件/系统自带视觉/位姿观测模态（来自 data_modalities）" } }, "evidence": { "source_tier": "A", "confidence": 0.62, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=Stanford%20University%EF%BC%88%E5%BC%80%E6%BA%90%EF%BC%89%20HumanPlus%20%E4%BA%BA%E5%BD%A2%E5%BD%B1%E5%AD%90%E5%AD%A6%E4%B9%A0%E9%87%87%E9%9B%86%E7%B3%BB%E7%BB%9F%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "DATA-neuro-originflow-kit", "name": "OriginFlow OriginKit Gen1 神经肌电腕带", "name_en": "OriginFlow OriginKit Gen1 sEMG Wristband", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "OriginFlow（渊澈太初）", "type": "neural_interface", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "embodied_data_collection", "human_robot_interface", "prosthetic_control" ], "price_range": null, "ros_support": null, "modalities": [ "vision" ], "modality_details": { "exposed": [ "vision" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": true, "note": "该零件/系统自带视觉/位姿观测模态（来自 data_modalities）" } }, "evidence": { "source_tier": "B", "confidence": 0.75, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "DATA-neuro-snoworigin-band", "name": "雪梦未来神经腕带", "name_en": "SnowOrigin Neural Wristband", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "雪梦未来（SnowOrigin）", "type": "neural_interface", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "embodied_data_collection", "hand_pose_estimation", "prosthetic_control" ], "price_range": null, "ros_support": null, "modalities": [ "vision" ], "modality_details": { "exposed": [ "vision" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": true, "note": "该零件/系统自带视觉/位姿观测模态（来自 data_modalities）" } }, "evidence": { "source_tier": "C", "confidence": 0.72, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "DATA-neuro-aemg-ref", "name": "AEMG 通用肌电采集参考平台", "name_en": "AEMG Universal EMG Collection Reference Platform", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "AEMG-series（CVPR 2026 开源）", "type": "neural_interface", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "gesture_recognition", "embodied_data_collection", "prosthetic_control" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.85, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=AEMG-series%EF%BC%88CVPR%202026%20%E5%BC%80%E6%BA%90%EF%BC%89%20AEMG%20%E9%80%9A%E7%94%A8%E8%82%8C%E7%94%B5%E9%87%87%E9%9B%86%E5%8F%82%E8%80%83%E5%B9%B3%E5%8F%B0%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CHIP-axelera-metis-aipu", "name": "Axelera Metis AIPU", "name_en": "Axelera AI Metis AIPU", "category": "chips", "entity_kind": "component", "manufacturer": "Axelera AI（荷兰）", "type": "ai_accelerator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "edge_ai", "robot_vision", "multi_stream_inference" ], "price_range": null, "ros_support": false, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=Axelera%20AI%EF%BC%88%E8%8D%B7%E5%85%B0%EF%BC%89%20Axelera%20Metis%20AIPU%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": false, "interop_posture": "unknown" } }, { "id": "CHIP-axera-ax650n", "name": "爱芯元智 AX650N", "name_en": "Axera AX650N", "category": "chips", "entity_kind": "component", "manufacturer": "上海爱芯元智半导体 (Axera)", "type": "robot_soc", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "edge_ai", "robot_vision", "smart_camera" ], "price_range": null, "ros_support": false, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E4%B8%8A%E6%B5%B7%E7%88%B1%E8%8A%AF%E5%85%83%E6%99%BA%E5%8D%8A%E5%AF%BC%E4%BD%93%20(Axera)%20%E7%88%B1%E8%8A%AF%E5%85%83%E6%99%BA%20AX650N%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": false, "interop_posture": "unknown" } }, { "id": "CHIP-axera-ax8850", "name": "爱芯元智 AX8850", "name_en": "Axera AX8850", "category": "chips", "entity_kind": "component", "manufacturer": "上海爱芯元智半导体 (Axera)", "type": "robot_soc", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "edge_ai", "robot_vision", "multimodal_inference" ], "price_range": null, "ros_support": false, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.42, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E4%B8%8A%E6%B5%B7%E7%88%B1%E8%8A%AF%E5%85%83%E6%99%BA%E5%8D%8A%E5%AF%BC%E4%BD%93%20(Axera)%20%E7%88%B1%E8%8A%AF%E5%85%83%E6%99%BA%20AX8850%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": false, "interop_posture": "unknown" } }, { "id": "CHIP-blacksesame-huashan-a2000", "name": "黑芝麻智能 华山 A2000", "name_en": "Black Sesame Technologies Huashan A2000", "category": "chips", "entity_kind": "component", "manufacturer": "黑芝麻智能 (Black Sesame Technologies, 2533.HK)", "type": "robot_soc", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "autonomous_vehicle", "embodied_ai", "edge_ai" ], "price_range": null, "ros_support": false, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.45, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E9%BB%91%E8%8A%9D%E9%BA%BB%E6%99%BA%E8%83%BD%20(Black%20Sesame%20Technologies%2C%202533.HK)%20%E9%BB%91%E8%8A%9D%E9%BA%BB%E6%99%BA%E8%83%BD%20%E5%8D%8E%E5%B1%B1%20A2000%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": false, "interop_posture": "unknown" } }, { "id": "CHIP-sophgo-bm1684x", "name": "算能 SOPHON BM1684X", "name_en": "SOPHGO SOPHON BM1684X", "category": "chips", "entity_kind": "component", "manufacturer": "算能科技 (SOPHGO)", "type": "ai_accelerator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "edge_ai", "llm_inference", "robot_vision" ], "price_range": null, "ros_support": false, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E7%AE%97%E8%83%BD%E7%A7%91%E6%8A%80%20(SOPHGO)%20%E7%AE%97%E8%83%BD%20SOPHON%20BM1684X%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": false, "interop_posture": "unknown" } }, { "id": "CHIP-cambricon-mlu370-s4", "name": "寒武纪 MLU370-S4 推理加速卡", "name_en": "Cambricon MLU370-S4", "category": "chips", "entity_kind": "component", "manufacturer": "中科寒武纪 (688256.SH)", "type": "ai_accelerator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "edge_server_inference", "llm_inference", "vision_inference" ], "price_range": null, "ros_support": false, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E4%B8%AD%E7%A7%91%E5%AF%92%E6%AD%A6%E7%BA%AA%20(688256.SH)%20%E5%AF%92%E6%AD%A6%E7%BA%AA%20MLU370-S4%20%E6%8E%A8%E7%90%86%E5%8A%A0%E9%80%9F%E5%8D%A1%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": false, "interop_posture": "unknown" } }, { "id": "CHIP-rockchip-rk3576", "name": "瑞芯微 RK3576", "name_en": "Rockchip RK3576", "category": "chips", "entity_kind": "component", "manufacturer": "瑞芯微电子 (603893.SH)", "type": "robot_soc", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "robot_controller", "hmi", "edge_ai" ], "price_range": null, "ros_support": true, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": true, "interop_posture": "unknown" } }, { "id": "CHIP-simaai-modalix", "name": "SiMa.ai MLSoC Modalix", "name_en": "SiMa.ai MLSoC Modalix", "category": "chips", "entity_kind": "component", "manufacturer": "SiMa.ai（美国）", "type": "robot_soc", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "edge_ai", "robot_vision", "multimodal_inference", "embodied_ai" ], "price_range": null, "ros_support": false, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": false, "interop_posture": "unknown" } }, { "id": "CHIP-ambarella-n1-655", "name": "Ambarella N1-655 边缘 GenAI SoC", "name_en": "Ambarella N1-655", "category": "chips", "entity_kind": "component", "manufacturer": "Ambarella（美国安霸）", "type": "robot_soc", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "edge_ai", "robot_vision", "vlm_inference", "smart_camera" ], "price_range": null, "ros_support": false, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=Ambarella%EF%BC%88%E7%BE%8E%E5%9B%BD%E5%AE%89%E9%9C%B8%EF%BC%89%20Ambarella%20N1-655%20%E8%BE%B9%E7%BC%98%20GenAI%20SoC%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": false, "interop_posture": "unknown" } }, { "id": "CHIP-ti-am69a", "name": "TI AM69A 边缘 AI 处理器", "name_en": "Texas Instruments AM69A", "category": "chips", "entity_kind": "component", "manufacturer": "Texas Instruments", "type": "robot_soc", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "industrial_robot", "robot_vision", "edge_ai", "amr" ], "price_range": null, "ros_support": true, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=Texas%20Instruments%20TI%20AM69A%20%E8%BE%B9%E7%BC%98%20AI%20%E5%A4%84%E7%90%86%E5%99%A8%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": true, "interop_posture": "unknown" } }, { "id": "CHIP-deepx-dx-m1", "name": "DEEPX DX-M1 边缘 NPU", "name_en": "DEEPX DX-M1", "category": "chips", "entity_kind": "component", "manufacturer": "DEEPX（韩国）", "type": "ai_accelerator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "edge_ai", "robot_vision", "smart_camera" ], "price_range": null, "ros_support": false, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.45, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=DEEPX%EF%BC%88%E9%9F%A9%E5%9B%BD%EF%BC%89%20DEEPX%20DX-M1%20%E8%BE%B9%E7%BC%98%20NPU%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": false, "interop_posture": "unknown" } }, { "id": "CHIP-houmo-manye-m30", "name": "后摩智能 漫界 M30 存算一体芯片", "name_en": "Houmo.AI Manye M30", "category": "chips", "entity_kind": "component", "manufacturer": "后摩智能 (Houmo.AI)", "type": "ai_accelerator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "edge_ai", "llm_inference", "embodied_ai" ], "price_range": null, "ros_support": false, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.42, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E5%90%8E%E6%91%A9%E6%99%BA%E8%83%BD%20(Houmo.AI)%20%E5%90%8E%E6%91%A9%E6%99%BA%E8%83%BD%20%E6%BC%AB%E7%95%8C%20M30%20%E5%AD%98%E7%AE%97%E4%B8%80%E4%BD%93%E8%8A%AF%E7%89%87%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": false, "interop_posture": "unknown" } }, { "id": "SENS-ft-keli-6axis", "name": "柯力传感 六维力传感器", "name_en": "Keli Sensing 6-Axis Force/Torque Sensor", "category": "sensors", "entity_kind": "component", "manufacturer": "宁波柯力传感科技 (603662.SH)", "type": "force_torque_6axis", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "cobot", "force_control" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.45, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E5%AE%81%E6%B3%A2%E6%9F%AF%E5%8A%9B%E4%BC%A0%E6%84%9F%E7%A7%91%E6%8A%80%20(603662.SH)%20%E6%9F%AF%E5%8A%9B%E4%BC%A0%E6%84%9F%20%E5%85%AD%E7%BB%B4%E5%8A%9B%E4%BC%A0%E6%84%9F%E5%99%A8%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-ft-anpulong-ceramic", "name": "安培龙 陶瓷电容式六维力传感器", "name_en": "Anpulong Ceramic Capacitive 6-Axis F/T Sensor", "category": "sensors", "entity_kind": "component", "manufacturer": "深圳安培龙科技 (301413.SZ)", "type": "force_torque_6axis", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "force_control", "automotive" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.45, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E6%B7%B1%E5%9C%B3%E5%AE%89%E5%9F%B9%E9%BE%99%E7%A7%91%E6%8A%80%20(301413.SZ)%20%E5%AE%89%E5%9F%B9%E9%BE%99%20%E9%99%B6%E7%93%B7%E7%94%B5%E5%AE%B9%E5%BC%8F%E5%85%AD%E7%BB%B4%E5%8A%9B%E4%BC%A0%E6%84%9F%E5%99%A8%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-ft-qianfenyi-6axis", "name": "千分一 六维力传感器", "name_en": "Qianfenyi 6-Axis Force/Torque Sensor", "category": "sensors", "entity_kind": "component", "manufacturer": "深圳千分一科技 (Qianfenyi)", "type": "force_torque_6axis", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "cobot", "humanoid", "force_control", "polishing" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.42, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E6%B7%B1%E5%9C%B3%E5%8D%83%E5%88%86%E4%B8%80%E7%A7%91%E6%8A%80%20(Qianfenyi)%20%E5%8D%83%E5%88%86%E4%B8%80%20%E5%85%AD%E7%BB%B4%E5%8A%9B%E4%BC%A0%E6%84%9F%E5%99%A8%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-strain-avicem", "name": "中航电测 应变式力/扭矩传感器", "name_en": "AVIC Electromechanical (AVICEM) Strain Gauge Force/Torque Sensor", "category": "sensors", "entity_kind": "component", "manufacturer": "中航电测仪器 (300114.SZ)", "type": "strain_gauge_force", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "force_control", "torque_measurement", "industrial" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.45, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E4%B8%AD%E8%88%AA%E7%94%B5%E6%B5%8B%E4%BB%AA%E5%99%A8%20(300114.SZ)%20%E4%B8%AD%E8%88%AA%E7%94%B5%E6%B5%8B%20%E5%BA%94%E5%8F%98%E5%BC%8F%E5%8A%9B%2F%E6%89%AD%E7%9F%A9%E4%BC%A0%E6%84%9F%E5%99%A8%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-imu-xindonglianke-mems", "name": "芯动联科 高性能 MEMS 陀螺/IMU", "name_en": "MicroDrive (Xindong Lianke) High-Performance MEMS Gyroscope / IMU", "category": "sensors", "entity_kind": "component", "manufacturer": "安徽芯动联科微系统 (688582.SH)", "type": "IMU", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "legged_robot", "navigation", "attitude_estimation" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E5%AE%89%E5%BE%BD%E8%8A%AF%E5%8A%A8%E8%81%94%E7%A7%91%E5%BE%AE%E7%B3%BB%E7%BB%9F%20(688582.SH)%20%E8%8A%AF%E5%8A%A8%E8%81%94%E7%A7%91%20%E9%AB%98%E6%80%A7%E8%83%BD%20MEMS%20%E9%99%80%E8%9E%BA%2FIMU%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-imu-huayi-automotive", "name": "华依科技 车规级 IMU 惯性模组", "name_en": "Huayi Technology Automotive-Grade IMU", "category": "sensors", "entity_kind": "component", "manufacturer": "上海华依科技 (688071.SH)", "type": "IMU", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "automotive", "amr", "navigation", "attitude_estimation" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.42, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E4%B8%8A%E6%B5%B7%E5%8D%8E%E4%BE%9D%E7%A7%91%E6%8A%80%20(688071.SH)%20%E5%8D%8E%E4%BE%9D%E7%A7%91%E6%8A%80%20%E8%BD%A6%E8%A7%84%E7%BA%A7%20IMU%20%E6%83%AF%E6%80%A7%E6%A8%A1%E7%BB%84%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-cam-orbbec-gemini335", "name": "奥比中光 Gemini 335 双目结构光深度相机", "name_en": "Orbbec Gemini 335", "category": "sensors", "entity_kind": "component", "manufacturer": "奥比中光科技 (688322.SH)", "type": "Depth Camera", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "robot_vision", "slam", "manipulation", "amr" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.6, "verified": true, "quarantine": false, "source_url": "https://www.google.com/search?q=%E5%A5%A5%E6%AF%94%E4%B8%AD%E5%85%89%E7%A7%91%E6%8A%80%20(688322.SH)%20%E5%A5%A5%E6%AF%94%E4%B8%AD%E5%85%89%20Gemini%20335%20%E5%8F%8C%E7%9B%AE%E7%BB%93%E6%9E%84%E5%85%89%E6%B7%B1%E5%BA%A6%E7%9B%B8%E6%9C%BA%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": true, "interop_posture": "unknown" } }, { "id": "SENS-cam-percipio-fm851", "name": "图漾科技 FM851 工业级 3D 相机", "name_en": "Percipio FM851 Industrial 3D Camera", "category": "sensors", "entity_kind": "component", "manufacturer": "上海图漾信息科技 (Percipio.XYZ)", "type": "Depth Camera", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "bin_picking", "palletizing", "manipulator", "industrial" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E4%B8%8A%E6%B5%B7%E5%9B%BE%E6%BC%BE%E4%BF%A1%E6%81%AF%E7%A7%91%E6%8A%80%20(Percipio.XYZ)%20%E5%9B%BE%E6%BC%BE%E7%A7%91%E6%8A%80%20FM851%20%E5%B7%A5%E4%B8%9A%E7%BA%A7%203D%20%E7%9B%B8%E6%9C%BA%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-lidar-hesai-ft120", "name": "禾赛科技 FT120 纯固态补盲激光雷达", "name_en": "Hesai FT120 Solid-State LiDAR", "category": "sensors", "entity_kind": "component", "manufacturer": "禾赛科技 (HSAI / 688771.SH)", "type": "LiDAR", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "obstacle_avoidance", "amr", "legged_robot", "autonomous_vehicle" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E7%A6%BE%E8%B5%9B%E7%A7%91%E6%8A%80%20(HSAI%20%2F%20688771.SH)%20%E7%A6%BE%E8%B5%9B%E7%A7%91%E6%8A%80%20FT120%20%E7%BA%AF%E5%9B%BA%E6%80%81%E8%A1%A5%E7%9B%B2%E6%BF%80%E5%85%89%E9%9B%B7%E8%BE%BE%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-lidar-robosense-ac1", "name": "速腾聚创 Active Camera AC1", "name_en": "RoboSense Active Camera AC1", "category": "sensors", "entity_kind": "component", "manufacturer": "速腾聚创 (RoboSense, 2498.HK)", "type": "LiDAR", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "robot_perception", "amr", "humanoid", "slam" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.45, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E9%80%9F%E8%85%BE%E8%81%9A%E5%88%9B%20(RoboSense%2C%202498.HK)%20%E9%80%9F%E8%85%BE%E8%81%9A%E5%88%9B%20Active%20Camera%20AC1%20datasheet" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-oss-leap-hand", "name": "LEAP Hand 开源灵巧手", "name_en": "LEAP Hand", "category": "actuators", "entity_kind": "component", "manufacturer": "Carnegie Mellon University (CMU Robotics Institute)", "type": "dexterous_hand", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "dexterous_manipulation", "humanoid", "embodied_ai", "research" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.88, "verified": true, "quarantine": false, "source_url": "https://github.com/leap-hand/LEAP_Hand_API" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-oss-ruka-hand", "name": "RUKA Hand 腱绳驱动灵巧手", "name_en": "RUKA Hand", "category": "actuators", "entity_kind": "component", "manufacturer": "New York University (NYU GRAIL / Lerrel Pinto Lab)", "type": "dexterous_hand", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "dexterous_manipulation", "teleoperation", "embodied_ai", "research" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.88, "verified": true, "quarantine": false, "source_url": "https://github.com/ruka-hand/RUKA" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-oss-odri-actuator", "name": "ODRI 开源力控关节模组", "name_en": "Open Dynamic Robot Initiative (ODRI) Actuator Module", "category": "actuators", "entity_kind": "component", "manufacturer": "Open Dynamic Robot Initiative (MPI-IS / NYU / LAAS-CNRS)", "type": "integrated_joint_module", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "legged_robot", "quadruped", "force_control", "research" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.88, "verified": true, "quarantine": false, "source_url": "https://github.com/open-dynamic-robot-initiative/open_robot_actuator_hardware" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-oss-mjbots-moteus", "name": "mjbots moteus 无刷伺服驱动器", "name_en": "mjbots moteus Brushless Servo Controller", "category": "actuators", "entity_kind": "component", "manufacturer": "mjbots Robotic Systems", "type": "BLDC_controller", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "legged_robot", "quadruped", "humanoid", "high_dynamic_actuation" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.88, "verified": true, "quarantine": false, "source_url": "https://github.com/mjbots/moteus" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-oss-vesc", "name": "VESC 开源无刷电机控制器", "name_en": "VESC (Vedder Electronic Speed Controller)", "category": "actuators", "entity_kind": "component", "manufacturer": "Benjamin Vedder (开源社区)", "type": "motor_controller", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "motor_control", "mobile_robot", "amr", "diy_robotics" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.88, "verified": true, "quarantine": false, "source_url": "https://github.com/vedderb/bldc" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-oss-anyskin", "name": "AnySkin 可更换磁性电子皮肤", "name_en": "AnySkin", "category": "sensors", "entity_kind": "component", "manufacturer": "New York University (NYU)", "type": "Electronic Skin", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "tactile_sensing", "dexterous_manipulation", "embodied_ai", "contact_rich_task" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.88, "verified": true, "quarantine": false, "source_url": "https://github.com/raunaqbhirangi/anyskin" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-oss-reskin", "name": "ReSkin 磁性弹性体触觉皮肤", "name_en": "ReSkin", "category": "sensors", "entity_kind": "component", "manufacturer": "Meta AI Research + Carnegie Mellon University", "type": "Electronic Skin", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "tactile_sensing", "slip_detection", "dexterous_manipulation", "research" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.88, "verified": true, "quarantine": false, "source_url": "https://github.com/raunaqbhirangi/reskin_sensor" }, "standards": { "caee060_relevant": true, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "DATA-oss-agibot-world", "name": "AgiBot World 智元开源具身数据集平台", "name_en": "AgiBot World (Colosseo)", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "智元机器人 (AgiBot) + OpenDriveLab", "type": "open_dataset_platform", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "embodied_ai", "vla_training", "imitation_learning", "data_collection" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.88, "verified": true, "quarantine": false, "source_url": "https://github.com/OpenDriveLab/AgiBot-World" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "semi_open" } }, { "id": "RPLAT-oss-open-duck-mini", "name": "Open Duck Mini 开源小型双足平台", "name_en": "Open Duck Mini", "category": "platforms", "entity_kind": "component", "manufacturer": "Open Duck Project (社区开源)", "type": "Open-source bipedal platform", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "biped", "rl_locomotion", "education", "research" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.88, "verified": true, "quarantine": false, "source_url": "https://github.com/apirrone/Open_Duck_Mini" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "RPLAT-oss-reachy2", "name": "Reachy 2 开源人形上身平台", "name_en": "Reachy 2", "category": "platforms", "entity_kind": "component", "manufacturer": "Pollen Robotics (Hugging Face)", "type": "Open-source humanoid platform", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "manipulation", "teleoperation", "research", "education" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.88, "verified": true, "quarantine": false, "source_url": "https://github.com/pollen-robotics/reachy2-sdk" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "XFA-001", "name": "Festo FinGripper", "name_en": "Festo FinGripper", "category": "flexible_actuators", "entity_kind": "component", "manufacturer": "Festo", "type": "finray_gripper", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [ "tactile" ], "modality_details": { "exposed": [ "tactile" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": true, "basis": [ "category:flexible_actuators" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": "https://www.festo.com" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "XFA-002", "name": "Festo BionicSoftHand", "name_en": "Festo BionicSoftHand", "category": "flexible_actuators", "entity_kind": "component", "manufacturer": "Festo", "type": "pneumatic_soft_hand", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [ "tactile" ], "modality_details": { "exposed": [ "tactile" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": true, "basis": [ "category:flexible_actuators" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": "https://www.festo.com" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "XFA-003", "name": "Soft Robotics mGrip", "name_en": "Soft Robotics mGrip", "category": "flexible_actuators", "entity_kind": "component", "manufacturer": "Soft Robotics Inc", "type": "adaptive_gripper", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [ "tactile" ], "modality_details": { "exposed": [ "tactile" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": true, "basis": [ "category:flexible_actuators" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": "https://www.softroboticsinc.com" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "XFA-004", "name": "Soft Robotics uGrip", "name_en": "Soft Robotics uGrip", "category": "flexible_actuators", "entity_kind": "component", "manufacturer": "Soft Robotics Inc", "type": "modular_gripper", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [ "tactile" ], "modality_details": { "exposed": [ "tactile" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": true, "basis": [ "category:flexible_actuators" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.85, "verified": true, "quarantine": false, "source_url": "https://www.softroboticsinc.com" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "XFA-005", "name": "Artimus Robotics HASEL", "name_en": "Artimus Robotics HASEL", "category": "flexible_actuators", "entity_kind": "component", "manufacturer": "Artimus Robotics", "type": "hasel_actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [ "tactile" ], "modality_details": { "exposed": [ "tactile" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": true, "basis": [ "category:flexible_actuators" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.8, "verified": true, "quarantine": false, "source_url": "https://www.artimusrobotics.com" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "XFA-006", "name": "RBO Hand 2", "name_en": "RBO Hand 2", "category": "flexible_actuators", "entity_kind": "component", "manufacturer": "TU Berlin", "type": "pneumatic_soft_hand", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [ "tactile" ], "modality_details": { "exposed": [ "tactile" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": true, "basis": [ "category:flexible_actuators" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.8, "verified": true, "quarantine": false, "source_url": "https://www.tu.berlin" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "XFA-007", "name": "Festo Fluidic Muscle", "name_en": "Festo Fluidic Muscle", "category": "flexible_actuators", "entity_kind": "component", "manufacturer": "Festo", "type": "pneumatic_muscle", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [ "tactile" ], "modality_details": { "exposed": [ "tactile" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": true, "basis": [ "category:flexible_actuators" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": "https://www.festo.com" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "XFA-008", "name": "Twisted String Actuator", "name_en": "Twisted String Actuator", "category": "flexible_actuators", "entity_kind": "component", "manufacturer": "WPI / TSA", "type": "twisted_string", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [ "tactile" ], "modality_details": { "exposed": [ "tactile" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": true, "basis": [ "category:flexible_actuators" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.7, "verified": true, "quarantine": false, "source_url": "https://www.wpi.edu" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "XFA-009", "name": "Flexinol SMA Wire", "name_en": "Flexinol SMA Wire", "category": "flexible_actuators", "entity_kind": "component", "manufacturer": "Dynalloy", "type": "sma_wire", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [ "tactile" ], "modality_details": { "exposed": [ "tactile" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": true, "basis": [ "category:flexible_actuators" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.85, "verified": true, "quarantine": false, "source_url": "https://www.dynalloy.com" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "XFA-010", "name": "PneuNet Soft Gripper", "name_en": "PneuNet Soft Gripper", "category": "flexible_actuators", "entity_kind": "component", "manufacturer": "Cornell / Pneubotics", "type": "pneumatic_bending", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [ "tactile" ], "modality_details": { "exposed": [ "tactile" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": true, "basis": [ "category:flexible_actuators" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.7, "verified": true, "quarantine": false, "source_url": "https://www.cs.cornell.edu" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "XFA-011", "name": "RightHand Reflex", "name_en": "RightHand Reflex", "category": "flexible_actuators", "entity_kind": "component", "manufacturer": "RightHand Robotics", "type": "compliant_gripper", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [ "tactile" ], "modality_details": { "exposed": [ "tactile" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": true, "basis": [ "category:flexible_actuators" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.8, "verified": true, "quarantine": false, "source_url": "https://www.righthandrobotics.com" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "XFA-013", "name": "Empire Robotics Versaball", "name_en": "Empire Robotics Versaball", "category": "flexible_actuators", "entity_kind": "component", "manufacturer": "Empire Robotics", "type": "jamming_gripper", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [ "tactile" ], "modality_details": { "exposed": [ "tactile" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": true, "basis": [ "category:flexible_actuators" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.75, "verified": true, "quarantine": false, "source_url": "https://www.empirerobotics.com" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "XFA-014", "name": "Wyss BionicSoftArm", "name_en": "Wyss BionicSoftArm", "category": "flexible_actuators", "entity_kind": "component", "manufacturer": "Wyss Institute", "type": "pneumatic_soft_arm", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [ "tactile" ], "modality_details": { "exposed": [ "tactile" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": true, "basis": [ "category:flexible_actuators" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.75, "verified": true, "quarantine": false, "source_url": "https://wyss.harvard.edu" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "XFA-015", "name": "Soft Robotics mGripAI", "name_en": "Soft Robotics mGripAI", "category": "flexible_actuators", "entity_kind": "component", "manufacturer": "Soft Robotics Inc", "type": "vision_gripper", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [ "tactile" ], "modality_details": { "exposed": [ "tactile" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": true, "basis": [ "category:flexible_actuators" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.8, "verified": true, "quarantine": false, "source_url": "https://www.softroboticsinc.com" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "XFA-016", "name": "BeSoft Prototype Hand", "name_en": "BeSoft Prototype Hand", "category": "flexible_actuators", "entity_kind": "component", "manufacturer": "BeSoft / 研究", "type": "soft_hand", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [ "tactile" ], "modality_details": { "exposed": [ "tactile" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": true, "basis": [ "category:flexible_actuators" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.6, "verified": true, "quarantine": false, "source_url": "https://besoft.dev" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "XDA-002", "name": "DROID", "name_en": "DROID", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "Stanford", "type": "data_pipeline", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "large_scale", "manipulation" ], "price_range": "varies", "ros_support": null, "modalities": [ "vision" ], "modality_details": { "exposed": [ "vision" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": true, "note": "该零件/系统自带视觉/位姿观测模态（来自 data_modalities）" } }, "evidence": { "source_tier": "A", "confidence": 0.82, "verified": true, "quarantine": false, "source_url": "https://droid.stanford.edu" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "XDA-003", "name": "BridgeData V2", "name_en": "BridgeData V2", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "UC Berkeley", "type": "data_pipeline", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "manipulation", "cross_domain" ], "price_range": "open", "ros_support": null, "modalities": [ "vision" ], "modality_details": { "exposed": [ "vision" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": true, "note": "该零件/系统自带视觉/位姿观测模态（来自 data_modalities）" } }, "evidence": { "source_tier": "B", "confidence": 0.82, "verified": true, "quarantine": false, "source_url": "https://rail.eecs.berkeley.edu" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "XDA-004", "name": "Open X-Embodiment", "name_en": "Open X-Embodiment", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "Google", "type": "data_pipeline", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "cross_embodiment", "base" ], "price_range": "open", "ros_support": null, "modalities": [ "vision" ], "modality_details": { "exposed": [ "vision" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": true, "note": "该零件/系统自带视觉/位姿观测模态（来自 data_modalities）" } }, "evidence": { "source_tier": "B", "confidence": 0.82, "verified": true, "quarantine": false, "source_url": "https://robotics-transformer.github.io" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "XDA-005", "name": "LeRobot", "name_en": "LeRobot", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "Hugging Face", "type": "data_pipeline", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "framework", "imitation" ], "price_range": "open", "ros_support": null, "modalities": [ "vision" ], "modality_details": { "exposed": [ "vision" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": true, "note": "该零件/系统自带视觉/位姿观测模态（来自 data_modalities）" } }, "evidence": { "source_tier": "A", "confidence": 0.82, "verified": true, "quarantine": false, "source_url": "https://github.com/huggingface/lerobot" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "XDA-006", "name": "ARX Teleop", "name_en": "ARX Teleop", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "ARX Robotics", "type": "teleoperation", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "bimanual", "humanoid" ], "price_range": "varies", "ros_support": null, "modalities": [ "vision" ], "modality_details": { "exposed": [ "vision" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": true, "note": "该零件/系统自带视觉/位姿观测模态（来自 data_modalities）" } }, "evidence": { "source_tier": "B", "confidence": 0.82, "verified": true, "quarantine": false, "source_url": "https://www.arxrobotics.com" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "XDA-007", "name": "Puppeteer", "name_en": "Puppeteer", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "Google", "type": "data_pipeline", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "anthropomorphic", "imitation" ], "price_range": "open", "ros_support": null, "modalities": [ "vision" ], "modality_details": { "exposed": [ "vision" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": true, "note": "该零件/系统自带视觉/位姿观测模态（来自 data_modalities）" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": false, "source_url": "https://github.com/google-deepmind/puppeteer" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "XDA-008", "name": "Telekinesis", "name_en": "Telekinesis", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "Google", "type": "data_pipeline", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "vr_teleop" ], "price_range": "open", "ros_support": null, "modalities": [ "vision" ], "modality_details": { "exposed": [ "vision" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": true, "note": "该零件/系统自带视觉/位姿观测模态（来自 data_modalities）" } }, "evidence": { "source_tier": "A", "confidence": 0.3, "verified": false, "quarantine": false, "source_url": "https://github.com/google-deepmind/telekinesis" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "XDA-009", "name": "RH20T", "name_en": "RH20T", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "多家", "type": "data_pipeline", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "large_scale", "humanoid" ], "price_range": "open", "ros_support": null, "modalities": [ "vision" ], "modality_details": { "exposed": [ "vision" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": true, "note": "该零件/系统自带视觉/位姿观测模态（来自 data_modalities）" } }, "evidence": { "source_tier": "A", "confidence": 0.82, "verified": true, "quarantine": false, "source_url": "https://rh20t.github.io" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "XDA-010", "name": "AgiBot World", "name_en": "AgiBot World", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "AgiBot", "type": "data_pipeline", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "large_scale" ], "price_range": "open", "ros_support": null, "modalities": [ "vision" ], "modality_details": { "exposed": [ "vision" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": true, "note": "该零件/系统自带视觉/位姿观测模态（来自 data_modalities）" } }, "evidence": { "source_tier": "A", "confidence": 0.82, "verified": true, "quarantine": false, "source_url": "https://agibot-world.com" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "semi_open" } }, { "id": "XDA-011", "name": "DAgger", "name_en": "DAgger", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "学术", "type": "data_pipeline", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "imitation", "dataset" ], "price_range": "open", "ros_support": null, "modalities": [ "vision" ], "modality_details": { "exposed": [ "vision" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": true, "note": "该零件/系统自带视觉/位姿观测模态（来自 data_modalities）" } }, "evidence": { "source_tier": "B", "confidence": 0.82, "verified": true, "quarantine": false, "source_url": "https://arxiv.org" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "XDA-012", "name": "RT-1", "name_en": "RT-1", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "Google", "type": "data_pipeline", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "manipulation", "base" ], "price_range": "open", "ros_support": null, "modalities": [ "vision" ], "modality_details": { "exposed": [ "vision" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": true, "note": "该零件/系统自带视觉/位姿观测模态（来自 data_modalities）" } }, "evidence": { "source_tier": "B", "confidence": 0.82, "verified": true, "quarantine": false, "source_url": "https://www.deepmind.google" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "XDA-013", "name": "Behavior-1K", "name_en": "Behavior-1K", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "Stanford", "type": "data_pipeline", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "benchmark", "home" ], "price_range": "open", "ros_support": null, "modalities": [ "vision" ], "modality_details": { "exposed": [ "vision" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": true, "note": "该零件/系统自带视觉/位姿观测模态（来自 data_modalities）" } }, "evidence": { "source_tier": "B", "confidence": 0.82, "verified": true, "quarantine": false, "source_url": "https://behavior.stanford.edu" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "XDA-014", "name": "MimicGen", "name_en": "MimicGen", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "NVIDIA", "type": "data_pipeline", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "synthetic", "imitation" ], "price_range": "open", "ros_support": null, "modalities": [ "vision" ], "modality_details": { "exposed": [ "vision" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": true, "note": "该零件/系统自带视觉/位姿观测模态（来自 data_modalities）" } }, "evidence": { "source_tier": "A", "confidence": 0.82, "verified": true, "quarantine": false, "source_url": "https://mimicgen.github.io" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "XDA-015", "name": "RoboSet", "name_en": "RoboSet", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "MIT", "type": "data_pipeline", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "manipulation", "base" ], "price_range": "open", "ros_support": null, "modalities": [ "vision" ], "modality_details": { "exposed": [ "vision" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": true, "note": "该零件/系统自带视觉/位姿观测模态（来自 data_modalities）" } }, "evidence": { "source_tier": "B", "confidence": 0.82, "verified": true, "quarantine": false, "source_url": "https://robocasa.ai" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "XDA-016", "name": "HITL Teleop", "name_en": "HITL Teleop", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "多家", "type": "teleoperation", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "human_in_loop" ], "price_range": "varies", "ros_support": null, "modalities": [ "vision" ], "modality_details": { "exposed": [ "vision" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": true, "note": "该零件/系统自带视觉/位姿观测模态（来自 data_modalities）" } }, "evidence": { "source_tier": "B", "confidence": 0.82, "verified": true, "quarantine": false, "source_url": "https://arxiv.org" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "XDA-017", "name": "Surface Teleop", "name_en": "Surface Teleop", "category": "data_acquisition", "entity_kind": "component", "manufacturer": "多家", "type": "teleoperation", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "tactile", "imitation" ], "price_range": "open", "ros_support": null, "modalities": [ "tactile", "vision" ], "modality_details": { "exposed": [ "tactile", "vision" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": true, "basis": [ "data_modalities:touch" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": true, "note": "该零件/系统自带视觉/位姿观测模态（来自 data_modalities）" } }, "evidence": { "source_tier": "B", "confidence": 0.82, "verified": true, "quarantine": false, "source_url": "https://arxiv.org" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "XPLT-001", "name": "Agility Digit", "name_en": "Agility Digit", "category": "platforms", "entity_kind": "component", "manufacturer": "Agility Robotics", "type": "humanoid", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": "varies", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.85, "verified": true, "quarantine": false, "source_url": "https://www.agilityrobotics.com" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "XPLT-002", "name": "Apptronik Apollo", "name_en": "Apptronik Apollo", "category": "platforms", "entity_kind": "component", "manufacturer": "Apptronik", "type": "humanoid", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": "varies", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.85, "verified": true, "quarantine": false, "source_url": "https://apptronik.com" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "XPLT-005", "name": "Sanctuary Phoenix", "name_en": "Sanctuary Phoenix", "category": "platforms", "entity_kind": "component", "manufacturer": "Sanctuary AI", "type": "humanoid", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": "varies", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.85, "verified": true, "quarantine": false, "source_url": "https://www.sanctuary.ai" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "XPLT-006", "name": "1X NEO", "name_en": "1X NEO", "category": "platforms", "entity_kind": "component", "manufacturer": "1X Technologies", "type": "humanoid", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": "varies", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.85, "verified": true, "quarantine": false, "source_url": "https://www.1x.tech" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "XPLT-007", "name": "Fourier GR-1", "name_en": "Fourier GR-1", "category": "platforms", "entity_kind": "component", "manufacturer": "Fourier Intelligence", "type": "humanoid", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": "varies", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.85, "verified": true, "quarantine": false, "source_url": "https://www.fourierintelligence.com" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "XPLT-008", "name": "Fourier GR-2", "name_en": "Fourier GR-2", "category": "platforms", "entity_kind": "component", "manufacturer": "Fourier Intelligence", "type": "humanoid", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": "varies", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.85, "verified": true, "quarantine": false, "source_url": "https://www.fourierintelligence.com" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "XPLT-009", "name": "UBTech Walker S", "name_en": "UBTech Walker S", "category": "platforms", "entity_kind": "component", "manufacturer": "UBTech", "type": "humanoid", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": "varies", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.85, "verified": true, "quarantine": false, "source_url": "https://www.ubtrobot.com" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "XPLT-010", "name": "Xiaomi CyberOne", "name_en": "Xiaomi CyberOne", "category": "platforms", "entity_kind": "component", "manufacturer": "Xiaomi", "type": "humanoid", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": "varies", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.85, "verified": true, "quarantine": false, "source_url": "https://www.mi.com" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "XPLT-011", "name": "Unitree H1", "name_en": "Unitree H1", "category": "platforms", "entity_kind": "component", "manufacturer": "Unitree", "type": "humanoid", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": "varies", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.85, "verified": true, "quarantine": false, "source_url": "https://www.unitree.com" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "semi_open" } }, { "id": "XPLT-013", "name": "Neura 4NE-1", "name_en": "Neura 4NE-1", "category": "platforms", "entity_kind": "component", "manufacturer": "Neura Robotics", "type": "humanoid", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": "varies", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.85, "verified": true, "quarantine": false, "source_url": "https://neura-robotics.com" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "XPLT-015", "name": "LimX Dynamics", "name_en": "LimX Dynamics", "category": "platforms", "entity_kind": "component", "manufacturer": "LimX", "type": "humanoid", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": "varies", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.85, "verified": true, "quarantine": false, "source_url": "https://www.limxdynamics.com" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "XPLT-016", "name": "PNDbotics Adam", "name_en": "PNDbotics Adam", "category": "platforms", "entity_kind": "component", "manufacturer": "PNDbotics", "type": "humanoid", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": "varies", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.85, "verified": true, "quarantine": false, "source_url": "https://www.pndbotics.com" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "XPLT-017", "name": "Booster Robotics T1", "name_en": "Booster Robotics T1", "category": "platforms", "entity_kind": "component", "manufacturer": "Booster Robotics", "type": "humanoid", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": "varies", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.85, "verified": true, "quarantine": false, "source_url": "https://www.booster Robotics.com" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "XPLT-018", "name": "Robotera Star1", "name_en": "Robotera Star1", "category": "platforms", "entity_kind": "component", "manufacturer": "Robotera", "type": "humanoid", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": "varies", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.85, "verified": true, "quarantine": false, "source_url": "https://www.robotera.com" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "multi_protocol" } }, { "id": "BRG-crb-thk-rb", "name": "THK RB 系列交叉滚子环 (Crossed Roller Ring)", "name_en": "THK RB 系列交叉滚子环 (Crossed Roller Ring)", "category": "actuators", "entity_kind": "component", "manufacturer": "THK", "type": "crossed_roller_bearing", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "harmonic_joint", "robot_arm", "rotary_table" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.88, "verified": true, "quarantine": false, "source_url": "https://www.thk.com" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "BRG-crb-iko-crbf", "name": "IKO CRBF 系列交叉滚子轴承 (Crossed Roller Bearing)", "name_en": "IKO CRBF 系列交叉滚子轴承 (Crossed Roller Bearing)", "category": "actuators", "entity_kind": "component", "manufacturer": "IKO 日本トムソン", "type": "crossed_roller_bearing", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "robot_joint", "index_table", "manipulator" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.86, "verified": true, "quarantine": false, "source_url": "https://www.ikont.co.jp" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "BRG-crb-hiwin", "name": "HIWIN CRB 系列交叉滚子轴承", "name_en": "HIWIN CRB 系列交叉滚子轴承", "category": "actuators", "entity_kind": "component", "manufacturer": "HIWIN 上银科技", "type": "crossed_roller_bearing", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "robot_joint", "harmonic_joint" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.85, "verified": true, "quarantine": false, "source_url": "https://www.hiwin.tw" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "LUB-hd-grease-sk", "name": "Harmonic Grease SK-1A 谐波减速器专用润滑脂", "name_en": "Harmonic Grease SK-1A 谐波减速器专用润滑脂", "category": "actuators", "entity_kind": "component", "manufacturer": "Harmonic Drive Systems", "type": "reducer_grease", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "harmonic_reducer", "robot_joint", "maintenance" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.87, "verified": true, "quarantine": false, "source_url": "https://www.harmonicdrive.net" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "LUB-nabtesco-vigo-re0", "name": "Nabtesco Vigo Grease RE0 (RV 减速器润滑脂)", "name_en": "Nabtesco Vigo Grease RE0 (RV 减速器润滑脂)", "category": "actuators", "entity_kind": "component", "manufacturer": "Nabtesco 纳博特斯克", "type": "reducer_grease", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "rv_reducer", "industrial_robot", "maintenance" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.86, "verified": true, "quarantine": false, "source_url": "https://www.nabtesco.com" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SEAL-klueber-nbu15", "name": "Klüber Isoflex NBU 15 高速轴承润滑脂", "name_en": "Klüber Isoflex NBU 15 高速轴承润滑脂", "category": "actuators", "entity_kind": "component", "manufacturer": "Klüber Lubrication", "type": "bearing_grease", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "bearing", "ball_screw", "robot_joint" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.84, "verified": true, "quarantine": false, "source_url": "https://www.klueber.com" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "GBX-neugart-ple", "name": "Neugart PLE 系列行星减速器", "name_en": "Neugart PLE 系列行星减速器", "category": "actuators", "entity_kind": "component", "manufacturer": "Neugart", "type": "planetary_gearbox", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "servo_drive", "robot_joint", "automation" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.87, "verified": true, "quarantine": false, "source_url": "https://www.neugart.com" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "GBX-wittenstein-tp", "name": "WITTENSTEIN alpha TP+ 行星减速器", "name_en": "WITTENSTEIN alpha TP+ 行星减速器", "category": "actuators", "entity_kind": "component", "manufacturer": "WITTENSTEIN", "type": "planetary_gearbox", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "precision_robot", "robot_joint", "machine_tool" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.86, "verified": true, "quarantine": false, "source_url": "https://www.wittenstein.de" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "GBX-shimpo-vrs", "name": "Nidec-Shimpo VRS 系列行星减速器", "name_en": "Nidec-Shimpo VRS 系列行星减速器", "category": "actuators", "entity_kind": "component", "manufacturer": "Nidec-Shimpo 日本电产新宝", "type": "planetary_gearbox", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "servo_drive", "manipulator", "rotary_table" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.85, "verified": true, "quarantine": false, "source_url": "https://www.shimpodrives.com" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "LIN-ewellix-casm", "name": "Ewellix CASM 系列电动缸 (Linear Actuator)", "name_en": "Ewellix CASM 系列电动缸 (Linear Actuator)", "category": "actuators", "entity_kind": "component", "manufacturer": "Ewellix", "type": "electric_linear_actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid_leg", "industrial_press", "linear_drive" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.86, "verified": true, "quarantine": false, "source_url": "https://www.ewellix.com" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "LIN-tolomatic-erd", "name": "Tolomatic ERD 系列电动直线执行器", "name_en": "Tolomatic ERD 系列电动直线执行器", "category": "actuators", "entity_kind": "component", "manufacturer": "Tolomatic", "type": "electric_linear_actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "linear_drive", "automation", "pneumatic_replacement" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.85, "verified": true, "quarantine": false, "source_url": "https://www.tolomatic.com" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "LIN-iai-rcp6", "name": "IAI ROBO Cylinder RCP6 电动直线执行器", "name_en": "IAI ROBO Cylinder RCP6 电动直线执行器", "category": "actuators", "entity_kind": "component", "manufacturer": "IAI Corporation", "type": "electric_linear_actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "assembly", "pick_place", "linear_drive" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.85, "verified": true, "quarantine": false, "source_url": "https://www.iai-robot.co.jp" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "MAT-flexspline-42crmo", "name": "42CrMo 合金结构钢（谐波减速器柔轮用）", "name_en": "42CrMo 合金结构钢（谐波减速器柔轮用）", "category": "actuators", "entity_kind": "component", "manufacturer": "GB/T 3077 标准牌号", "type": "flexspline_material", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "harmonic_reducer", "flexspline", "material" ], "price_range": null, "ros_support": null, "modalities": [ "tactile" ], "modality_details": { "exposed": [ "tactile" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": true, "basis": [ "material_note" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.7, "verified": true, "quarantine": false, "source_url": "https://openstd.samr.gov.cn" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "MAT-flexspline-30crmnsia", "name": "30CrMnSiA 合金结构钢（柔轮/高应力构件用）", "name_en": "30CrMnSiA 合金结构钢（柔轮/高应力构件用）", "category": "actuators", "entity_kind": "component", "manufacturer": "GB/T 3077 标准牌号", "type": "flexspline_material", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "harmonic_reducer", "flexspline", "material" ], "price_range": null, "ros_support": null, "modalities": [ "tactile" ], "modality_details": { "exposed": [ "tactile" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": true, "basis": [ "material_note" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.65, "verified": true, "quarantine": false, "source_url": "https://openstd.samr.gov.cn" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "TDN-dyneema-sk75", "name": "Dyneema SK75 超高分子量聚乙烯纤维（腱绳传动用）", "name_en": "Dyneema SK75 超高分子量聚乙烯纤维（腱绳传动用）", "category": "actuators", "entity_kind": "component", "manufacturer": "Avient / DSM Dyneema", "type": "tendon_cable", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "dexterous_hand", "tendon_drive", "exoskeleton" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.85, "verified": true, "quarantine": false, "source_url": "https://www.dyneema.com" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "TDN-sava-cable", "name": "Sava Industries 微型钢丝绳（腱绳/tendon 传动）", "name_en": "Sava Industries 微型钢丝绳（腱绳/tendon 传动）", "category": "actuators", "entity_kind": "component", "manufacturer": "Sava Industries", "type": "tendon_cable", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "dexterous_hand", "tendon_drive", "surgical_robot" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.78, "verified": true, "quarantine": false, "source_url": "https://savacable.com" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "MOT-maxon-re25", "name": "maxon RE 25 空心杯直流电机 (Coreless DC Motor)", "name_en": "maxon RE 25 空心杯直流电机 (Coreless DC Motor)", "category": "actuators", "entity_kind": "component", "manufacturer": "maxon group", "type": "coreless_dc_motor", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "dexterous_hand", "micro_joint", "precision_drive" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.88, "verified": true, "quarantine": false, "source_url": "https://www.maxongroup.com" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "MOT-faulhaber-1741cxr", "name": "FAULHABER 1741...CXR 空心杯微电机", "name_en": "FAULHABER 1741...CXR 空心杯微电机", "category": "actuators", "entity_kind": "component", "manufacturer": "FAULHABER", "type": "coreless_dc_motor", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "prosthetics", "dexterous_hand", "micro_actuator" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.87, "verified": true, "quarantine": false, "source_url": "https://www.faulhaber.com" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CONN-molex-minimix", "name": "Molex MiniMix 混装电源信号连接器", "name_en": "Molex MiniMix Hybrid Power and Signal Connectors", "category": "connectors", "entity_kind": "component", "manufacturer": "Molex", "type": "hybrid_connector", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": "1000BASE-T1", "interface": null, "position_resolution": null }, "applications": [ "humanoid_joint", "actuator", "amr", "industrial_automation" ], "price_range": null, "ros_support": null, "modalities": [ "electrical" ], "modality_details": { "exposed": [ "electrical" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": true, "voltage_range": null, "protocols": [ "1000BASE-T1" ] }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.8, "verified": true, "quarantine": false, "source_url": "https://www.prnewswire.com/news-releases/molex-introduces-minimix-hybrid-power-and-signal-connectors-to-accelerate-humanoid-robotics-mass-production-scaling-302843651.html" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "other", "ros2": null, "interop_posture": "unknown" } }, { "id": "CONN-molex-mirror-mezz", "name": "Molex Mirror Mezz 夹层连接器", "name_en": "Molex Mirror Mezz Mezzanine Connectors", "category": "connectors", "entity_kind": "component", "manufacturer": "Molex", "type": "mezzanine_connector", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "ai_compute_module", "humanoid_robot" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.7, "verified": true, "quarantine": false, "source_url": "https://www.prnewswire.com/news-releases/molex-introduces-minimix-hybrid-power-and-signal-connectors-to-accelerate-humanoid-robotics-mass-production-scaling-302843651.html" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "IJ-MATRIX-1", "name": "Matrix 一体化关节模组 (MATRIX-1/3)", "name_en": "Matrix Integrated Joint Module (MATRIX-1/3)", "category": "integrated_joints", "entity_kind": "component", "manufacturer": "矩阵超智", "type": "integrated_joint_module", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid" ], "price_range": "varies", "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": "https://www.google.com/search?q=%E7%9F%A9%E9%98%B5%E8%B6%85%E6%99%BA%20Matrix%20%E4%B8%80%E4%BD%93%E5%8C%96%E5%85%B3%E8%8A%82%E6%A8%A1%E7%BB%84%20(MATRIX-1%2F3)%20datasheet" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "RED-001", "name": "Harmonic Drive CSF/SHF Series", "name_en": "Harmonic Drive CSF/SHF Series", "category": "reducers", "entity_kind": "component", "manufacturer": "Harmonic Drive LLC", "type": "strain_wave_gear", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "manipulator", "semiconductor", "medical", "aerospace" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.7, "verified": true, "quarantine": false, "source_url": "https://harmonicdrive.net/products/gear-units" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "RED-002", "name": "Nabtesco RV Reducer", "name_en": "Nabtesco RV Reducer", "category": "reducers", "entity_kind": "component", "manufacturer": "Nabtesco", "type": "cycloidal_pin_reducer", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "industrial_robot", "manipulator", "humanoid" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.7, "verified": true, "quarantine": false, "source_url": "https://www.nabtesco-motion.cn/cn/products/introduction/" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "RED-003", "name": "Leaderdrive 绿的谐波 Strain Wave Gears", "name_en": "Leaderdrive Strain Wave Gears", "category": "reducers", "entity_kind": "component", "manufacturer": "Leaderdrive (绿的谐波)", "type": "strain_wave_gear", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "manipulator", "industrial_robot" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.65, "verified": true, "quarantine": false, "source_url": "https://www.leaderdrive.com/about.html" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CTRL-001", "name": "ODrive Pro", "name_en": "ODrive Pro", "category": "controllers", "entity_kind": "component", "manufacturer": "ODrive Robotics", "type": "servo_motor_controller", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "manipulator", "exoskeleton", "mobile_robot", "humanoid" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.8, "verified": true, "quarantine": false, "source_url": "https://odriverobotics.com/shop/odrive-pro" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CTRL-002", "name": "CubeMars AK80-64", "name_en": "CubeMars AK80-64", "category": "controllers", "entity_kind": "component", "manufacturer": "CubeMars", "type": "integrated_actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "quadruped", "exoskeleton", "cobot" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.8, "verified": true, "quarantine": false, "source_url": "https://cubemars.com/cn/product/ak80-64-kv80-robotic-actuator.html" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CTRL-003", "name": "Roboteq Motor Controller", "name_en": "Roboteq Motor Controller", "category": "controllers", "entity_kind": "component", "manufacturer": "Roboteq", "type": "motor_controller", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "mobile_robot", "AGV", "cobot" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": "https://www.roboteq.com" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "GRIP-001", "name": "OnRobot 2FG7", "name_en": "OnRobot 2FG7", "category": "grippers", "entity_kind": "component", "manufacturer": "OnRobot", "type": "electric_parallel_gripper", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "machine_tending", "material_handling", "cleanroom" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.85, "verified": true, "quarantine": false, "source_url": "https://onrobot.com/en/products/2fg7" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "GRIP-002", "name": "Robotiq 2F-85", "name_en": "Robotiq 2F-85", "category": "grippers", "entity_kind": "component", "manufacturer": "Robotiq", "type": "adaptive_gripper", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "pick_and_place", "machine_tending", "assembly", "quality_testing" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.85, "verified": true, "quarantine": false, "source_url": "https://robotiq.com/products/2f85-140-adaptive-robot-gripper" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "GRIP-003", "name": "SCHUNK EGP", "name_en": "SCHUNK EGP", "category": "grippers", "entity_kind": "component", "manufacturer": "SCHUNK", "type": "electric_parallel_gripper", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "pick_and_place", "assembly", "electronics_handling", "lab_automation" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.8, "verified": true, "quarantine": false, "source_url": "https://schunk.com/gb_en/gripping-systems/series/egp/" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "GRIP-004", "name": "DH Robotics 大寰 Electric Gripper", "name_en": "DH Robotics Electric Gripper", "category": "grippers", "entity_kind": "component", "manufacturer": "DH Robotics (大寰)", "type": "electric_gripper", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "machine_tending", "3c_assembly", "lab_automation" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.55, "verified": false, "quarantine": false, "source_url": "http://dh-robotics.com/" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "STR-001", "name": "MISUMI Aluminum Extrusion", "name_en": "MISUMI Aluminum Extrusion", "category": "structural", "entity_kind": "component", "manufacturer": "MISUMI", "type": "aluminum_extrusion", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "frame", "enclosure", "workstation", "fixture" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.7, "verified": true, "quarantine": false, "source_url": "https://www.misumi.com.cn/vona2/detail/110302368740/" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "STR-002", "name": "80/20 T-slot Framing", "name_en": "80/20 T-slot Framing", "category": "structural", "entity_kind": "component", "manufacturer": "80/20 Inc", "type": "aluminum_extrusion", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "frame", "enclosure", "guard", "fixture" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.6, "verified": true, "quarantine": false, "source_url": "https://8020.net" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "STR-003", "name": "item MB Building Kit", "name_en": "item MB Building Kit System", "category": "structural", "entity_kind": "component", "manufacturer": "item Industrietechnik", "type": "aluminum_profile_system", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "frame", "workstation", "automation_structure" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.6, "verified": true, "quarantine": false, "source_url": "https://www.item24.com" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CAB-001", "name": "igus chainflex Robot Cable", "name_en": "igus chainflex Robot Cable", "category": "cables", "entity_kind": "component", "manufacturer": "igus", "type": "robot_cable", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "robot_dress_pack", "cable_chain", "multi_axis" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.75, "verified": true, "quarantine": false, "source_url": "https://www.igus.com/cables/motor-cables" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CAB-002", "name": "LEONI Robot Cable", "name_en": "LEONI Robot Cable", "category": "cables", "entity_kind": "component", "manufacturer": "LEONI", "type": "robot_cable", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "robot_dress_pack", "cable_chain" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.5, "verified": false, "quarantine": false, "source_url": "https://www.leoni.com" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "PWR-001", "name": "Tattu/Grepow Smart LiPo Battery", "name_en": "Tattu/Grepow Smart LiPo Battery", "category": "power", "entity_kind": "component", "manufacturer": "Tattu (Grepow)", "type": "smart_lipo_battery", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "UGV", "drone", "mobile_robot", "payload" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.7, "verified": true, "quarantine": false, "source_url": "https://www.grepow.com/products.html" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "PWR-002", "name": "MEAN WELL Industrial PSU", "name_en": "MEAN WELL Industrial Power Supply", "category": "power", "entity_kind": "component", "manufacturer": "MEAN WELL", "type": "power_supply", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "controller_power", "actuator_power", "enclosure" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.6, "verified": true, "quarantine": false, "source_url": "https://www.meanwell.com" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "PCB-001", "name": "SimpleFOC Board", "name_en": "SimpleFOC Board", "category": "pcb", "entity_kind": "component", "manufacturer": "SimpleFOC", "type": "foc_driver_board", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "bldc_control", "actuator_control", "prototyping" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.6, "verified": true, "quarantine": false, "source_url": "https://www.simplefoc.com" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "PCB-002", "name": "PCBWay Robotics PCB Fabrication", "name_en": "PCBWay Robotics PCB Fabrication", "category": "pcb", "entity_kind": "component", "manufacturer": "PCBWay", "type": "pcb_fabrication_service", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "driver_board", "control_pcb", "prototyping" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.6, "verified": true, "quarantine": false, "source_url": "https://www.pcbway.com" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "PRIMA1-HAND-001", "name": "Prima1 Dexterous Hand", "name_en": "Prima1 Dexterous Hand", "category": "grippers", "entity_kind": "component", "manufacturer": "Xynova", "type": "dexterous_hand", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "precision_manipulation", "industrial_assembly", "research", "humanoid_robotics" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.7, "verified": true, "quarantine": false, "source_url": "https://nnets.ru/news/robotizirovannaja-kist-prima1-ot-xynova-poluchila-22-stepeni-svobody" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "DEXHAND021PRO-001", "name": "DexHand021 Pro", "name_en": "DexHand021 Pro", "category": "grippers", "entity_kind": "component", "manufacturer": "DexRobot", "type": "dexterous_hand", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "industrial_manipulation", "research", "humanoid_robotics" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.85, "verified": true, "quarantine": false, "source_url": "https://www.prnewswire.com/news-releases/dexrobot-unveils-full-dexterous-hand-series-and-new-dextele-teleoperation-system-at-automate-2026-302808579.html" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "NEO-HAND-001", "name": "NEO 25-DoF Hand", "name_en": "NEO 25-DoF Hand", "category": "grippers", "entity_kind": "component", "manufacturer": "1X Technologies", "type": "dexterous_hand", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid_robotics", "household_tasks", "food_handling", "research" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": "https://www.1x.tech/discover/neos-hands" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "PROHAND-001", "name": "ProHand 1.0", "name_en": "ProHand 1.0", "category": "grippers", "entity_kind": "component", "manufacturer": "Proception", "type": "dexterous_hand", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "research", "data_collection", "humanoid_robotics" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.85, "verified": true, "quarantine": false, "source_url": "https://www.proception.ai/news/introducing-prohand" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "BIONIC-JOINT-001", "name": "球窝仿生关节", "name_en": "Ball-and-Socket Bionic Joint", "category": "bionic_mechanisms", "entity_kind": "component", "manufacturer": "RoboParts", "type": "bionic_joint", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid_upper_limb", "humanoid_lower_limb", "prosthetics" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.6, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "BIONIC-JOINT-002", "name": "铰链仿生关节", "name_en": "Hinge Bionic Joint", "category": "bionic_mechanisms", "entity_kind": "component", "manufacturer": "RoboParts", "type": "bionic_joint", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid_knee", "humanoid_elbow", "exoskeleton" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.6, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "BIONIC-JOINT-003", "name": "滑车仿生关节", "name_en": "Gliding Bionic Joint", "category": "bionic_mechanisms", "entity_kind": "component", "manufacturer": "RoboParts", "type": "bionic_joint", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "dexterous_hand", "prosthetic_finger", "micro_manipulation" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.6, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "BIONIC-ACTUATOR-001", "name": "肌腱驱动仿生驱动器", "name_en": "Tendon-Driven Bionic Actuator", "category": "bionic_mechanisms", "entity_kind": "component", "manufacturer": "RoboParts", "type": "bionic_actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "dexterous_hand", "flexible_manipulator", "prosthetics" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.6, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "BIONIC-ACTUATOR-002", "name": "人工肌肉驱动器", "name_en": "Artificial Muscle Actuator", "category": "bionic_mechanisms", "entity_kind": "component", "manufacturer": "RoboParts", "type": "bionic_actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid_body", "exoskeleton", "rehabilitation" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.6, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "BIONIC-SENSOR-001", "name": "电子皮肤传感器", "name_en": "Electronic Skin Sensor", "category": "bionic_mechanisms", "entity_kind": "component", "manufacturer": "RoboParts", "type": "bionic_sensor", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid_skin", "prosthetic_sensory", "collaborative_robot" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.6, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "BIONIC-SENSOR-002", "name": "仿生本体感觉传感器", "name_en": "Bionic Proprioception Sensor", "category": "bionic_mechanisms", "entity_kind": "component", "manufacturer": "RoboParts", "type": "bionic_sensor", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "joint_control", "force_feedback", "balance_control" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.6, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "BIONIC-FRAME-001", "name": "仿生骨骼框架", "name_en": "Bionic Skeleton Frame", "category": "bionic_mechanisms", "entity_kind": "component", "manufacturer": "RoboParts", "type": "bionic_frame", "specs": { "torque": null, "speed": null, "weight": "2.5kg", "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid_torso", "robot_frame", "exoskeleton" ], "price_range": null, "ros_support": null, "modalities": [ "force" ], "modality_details": { "exposed": [ "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": 2.5, "force_control_precision_nm": null, "basis": [ "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.6, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "BIONIC-SKIN-001", "name": "仿生皮肤覆盖层", "name_en": "Bionic Skin Cover", "category": "bionic_mechanisms", "entity_kind": "component", "manufacturer": "RoboParts", "type": "bionic_skin", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid_appearance", "prosthetic_cover", "social_robot" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.6, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "REDUCER-HD-25", "name": "Harmonic Drive CSF-25-100-H-D", "name_en": "Harmonic Drive CSF-25-100-H-D", "category": "reducers", "entity_kind": "component", "manufacturer": "Harmonic Drive", "type": "harmonic_gear", "specs": { "torque": null, "speed": null, "weight": 0.5, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "robotics_joint", "precision_positioning" ], "price_range": "¥3000-8000", "ros_support": null, "modalities": [ "geometric", "force" ], "modality_details": { "exposed": [ "geometric", "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "REDUCER-HD-32", "name": "Harmonic Drive CSF-32-100-H-D", "name_en": "Harmonic Drive CSF-32-100-H-D", "category": "reducers", "entity_kind": "component", "manufacturer": "Harmonic Drive", "type": "harmonic_gear", "specs": { "torque": null, "speed": null, "weight": 1.1, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "robotics_joint", "industrial_automation" ], "price_range": "¥5000-12000", "ros_support": null, "modalities": [ "geometric", "force" ], "modality_details": { "exposed": [ "geometric", "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "REDUCER-HD-50", "name": "Harmonic Drive CSF-50-100-H-D", "name_en": "Harmonic Drive CSF-50-100-H-D", "category": "reducers", "entity_kind": "component", "manufacturer": "Harmonic Drive", "type": "harmonic_gear", "specs": { "torque": null, "speed": null, "weight": 3.5, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "heavy_duty_robotics", "industrial_automation" ], "price_range": "¥10000-25000", "ros_support": null, "modalities": [ "geometric", "force" ], "modality_details": { "exposed": [ "geometric", "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "REDUCER-GH-25", "name": "Green Harmonic GH25-100-H-D", "name_en": "Green Harmonic GH25-100-H-D", "category": "reducers", "entity_kind": "component", "manufacturer": "Green Harmonic (绿的谐波)", "type": "harmonic_gear", "specs": { "torque": null, "speed": null, "weight": 0.4, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "robotics_joint", "domestic_substitution" ], "price_range": "¥1500-4000", "ros_support": null, "modalities": [ "geometric", "force" ], "modality_details": { "exposed": [ "geometric", "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.85, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "REDUCER-GH-50", "name": "Green Harmonic GH50-100-H-D", "name_en": "Green Harmonic GH50-100-H-D", "category": "reducers", "entity_kind": "component", "manufacturer": "Green Harmonic (绿的谐波)", "type": "harmonic_gear", "specs": { "torque": null, "speed": null, "weight": 2.8, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "heavy_duty_robotics", "domestic_substitution" ], "price_range": "¥5000-12000", "ros_support": null, "modalities": [ "geometric", "force" ], "modality_details": { "exposed": [ "geometric", "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.85, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "REDUCER-RV-50", "name": "Nabtesco RV-50CE", "name_en": "Nabtesco RV-50CE", "category": "reducers", "entity_kind": "component", "manufacturer": "Nabtesco", "type": "rv_gear", "specs": { "torque": null, "speed": null, "weight": 8, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "industrial_robot_base_joint", "heavy_duty" ], "price_range": "¥15000-35000", "ros_support": null, "modalities": [ "geometric", "force" ], "modality_details": { "exposed": [ "geometric", "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.85, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "REDUCER-RV-200", "name": "Nabtesco RV-200FS", "name_en": "Nabtesco RV-200FS", "category": "reducers", "entity_kind": "component", "manufacturer": "Nabtesco", "type": "rv_gear", "specs": { "torque": null, "speed": null, "weight": 25, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "industrial_robot_base_joint", "heavy_duty" ], "price_range": "¥40000-80000", "ros_support": null, "modalities": [ "geometric", "force" ], "modality_details": { "exposed": [ "geometric", "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.85, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "REDUCER-LIF-60", "name": "来福 LIF-60RV-C", "name_en": "Lif-drive LIF-60RV-C", "category": "reducers", "entity_kind": "component", "manufacturer": "来福 (Lif-drive)", "type": "rv_gear", "specs": { "torque": null, "speed": null, "weight": 7.5, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "industrial_robot_base_joint", "domestic_substitution" ], "price_range": "¥8000-18000", "ros_support": null, "modalities": [ "geometric", "force" ], "modality_details": { "exposed": [ "geometric", "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [ "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.8, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "GRIPPER-ONR-VG1", "name": "OnRobot VG1 气动夹爪", "name_en": "OnRobot VG1 Vacuum Gripper", "category": "grippers", "entity_kind": "component", "manufacturer": "OnRobot", "type": "vacuum_gripper", "specs": { "torque": null, "speed": null, "weight": null, "voltage": "24V", "protocol": "IO_Link", "interface": null, "position_resolution": null }, "applications": [ "pick_and_place", "lightweight_parts" ], "price_range": "¥3000-6000", "ros_support": null, "modalities": [ "geometric", "electrical" ], "modality_details": { "exposed": [ "geometric", "electrical" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": true, "voltage_range": [ 24, 24 ], "protocols": [ "IO_Link" ] }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "other", "ros2": null, "interop_posture": "unknown" } }, { "id": "GRIPPER-ONR-NG1", "name": "OnRobot NG10 电动夹爪", "name_en": "OnRobot NG10 Robotic Gripper", "category": "grippers", "entity_kind": "component", "manufacturer": "OnRobot", "type": "electric_parallel_gripper", "specs": { "torque": null, "speed": null, "weight": null, "voltage": "24V", "protocol": "EtherCAT", "interface": null, "position_resolution": null }, "applications": [ "pick_and_place", "assembly" ], "price_range": "¥15000-30000", "ros_support": null, "modalities": [ "geometric", "electrical" ], "modality_details": { "exposed": [ "geometric", "electrical" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": true, "voltage_range": [ 24, 24 ], "protocols": [ "EtherCAT" ] }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "EtherCAT", "ros2": null, "interop_posture": "unknown" } }, { "id": "GRIPPER-ONR-NG30", "name": "OnRobot NG30 电动夹爪", "name_en": "OnRobot NG30 Robotic Gripper", "category": "grippers", "entity_kind": "component", "manufacturer": "OnRobot", "type": "electric_parallel_gripper", "specs": { "torque": null, "speed": null, "weight": null, "voltage": "24V", "protocol": "EtherCAT", "interface": null, "position_resolution": null }, "applications": [ "heavy_duty_pick_and_place", "industrial" ], "price_range": "¥25000-50000", "ros_support": null, "modalities": [ "geometric", "electrical" ], "modality_details": { "exposed": [ "geometric", "electrical" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": true, "voltage_range": [ 24, 24 ], "protocols": [ "EtherCAT" ] }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.9, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "EtherCAT", "ros2": null, "interop_posture": "unknown" } }, { "id": "GRIPPER-SCHUNK-SWG15", "name": "Schunk SWG 15 气动夹爪", "name_en": "Schunk SWG 15 Parallel Gripper", "category": "grippers", "entity_kind": "component", "manufacturer": "Schunk", "type": "pneumatic_parallel_gripper", "specs": { "torque": null, "speed": null, "weight": null, "voltage": "pneumatic", "protocol": "pneumatic", "interface": null, "position_resolution": null }, "applications": [ "industrial_pick_and_place" ], "price_range": "¥5000-12000", "ros_support": null, "modalities": [ "geometric", "electrical" ], "modality_details": { "exposed": [ "geometric", "electrical" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": true, "voltage_range": null, "protocols": [ "pneumatic" ] }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.85, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "other", "ros2": null, "interop_posture": "unknown" } }, { "id": "GRIPPER-POS-2F20", "name": "正实 2F-20 电动夹爪", "name_en": "ZhenShi 2F-20 Electric Gripper", "category": "grippers", "entity_kind": "component", "manufacturer": "正实机器人", "type": "electric_parallel_gripper", "specs": { "torque": null, "speed": null, "weight": null, "voltage": "24V", "protocol": "Modbus", "interface": null, "position_resolution": null }, "applications": [ "robotics", "domestic_substitution" ], "price_range": "¥3000-8000", "ros_support": null, "modalities": [ "geometric", "electrical" ], "modality_details": { "exposed": [ "geometric", "electrical" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [] }, "electrical": { "declared": true, "voltage_range": [ 24, 24 ], "protocols": [ "Modbus" ] }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.85, "verified": true, "quarantine": false, "source_url": null }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "Modbus", "ros2": null, "interop_posture": "unknown" } }, { "id": "XFA-017", "name": "UNIST Magnetic Composite Artificial Muscle", "name_en": "UNIST Magnetic Composite Artificial Muscle", "category": "flexible_actuators", "entity_kind": "component", "manufacturer": "UNIST (Hoon Eui Jeong)", "type": "magnetic_composite_actuator", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [], "price_range": null, "ros_support": null, "modalities": [ "tactile" ], "modality_details": { "exposed": [ "tactile" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": true, "basis": [ "category:flexible_actuators" ], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.7, "verified": true, "quarantine": false, "source_url": "https://onlinelibrary.wiley.com/journal/16163028" }, "standards": { "caee060_relevant": true, "iso22166_relevant": true, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "BIONIC-HAND-001", "name": "Clone Hand", "name_en": "Clone Hand (myofiber anthropomorphic hand)", "category": "bionic_mechanisms", "entity_kind": "component", "manufacturer": "Clone Robotics", "type": "bionic_hand", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid_hand", "android", "prosthetics_research" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.7, "verified": true, "quarantine": false, "source_url": "https://www.clonerobotics.com/hand" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "BIONIC-HAND-002", "name": "Yeah Robotic Hand (formerly Rebelia)", "name_en": "Yeah Robotic Hand (formerly Rebelia)", "category": "bionic_mechanisms", "entity_kind": "component", "manufacturer": "Vittorio Lumare (Yeah Robotics) / Public Invention", "type": "bionic_hand", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid_hand", "manipulator", "prosthetic_transradial", "research" ], "price_range": null, "ros_support": null, "modalities": [ "geometric" ], "modality_details": { "exposed": [ "geometric" ], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": true, "identity": [ "ISO 9409-1", "50mm" ] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.6, "verified": true, "quarantine": false, "source_url": "https://hackaday.io/project/204373-rebelia-robotic-hand" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "BIONIC-HAND-003", "name": "Shadow Dexterous Hand", "name_en": "Shadow Dexterous Hand (research-grade anthropomorphic hand)", "category": "bionic_mechanisms", "entity_kind": "component", "manufacturer": "Shadow Robot Company", "type": "bionic_hand", "specs": { "torque": null, "speed": null, "weight": "4.3kg", "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "research", "in_hand_manipulation", "humanoid_hand", "teleoperation" ], "price_range": null, "ros_support": null, "modalities": [ "force" ], "modality_details": { "exposed": [ "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": 4.3, "force_control_precision_nm": null, "basis": [ "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.7, "verified": true, "quarantine": false, "source_url": "https://www.shadowrobot.com/dexterous-hand-series/" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "BIONIC-HAND-004", "name": "Psyonic Ability Hand", "name_en": "Psyonic Ability Hand (myoelectric bionic hand)", "category": "bionic_mechanisms", "entity_kind": "component", "manufacturer": "Psyonic", "type": "bionic_hand", "specs": { "torque": null, "speed": null, "weight": "490g", "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "prosthetics", "humanoid_hand", "research", "teleoperation" ], "price_range": null, "ros_support": null, "modalities": [ "force" ], "modality_details": { "exposed": [ "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": 0.49, "force_control_precision_nm": null, "basis": [ "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.7, "verified": true, "quarantine": false, "source_url": "https://www.psyonic.io/" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "BIONIC-HAND-005", "name": "Open Bionics Hero PRO", "name_en": "Open Bionics Hero PRO (myoelectric bionic hand)", "category": "bionic_mechanisms", "entity_kind": "component", "manufacturer": "Open Bionics", "type": "bionic_hand", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "prosthetics", "humanoid_hand", "research" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.65, "verified": true, "quarantine": false, "source_url": "https://openbionics.com/" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "BIONIC-HAND-006", "name": "Unitree Dex5", "name_en": "Unitree Dex5 (dexterous robot hand)", "category": "bionic_mechanisms", "entity_kind": "component", "manufacturer": "Unitree Robotics", "type": "bionic_hand", "specs": { "torque": null, "speed": null, "weight": "~1.0kg", "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid_hand", "dexterous_manipulation", "research" ], "price_range": null, "ros_support": null, "modalities": [ "force" ], "modality_details": { "exposed": [ "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": 1, "force_control_precision_nm": null, "basis": [ "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.7, "verified": true, "quarantine": false, "source_url": "https://www.unitree.com/" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "BIONIC-HAND-007", "name": "Inspire RH56 Series", "name_en": "Inspire RH56 Series (dexterous robot hand)", "category": "bionic_mechanisms", "entity_kind": "component", "manufacturer": "Inspire-Robots", "type": "bionic_hand", "specs": { "torque": null, "speed": null, "weight": "540g", "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid_hand", "dexterous_manipulation", "industrial" ], "price_range": null, "ros_support": null, "modalities": [ "force" ], "modality_details": { "exposed": [ "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": 0.54, "force_control_precision_nm": null, "basis": [ "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.65, "verified": true, "quarantine": false, "source_url": "https://www.inspire-robots.com/" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "BIONIC-HAND-008", "name": "Allegro Hand", "name_en": "Allegro Hand (Wonik Robotics dexterous hand)", "category": "bionic_mechanisms", "entity_kind": "component", "manufacturer": "Wonik Robotics", "type": "bionic_hand", "specs": { "torque": null, "speed": null, "weight": "1.0kg", "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "research", "dexterous_manipulation", "humanoid_hand" ], "price_range": null, "ros_support": null, "modalities": [ "force" ], "modality_details": { "exposed": [ "force" ], "force": { "declared": true, "torque_nm": null, "weight_kg": 1, "force_control_precision_nm": null, "basis": [ "weight" ] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.65, "verified": true, "quarantine": false, "source_url": "https://www.wonikrobotics.com/allegro-hand" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "GRIP-006", "name": "Robotiq Hand-E", "name_en": "Robotiq Hand-E", "category": "grippers", "entity_kind": "component", "manufacturer": "Robotiq", "type": "adaptive_gripper", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "machine_tending", "bin_picking", "assembly" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.8, "verified": true, "quarantine": false, "source_url": "https://robotiq.com/products/hand-e-adaptive-gripper" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "GRIP-007", "name": "OnRobot RG2", "name_en": "OnRobot RG2", "category": "grippers", "entity_kind": "component", "manufacturer": "OnRobot", "type": "collaborative_gripper", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "collaborative", "machine_tending", "material_handling" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.8, "verified": true, "quarantine": false, "source_url": "https://onrobot.com/en/products/rg2" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "GRIP-008", "name": "Schunk WSG 050", "name_en": "Schunk WSG 050", "category": "grippers", "entity_kind": "component", "manufacturer": "Schunk", "type": "electric_parallel_gripper", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "precision_assembly", "lab_automation", "electronics" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.8, "verified": true, "quarantine": false, "source_url": "https://schunk.com/us/en/gripping-systems/parallel-grippers/wsg-050" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "GRIP-009", "name": "Schunk Co-act EGP 64", "name_en": "Schunk Co-act EGP 64", "category": "grippers", "entity_kind": "component", "manufacturer": "Schunk", "type": "electric_parallel_gripper", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "collaborative", "machine_tending", "food", "industrial" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.8, "verified": true, "quarantine": false, "source_url": "https://schunk.com/us/en/gripping-systems/parallel-grippers/co-act-egp-64" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "GRIP-010", "name": "Festo DHAS", "name_en": "Festo DHAS", "category": "grippers", "entity_kind": "component", "manufacturer": "Festo", "type": "pneumatic_parallel_gripper", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "pick_and_place", "packaging", "high_speed" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.8, "verified": true, "quarantine": false, "source_url": "https://www.festo.com/cat/en-us_us/products_DHAS" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "GRIP-011", "name": "Soft Robotics mGrip", "name_en": "Soft Robotics mGrip", "category": "grippers", "entity_kind": "component", "manufacturer": "Soft Robotics (now Quantos)", "type": "soft_adaptive_gripper", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "food", "packaging", "bin_picking", "fragile" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.8, "verified": true, "quarantine": false, "source_url": "https://www.softroboticsinc.com/mgrip" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "GRIP-012", "name": "OnRobot VGC10", "name_en": "OnRobot VGC10", "category": "grippers", "entity_kind": "component", "manufacturer": "OnRobot", "type": "electric_vacuum_gripper", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "collaborative", "packaging", "pick_and_place" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.8, "verified": true, "quarantine": false, "source_url": "https://onrobot.com/en/products/vgc10" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "GRIP-013", "name": "Barrett Hand BH8-282", "name_en": "Barrett Hand BH8-282", "category": "grippers", "entity_kind": "component", "manufacturer": "Barrett Technology", "type": "multi_fingered_gripper", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "dexterous_grasp", "research", "prosthetics_research" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.8, "verified": true, "quarantine": false, "source_url": "https://www.barrett.com/products/hand/" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "GRIP-014", "name": "Robotiq EPick", "name_en": "Robotiq EPick", "category": "grippers", "entity_kind": "component", "manufacturer": "Robotiq", "type": "electric_vacuum_gripper", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "collaborative", "pick_and_place", "packaging" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.8, "verified": true, "quarantine": false, "source_url": "https://robotiq.com/products/epick" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "GRIP-015", "name": "ROBOTIS RH-P12-RN", "name_en": "ROBOTIS RH-P12-RN", "category": "grippers", "entity_kind": "component", "manufacturer": "ROBOTIS", "type": "adaptive_gripper", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "manipulation", "research", "service_robot" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.8, "verified": true, "quarantine": false, "source_url": "https://emanual.robotis.com/docs/en/platform/rh_p12_rn/" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-852", "name": "ATI Axia80", "name_en": "ATI Axia80", "category": "sensors", "entity_kind": "component", "manufacturer": "ATI Industrial Automation", "type": "force_torque_sensor", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "force_control", "assembly", "research", "polishing" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.8, "verified": true, "quarantine": false, "source_url": "https://www.ati-ia.com/products/ft/axia80.aspx" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-853", "name": "ATI Mini45", "name_en": "ATI Mini45", "category": "sensors", "entity_kind": "component", "manufacturer": "ATI Industrial Automation", "type": "force_torque_sensor", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "collaborative", "force_control", "research" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.8, "verified": true, "quarantine": false, "source_url": "https://www.ati-ia.com/products/ft/mini45.aspx" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-854", "name": "OnRobot HEX-H", "name_en": "OnRobot HEX-H", "category": "sensors", "entity_kind": "component", "manufacturer": "OnRobot", "type": "force_torque_sensor", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "collaborative", "force_control", "hand_guiding" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.8, "verified": true, "quarantine": false, "source_url": "https://onrobot.com/en/products/hex-s" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-855", "name": "Robotiq FT 300-S", "name_en": "Robotiq FT 300-S", "category": "sensors", "entity_kind": "component", "manufacturer": "Robotiq", "type": "force_torque_sensor", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "collaborative", "force_control", "assembly", "sanding" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.8, "verified": true, "quarantine": false, "source_url": "https://robotiq.com/products/ft-300-force-torque-sensor" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "SENS-856", "name": "Robotiq Fingertip", "name_en": "Robotiq Fingertip", "category": "sensors", "entity_kind": "component", "manufacturer": "Robotiq", "type": "tactile_sensor", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "tactile_grasp", "dexterous", "collaborative" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.8, "verified": true, "quarantine": false, "source_url": "https://robotiq.com/products/fingertip" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-3275", "name": "T-Motor AK80-9", "name_en": "T-Motor AK80-9", "category": "actuators", "entity_kind": "component", "manufacturer": "T-Motor (X-TEAM)", "type": "robot_joint_motor", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid_joint", "legged_robot", "manipulator" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.8, "verified": true, "quarantine": false, "source_url": "https://www.tmotor.com/product/ak80" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-3276", "name": "maxon EC 45 flat", "name_en": "maxon EC 45 flat", "category": "actuators", "entity_kind": "component", "manufacturer": "maxon", "type": "bldc_motor", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "medical", "instrumentation", "precision_actuation" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.8, "verified": true, "quarantine": false, "source_url": "https://www.maxongroup.com/maxon/view/product/motor/ecmotor/ecflat/EC45flat" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "ACT-3277", "name": "Elmo Whistle", "name_en": "Elmo Whistle", "category": "actuators", "entity_kind": "component", "manufacturer": "Elmo Motion Control", "type": "servo_drive", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "servo_control", "robot_actuation", "agv" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.8, "verified": true, "quarantine": false, "source_url": "https://www.elmomc.com/products/whistle-servo-drive.htm" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "CTRL-005", "name": "ROBOTIS Dynamixel XM540-W270", "name_en": "ROBOTIS Dynamixel XM540-W270", "category": "controllers", "entity_kind": "component", "manufacturer": "ROBOTIS", "type": "smart_servo", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "education", "manipulator" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.8, "verified": true, "quarantine": false, "source_url": "https://emanual.robotis.com/docs/en/dxl/x/xm540-w270/" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "RED-004", "name": "Harmonic Drive CSF-8", "name_en": "Harmonic Drive CSF-8", "category": "reducers", "entity_kind": "component", "manufacturer": "Harmonic Drive", "type": "harmonic_drive", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "precision_actuation", "joint", "semiconductor", "aerospace" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.8, "verified": true, "quarantine": false, "source_url": "https://www.harmonicdrive.net/products" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "RED-005", "name": "Nidec-Shimpo VRS-060", "name_en": "Nidec-Shimpo VRS-060", "category": "reducers", "entity_kind": "component", "manufacturer": "Nidec-Shimpo", "type": "precision_reducer", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "precision_actuation", "joint", "factory_automation" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "A", "confidence": 0.8, "verified": true, "quarantine": false, "source_url": "https://www.nidec-shimpo.eu/products/reducers/" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } }, { "id": "RED-006", "name": "Leaderdrive LHD-20", "name_en": "Leaderdrive LHD-20", "category": "reducers", "entity_kind": "component", "manufacturer": "Leaderdrive (绿地谐波)", "type": "harmonic_drive", "specs": { "torque": null, "speed": null, "weight": null, "voltage": null, "protocol": null, "interface": null, "position_resolution": null }, "applications": [ "humanoid", "collaborative", "joint" ], "price_range": null, "ros_support": null, "modalities": [], "modality_details": { "exposed": [], "force": { "declared": false, "torque_nm": null, "weight_kg": null, "force_control_precision_nm": null, "basis": [] }, "tactile": { "declared": false, "basis": [], "note": "声明级/类别级触觉相关（软体柔顺性、表面材质、抓握力），无原始触觉传感时序" }, "geometric": { "declared": false, "identity": [] }, "electrical": { "declared": false, "voltage_range": null, "protocols": null }, "vision": { "declared": false, "note": "RoboParts 平台不提供原始图像流，消费方须自备相机/RGB(-D)观测" } }, "evidence": { "source_tier": "B", "confidence": 0.8, "verified": true, "quarantine": false, "source_url": "https://www.leaderdrive.com/" }, "standards": { "caee060_relevant": false, "iso22166_relevant": false, "bus_class": "unknown", "ros2": null, "interop_posture": "unknown" } } ], "compatibility_edges": [ { "a": "ACT-001", "b": "ACT-002", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: rs485/ttl/dynamixel" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (10-14.8V / 10-14.8V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ），无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "ACT-003", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: rs485/dynamixel" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ），无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "ACT-004", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/uart/usb）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (10-14.8V / 12-48V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Odrive D6374 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "ACT-005", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs spi/i2c/uart）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (10-14.8V / 5-30V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；SimpleFOC Shield 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 38, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "ACT-006", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；T-Motor AK80-64 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "ACT-007", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；T-Motor AK10-9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "ACT-008", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs analog）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Maxon EC Flat 60 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "ACT-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs ethercat/ethernetip）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Kollmorgen TBM2G 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "ACT-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/uart/usb）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (10-14.8V / 8-60V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Focbox Unity 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 38, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "ACT-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Unitree B2 Motor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "ACT-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Unitree A1 Motor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "ACT-013", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Tesla M107 Joint Motor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "ACT-014", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Figure Custom Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "ACT-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；CubeMars GL40 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "ACT-016", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；CubeMars AK80-9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "ACT-017", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs ethercat）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Anybotics ANYdrive 3.0 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "ACT-018", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；MIT Mini Cheetah Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "ACT-019", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/rs232）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Faulhaber 3268 BP4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "ACT-020", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs ethercat/ethernetip/canopen/can）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Moog SmartMotor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "ACT-021", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs ethernet/udp/tcp/wifi）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Hebi X5 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "ACT-022", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs ethernet/udp/tcp/wifi）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Hebi X8 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "ACT-023", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs ethercat/proprietary）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Kinova Gen3 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "ACT-024", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs ethercat/canopen/can）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；RoboDrive ILM 70 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "ACT-025", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs uart）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (10-14.8V / 12-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Innodisk Flexidrive 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "ACT-026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs ethernetip/profinet/io-link）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Festo DSBC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "ACT-027", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs ethercat/profinet/io-link）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Schunk EGP Gripper 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "ACT-028", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: rs485" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ），无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "ACT-029", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs ethercat）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Dexai Allegro Hand v4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "ACT-030", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs ethercat/usb/proprietary）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Shadow Dexterous Hand 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "ACT-031", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs uart）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (10-14.8V / 6-12V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Lynxmotion LSS Arm 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 38, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "ACT-032", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Agility Robotics Digit Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "ACT-mosrac-whg240", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明通信协议，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Mosrac WHG-240 Frameless BLDC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "ACT-figure-03-helix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Figure 03 Helix Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "ACT-tienkung-ultra", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Tien Kung Ultra Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；NVIDIA Jetson Orin NX 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-002", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；NVIDIA Jetson AGX Orin 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Raspberry Pi 5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-004", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/spi/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；STM32H743 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-005", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/spi/i2c/uart/usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；ESP32-S3 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-006", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/spi/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Teensy 4.1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-007", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-008", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；NVIDIA Jetson Thor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Qualcomm RB6 (QCS6490) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Intel RealSense D455 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Hailo-8 M.2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Google Coral TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/spi/i2c/uart）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/spi/i2c/uart/usb/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/spi/i2c/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs ethercat/can/spi/i2c/usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/spi/i2c/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs ethercat/can/spi/i2c/uart/usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs usb/pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/usb/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs spi/i2c/usb/pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: dynamixel" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: dynamixel" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: rs485" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: rs485/ttl" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/spi/ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "GRIPPER-ONR-VG1", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 声明了「io_link」但不在可比对通信协议词表内（我方能力边界，非厂商缺数据），无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；OnRobot VG1 气动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs ethercat）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs ethercat）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-001", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs modbus）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM540-W270-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "ACT-003", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: rs485/dynamixel" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ），无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "ACT-004", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/uart/usb）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (10-14.8V / 12-48V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Odrive D6374 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "ACT-005", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs spi/i2c/uart）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (10-14.8V / 5-30V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；SimpleFOC Shield 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 38, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "ACT-006", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；T-Motor AK80-64 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "ACT-007", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；T-Motor AK10-9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "ACT-008", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs analog）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Maxon EC Flat 60 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "ACT-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs ethercat/ethernetip）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Kollmorgen TBM2G 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "ACT-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/uart/usb）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (10-14.8V / 8-60V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Focbox Unity 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 38, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "ACT-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Unitree B2 Motor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "ACT-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Unitree A1 Motor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "ACT-013", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Tesla M107 Joint Motor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "ACT-014", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Figure Custom Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "ACT-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；CubeMars GL40 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "ACT-016", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；CubeMars AK80-9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "ACT-017", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs ethercat）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Anybotics ANYdrive 3.0 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "ACT-018", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；MIT Mini Cheetah Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "ACT-019", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/rs232）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Faulhaber 3268 BP4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "ACT-020", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs ethercat/ethernetip/canopen/can）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Moog SmartMotor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "ACT-021", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs ethernet/udp/tcp/wifi）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Hebi X5 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "ACT-022", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs ethernet/udp/tcp/wifi）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Hebi X8 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "ACT-023", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs ethercat/proprietary）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Kinova Gen3 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "ACT-024", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs ethercat/canopen/can）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；RoboDrive ILM 70 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "ACT-025", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs uart）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (10-14.8V / 12-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Innodisk Flexidrive 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "ACT-026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs ethernetip/profinet/io-link）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Festo DSBC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "ACT-027", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs ethercat/profinet/io-link）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Schunk EGP Gripper 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "ACT-028", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: rs485" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ），无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "ACT-029", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs ethercat）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Dexai Allegro Hand v4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "ACT-030", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs ethercat/usb/proprietary）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Shadow Dexterous Hand 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "ACT-031", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs uart）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (10-14.8V / 6-12V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Lynxmotion LSS Arm 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 38, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "ACT-032", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Agility Robotics Digit Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "ACT-mosrac-whg240", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明通信协议，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Mosrac WHG-240 Frameless BLDC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "ACT-figure-03-helix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Figure 03 Helix Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "ACT-tienkung-ultra", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Tien Kung Ultra Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；NVIDIA Jetson Orin NX 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-002", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；NVIDIA Jetson AGX Orin 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Raspberry Pi 5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-004", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/spi/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；STM32H743 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-005", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/spi/i2c/uart/usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；ESP32-S3 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-006", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/spi/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Teensy 4.1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-007", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-008", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；NVIDIA Jetson Thor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Qualcomm RB6 (QCS6490) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Intel RealSense D455 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Hailo-8 M.2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Google Coral TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/spi/i2c/uart）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/spi/i2c/uart/usb/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/spi/i2c/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs ethercat/can/spi/i2c/usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/spi/i2c/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs ethercat/can/spi/i2c/uart/usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs usb/pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/usb/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs spi/i2c/usb/pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: dynamixel" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: dynamixel" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: rs485" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: rs485/ttl" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/spi/ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "GRIPPER-ONR-VG1", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 声明了「io_link」但不在可比对通信协议词表内（我方能力边界，非厂商缺数据），无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；OnRobot VG1 气动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs ethercat）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs ethercat）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-002", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/ttl/dynamixel vs modbus）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL XM430-W350-T 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "ACT-004", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs can/uart/usb）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-48V / 12-48V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Odrive D6374 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "ACT-005", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs spi/i2c/uart）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-48V / 5-30V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；SimpleFOC Shield 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 38, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "ACT-006", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs can）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-48V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；T-Motor AK80-64 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "ACT-007", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs can）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-48V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；T-Motor AK10-9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "ACT-008", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs analog）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-48V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Maxon EC Flat 60 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "ACT-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs ethercat/ethernetip）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-48V / 48-400V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Kollmorgen TBM2G 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "ACT-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs can/uart/usb）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-48V / 8-60V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Focbox Unity 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 38, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "ACT-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs can）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-48V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Unitree B2 Motor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "ACT-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs can）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Unitree A1 Motor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "ACT-013", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Tesla M107 Joint Motor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "ACT-014", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Figure Custom Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "ACT-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs can）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-48V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；CubeMars GL40 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "ACT-016", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs can）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-48V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；CubeMars AK80-9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "ACT-017", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-48V / 48-48V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Anybotics ANYdrive 3.0 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "ACT-018", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs can）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-48V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；MIT Mini Cheetah Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "ACT-019", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs can/rs232）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-48V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Faulhaber 3268 BP4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "ACT-020", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs ethercat/ethernetip/canopen/can）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-48V / 48-400V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Moog SmartMotor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "ACT-021", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs ethernet/udp/tcp/wifi）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-48V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Hebi X5 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "ACT-022", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs ethernet/udp/tcp/wifi）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-48V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Hebi X8 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "ACT-023", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs ethercat/proprietary）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-48V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Kinova Gen3 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "ACT-024", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs ethercat/canopen/can）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-48V / 48-48V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；RoboDrive ILM 70 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "ACT-025", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs uart）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-48V / 12-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Innodisk Flexidrive 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "ACT-026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs ethernetip/profinet/io-link）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-48V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Festo DSBC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "ACT-027", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs ethercat/profinet/io-link）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-48V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Schunk EGP Gripper 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "ACT-028", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: rs485" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-48V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ），无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "ACT-029", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-48V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Dexai Allegro Hand v4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "ACT-030", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs ethercat/usb/proprietary）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-48V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Shadow Dexterous Hand 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "ACT-031", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs uart）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Lynxmotion LSS Arm 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "ACT-032", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Agility Robotics Digit Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "ACT-mosrac-whg240", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明通信协议，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-48V / 48-48V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Mosrac WHG-240 Frameless BLDC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "ACT-figure-03-helix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Figure 03 Helix Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "ACT-tienkung-ultra", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Tien Kung Ultra Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；NVIDIA Jetson Orin NX 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-002", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；NVIDIA Jetson AGX Orin 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Raspberry Pi 5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-004", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs can/spi/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；STM32H743 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-005", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs can/spi/i2c/uart/usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；ESP32-S3 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-006", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs can/spi/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Teensy 4.1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-007", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-008", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；NVIDIA Jetson Thor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Qualcomm RB6 (QCS6490) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Intel RealSense D455 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Hailo-8 M.2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Google Coral TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs can/spi/i2c/uart）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs can/spi/i2c/uart/usb/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs can/spi/i2c/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs ethercat/can/spi/i2c/usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs can/spi/i2c/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs ethercat/can/spi/i2c/uart/usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs usb/pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs can/usb/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs spi/i2c/usb/pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: dynamixel" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: dynamixel" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: rs485" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: rs485" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs can/spi/ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "GRIPPER-ONR-VG1", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 声明了「io_link」但不在可比对通信协议词表内（我方能力边界，非厂商缺数据），无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-48V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；OnRobot VG1 气动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-48V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-48V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-003", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/dynamixel vs modbus）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-48V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DYNAMIXEL PH54-200-S500-R 仅声明安装方式「direct_mount」，未给法兰/接口标准规格（厂商侧缺口：horn/框架孔位 PCD、孔数、螺纹的法兰级几何未在公开页面给出，需对照官方 ）；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "ACT-005", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (12-48V / 5-30V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；SimpleFOC Shield 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 77, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "ACT-006", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (12-48V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；T-Motor AK80-64 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "ACT-007", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (12-48V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；T-Motor AK10-9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "ACT-008", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs analog）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (12-48V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Maxon EC Flat 60 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "ACT-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs ethercat/ethernetip）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (12-48V / 48-400V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Kollmorgen TBM2G 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "ACT-010", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/uart/usb" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (12-48V / 8-60V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Focbox Unity 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 77, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "ACT-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (12-48V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Unitree B2 Motor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "ACT-012", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (12-48V / 21.6-21.6V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Unitree A1 Motor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "ACT-013", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Tesla M107 Joint Motor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "ACT-014", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Figure Custom Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "ACT-015", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (12-48V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；CubeMars GL40 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "ACT-016", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (12-48V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；CubeMars AK80-9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "ACT-017", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (12-48V / 48-48V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Anybotics ANYdrive 3.0 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "ACT-018", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (12-48V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；MIT Mini Cheetah Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "ACT-019", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (12-48V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Faulhaber 3268 BP4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "ACT-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (12-48V / 48-400V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Moog SmartMotor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "ACT-021", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs ethernet/udp/tcp/wifi）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (12-48V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Hebi X5 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "ACT-022", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs ethernet/udp/tcp/wifi）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (12-48V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Hebi X8 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "ACT-023", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs ethercat/proprietary）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (12-48V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Kinova Gen3 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "ACT-024", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (12-48V / 48-48V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；RoboDrive ILM 70 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "ACT-025", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (12-48V / 12-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Innodisk Flexidrive 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "ACT-026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs ethernetip/profinet/io-link）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (12-48V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Festo DSBC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "ACT-027", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs ethercat/profinet/io-link）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (12-48V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Schunk EGP Gripper 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "ACT-028", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (12-48V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "ACT-029", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (12-48V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Dexai Allegro Hand v4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "ACT-030", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (12-48V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Shadow Dexterous Hand 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "ACT-031", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (12-48V / 6-12V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Lynxmotion LSS Arm 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 77, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "ACT-032", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Agility Robotics Digit Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "ACT-mosrac-whg240", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明通信协议，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (12-48V / 48-48V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Mosrac WHG-240 Frameless BLDC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "ACT-figure-03-helix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Figure 03 Helix Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "ACT-tienkung-ultra", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Tien Kung Ultra Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-001", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；NVIDIA Jetson Orin NX 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-002", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；NVIDIA Jetson AGX Orin 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-003", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Raspberry Pi 5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-004", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/uart/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；STM32H743 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-005", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/uart/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；ESP32-S3 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-006", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/uart/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Teensy 4.1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-007", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-008", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；NVIDIA Jetson Thor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-009", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Qualcomm RB6 (QCS6490) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Intel RealSense D455 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Hailo-8 M.2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Google Coral TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/uart/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/uart/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/uart/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "GRIPPER-ONR-VG1", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 声明了「io_link」但不在可比对通信协议词表内（我方能力边界，非厂商缺数据），无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (12-48V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；OnRobot VG1 气动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (12-48V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (12-48V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-004", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs modbus）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (12-48V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Odrive D6374 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "ACT-006", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs can）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (5-30V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；T-Motor AK80-64 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 38, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "ACT-007", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs can）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (5-30V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；T-Motor AK10-9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 38, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "ACT-008", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs analog）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (5-30V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Maxon EC Flat 60 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 38, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "ACT-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs ethercat/ethernetip）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Kollmorgen TBM2G 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "ACT-010", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (5-30V / 8-60V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Focbox Unity 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "ACT-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs can）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (5-30V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Unitree B2 Motor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 38, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "ACT-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs can）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (5-30V / 21.6-21.6V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Unitree A1 Motor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 38, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "ACT-013", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Tesla M107 Joint Motor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "ACT-014", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Figure Custom Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "ACT-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs can）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (5-30V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；CubeMars GL40 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 38, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "ACT-016", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs can）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (5-30V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；CubeMars AK80-9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 38, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "ACT-017", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs ethercat）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Anybotics ANYdrive 3.0 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "ACT-018", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs can）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (5-30V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；MIT Mini Cheetah Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 38, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "ACT-019", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs can/rs232）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (5-30V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Faulhaber 3268 BP4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 38, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "ACT-020", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs ethercat/ethernetip/canopen/can）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Moog SmartMotor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "ACT-021", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs ethernet/udp/tcp/wifi）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (5-30V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Hebi X5 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 38, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "ACT-022", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs ethernet/udp/tcp/wifi）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (5-30V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Hebi X8 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 38, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "ACT-023", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs ethercat/proprietary）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (5-30V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Kinova Gen3 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 38, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "ACT-024", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs ethercat/canopen/can）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；RoboDrive ILM 70 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "ACT-025", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (5-30V / 12-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Innodisk Flexidrive 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 77, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "ACT-026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs ethernetip/profinet/io-link）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (5-30V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Festo DSBC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 38, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "ACT-027", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs ethercat/profinet/io-link）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (5-30V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Schunk EGP Gripper 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 38, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "ACT-028", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs rs485/modbus/usb/ethernet/tcp）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (5-30V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 38, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "ACT-029", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (5-30V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Dexai Allegro Hand v4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 38, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "ACT-030", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs ethercat/usb/proprietary）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (5-30V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Shadow Dexterous Hand 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 38, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "ACT-031", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (5-30V / 6-12V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Lynxmotion LSS Arm 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "ACT-032", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Agility Robotics Digit Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "ACT-mosrac-whg240", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明通信协议，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Mosrac WHG-240 Frameless BLDC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "ACT-figure-03-helix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Figure 03 Helix Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "ACT-tienkung-ultra", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Tien Kung Ultra Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-001", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；NVIDIA Jetson Orin NX 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-002", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；NVIDIA Jetson AGX Orin 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-003", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Raspberry Pi 5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-004", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；STM32H743 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-005", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；ESP32-S3 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-006", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Teensy 4.1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-007", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-008", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；NVIDIA Jetson Thor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-009", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Qualcomm RB6 (QCS6490) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Intel RealSense D455 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Hailo-8 M.2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Google Coral TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs usb/pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs can/usb/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs can/rs485）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "GRIPPER-ONR-VG1", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 声明了「io_link」但不在可比对通信协议词表内（我方能力边界，非厂商缺数据），无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (5-30V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；OnRobot VG1 气动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (5-30V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (5-30V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-005", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart vs modbus）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (5-30V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SimpleFOC Shield 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "ACT-007", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；T-Motor AK10-9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "ACT-008", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs analog）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Maxon EC Flat 60 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "ACT-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat/ethernetip）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Kollmorgen TBM2G 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "ACT-010", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 8-60V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Focbox Unity 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 77, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "ACT-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Unitree B2 Motor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "ACT-012", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Unitree A1 Motor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "ACT-013", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Tesla M107 Joint Motor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "ACT-014", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Figure Custom Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "ACT-015", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；CubeMars GL40 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "ACT-016", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；CubeMars AK80-9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "ACT-017", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Anybotics ANYdrive 3.0 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "ACT-018", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；MIT Mini Cheetah Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "ACT-019", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Faulhaber 3268 BP4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "ACT-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Moog SmartMotor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "ACT-021", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethernet/udp/tcp/wifi）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Hebi X5 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "ACT-022", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethernet/udp/tcp/wifi）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Hebi X8 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "ACT-023", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat/proprietary）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Kinova Gen3 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "ACT-024", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；RoboDrive ILM 70 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "ACT-025", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs uart）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 12-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Innodisk Flexidrive 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "ACT-026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethernetip/profinet/io-link）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Festo DSBC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "ACT-027", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat/profinet/io-link）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Schunk EGP Gripper 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "ACT-028", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs rs485/modbus/usb/ethernet/tcp）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "ACT-029", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Dexai Allegro Hand v4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "ACT-030", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat/usb/proprietary）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Shadow Dexterous Hand 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "ACT-031", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs uart）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Lynxmotion LSS Arm 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "ACT-032", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Agility Robotics Digit Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "ACT-mosrac-whg240", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明通信协议，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Mosrac WHG-240 Frameless BLDC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "ACT-figure-03-helix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Figure 03 Helix Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "ACT-tienkung-ultra", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Tien Kung Ultra Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-001", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；NVIDIA Jetson Orin NX 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-002", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；NVIDIA Jetson AGX Orin 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Raspberry Pi 5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-004", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；STM32H743 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-005", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；ESP32-S3 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-006", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Teensy 4.1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-007", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-008", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；NVIDIA Jetson Thor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-009", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Qualcomm RB6 (QCS6490) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Intel RealSense D455 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Hailo-8 M.2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Google Coral TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs spi/i2c/usb/pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "GRIPPER-ONR-VG1", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 声明了「io_link」但不在可比对通信协议词表内（我方能力边界，非厂商缺数据），无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；OnRobot VG1 气动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-006", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs modbus）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK80-64 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "ACT-008", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs analog）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Maxon EC Flat 60 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "ACT-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat/ethernetip）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Kollmorgen TBM2G 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "ACT-010", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 8-60V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Focbox Unity 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 77, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "ACT-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Unitree B2 Motor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "ACT-012", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Unitree A1 Motor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "ACT-013", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Tesla M107 Joint Motor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "ACT-014", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Figure Custom Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "ACT-015", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；CubeMars GL40 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "ACT-016", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；CubeMars AK80-9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "ACT-017", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Anybotics ANYdrive 3.0 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "ACT-018", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；MIT Mini Cheetah Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "ACT-019", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Faulhaber 3268 BP4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "ACT-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Moog SmartMotor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "ACT-021", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethernet/udp/tcp/wifi）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Hebi X5 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "ACT-022", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethernet/udp/tcp/wifi）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Hebi X8 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "ACT-023", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat/proprietary）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Kinova Gen3 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "ACT-024", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；RoboDrive ILM 70 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "ACT-025", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs uart）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 12-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Innodisk Flexidrive 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "ACT-026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethernetip/profinet/io-link）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Festo DSBC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "ACT-027", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat/profinet/io-link）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Schunk EGP Gripper 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "ACT-028", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs rs485/modbus/usb/ethernet/tcp）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "ACT-029", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Dexai Allegro Hand v4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "ACT-030", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat/usb/proprietary）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Shadow Dexterous Hand 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "ACT-031", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs uart）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Lynxmotion LSS Arm 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "ACT-032", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Agility Robotics Digit Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "ACT-mosrac-whg240", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明通信协议，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Mosrac WHG-240 Frameless BLDC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "ACT-figure-03-helix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Figure 03 Helix Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "ACT-tienkung-ultra", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Tien Kung Ultra Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-001", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；NVIDIA Jetson Orin NX 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-002", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；NVIDIA Jetson AGX Orin 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Raspberry Pi 5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-004", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；STM32H743 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-005", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；ESP32-S3 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-006", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Teensy 4.1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-007", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-008", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；NVIDIA Jetson Thor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-009", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Qualcomm RB6 (QCS6490) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Intel RealSense D455 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Hailo-8 M.2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Google Coral TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs spi/i2c/usb/pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "GRIPPER-ONR-VG1", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 声明了「io_link」但不在可比对通信协议词表内（我方能力边界，非厂商缺数据），无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；OnRobot VG1 气动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-007", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs modbus）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "T-Motor AK10-9 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "ACT-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs ethercat/ethernetip）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Kollmorgen TBM2G 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "ACT-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs can/uart/usb）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 8-60V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Focbox Unity 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 38, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "ACT-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs can）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Unitree B2 Motor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "ACT-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs can）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Unitree A1 Motor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "ACT-013", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Tesla M107 Joint Motor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "ACT-014", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Figure Custom Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "ACT-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs can）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；CubeMars GL40 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "ACT-016", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs can）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；CubeMars AK80-9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "ACT-017", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs ethercat）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Anybotics ANYdrive 3.0 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "ACT-018", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs can）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；MIT Mini Cheetah Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "ACT-019", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs can/rs232）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Faulhaber 3268 BP4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "ACT-020", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs ethercat/ethernetip/canopen/can）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Moog SmartMotor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "ACT-021", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs ethernet/udp/tcp/wifi）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Hebi X5 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "ACT-022", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs ethernet/udp/tcp/wifi）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Hebi X8 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "ACT-023", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs ethercat/proprietary）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Kinova Gen3 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "ACT-024", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs ethercat/canopen/can）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；RoboDrive ILM 70 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "ACT-025", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs uart）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 12-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Innodisk Flexidrive 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "ACT-026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs ethernetip/profinet/io-link）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Festo DSBC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "ACT-027", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs ethercat/profinet/io-link）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Schunk EGP Gripper 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "ACT-028", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs rs485/modbus/usb/ethernet/tcp）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "ACT-029", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Dexai Allegro Hand v4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "ACT-030", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs ethercat/usb/proprietary）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Shadow Dexterous Hand 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "ACT-031", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs uart）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Lynxmotion LSS Arm 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "ACT-032", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Agility Robotics Digit Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "ACT-mosrac-whg240", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明通信协议，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Mosrac WHG-240 Frameless BLDC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "ACT-figure-03-helix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Figure 03 Helix Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "ACT-tienkung-ultra", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Tien Kung Ultra Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；NVIDIA Jetson Orin NX 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-002", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；NVIDIA Jetson AGX Orin 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Raspberry Pi 5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-004", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs can/spi/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；STM32H743 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-005", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs can/spi/i2c/uart/usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；ESP32-S3 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-006", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs can/spi/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Teensy 4.1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-007", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-008", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；NVIDIA Jetson Thor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Qualcomm RB6 (QCS6490) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Intel RealSense D455 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Hailo-8 M.2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Google Coral TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs can/spi/i2c/uart）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs can/spi/i2c/uart/usb/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs can/spi/i2c/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs ethercat/can/spi/i2c/usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs can/spi/i2c/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs ethercat/can/spi/i2c/uart/usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs usb/pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs can/usb/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs spi/i2c/usb/pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs can/rs485）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs can/spi/ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "GRIPPER-ONR-VG1", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 声明了「io_link」但不在可比对通信协议词表内（我方能力边界，非厂商缺数据），无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；OnRobot VG1 气动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-008", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（analog vs modbus）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Maxon EC Flat 60 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "ACT-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs can/uart/usb）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (48-400V / 8-60V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Focbox Unity 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 38, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "ACT-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs can）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Unitree B2 Motor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "ACT-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs can）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Unitree A1 Motor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "ACT-013", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Tesla M107 Joint Motor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "ACT-014", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Figure Custom Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "ACT-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs can）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；CubeMars GL40 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "ACT-016", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs can）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；CubeMars AK80-9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "ACT-017", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (48-400V / 48-48V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Anybotics ANYdrive 3.0 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "ACT-018", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs can）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；MIT Mini Cheetah Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "ACT-019", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs can/rs232）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Faulhaber 3268 BP4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "ACT-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat/ethernetip" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (48-400V / 48-400V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Moog SmartMotor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "ACT-021", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs ethernet/udp/tcp/wifi）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Hebi X5 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "ACT-022", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs ethernet/udp/tcp/wifi）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Hebi X8 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "ACT-023", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Kinova Gen3 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "ACT-024", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (48-400V / 48-48V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；RoboDrive ILM 70 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "ACT-025", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs uart）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Innodisk Flexidrive 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "ACT-026", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernetip" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Festo DSBC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "ACT-027", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Schunk EGP Gripper 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "ACT-028", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs rs485/modbus/usb/ethernet/tcp）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "ACT-029", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Dexai Allegro Hand v4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "ACT-030", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Shadow Dexterous Hand 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "ACT-031", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs uart）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Lynxmotion LSS Arm 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "ACT-032", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Agility Robotics Digit Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "ACT-mosrac-whg240", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明通信协议，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (48-400V / 48-48V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Mosrac WHG-240 Frameless BLDC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "ACT-figure-03-helix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Figure 03 Helix Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "ACT-tienkung-ultra", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Tien Kung Ultra Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；NVIDIA Jetson Orin NX 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-002", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；NVIDIA Jetson AGX Orin 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Raspberry Pi 5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-004", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs can/spi/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；STM32H743 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-005", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs can/spi/i2c/uart/usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；ESP32-S3 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-006", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs can/spi/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Teensy 4.1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-007", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-008", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；NVIDIA Jetson Thor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Qualcomm RB6 (QCS6490) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Intel RealSense D455 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Hailo-8 M.2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Google Coral TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs can/spi/i2c/uart）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs can/spi/i2c/uart/usb/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs can/spi/i2c/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs can/spi/i2c/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs usb/pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs can/usb/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs spi/i2c/usb/pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs can/rs485）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs can/spi/ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "GRIPPER-ONR-VG1", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 声明了「io_link」但不在可比对通信协议词表内（我方能力边界，非厂商缺数据），无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；OnRobot VG1 气动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-009", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip vs modbus）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kollmorgen TBM2G 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "ACT-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (8-60V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Unitree B2 Motor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 77, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "ACT-012", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (8-60V / 21.6-21.6V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Unitree A1 Motor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 77, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "ACT-013", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Tesla M107 Joint Motor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "ACT-014", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Figure Custom Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "ACT-015", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (8-60V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；CubeMars GL40 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 77, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "ACT-016", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (8-60V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；CubeMars AK80-9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 77, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "ACT-017", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (8-60V / 48-48V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Anybotics ANYdrive 3.0 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 38, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "ACT-018", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (8-60V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；MIT Mini Cheetah Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 77, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "ACT-019", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (8-60V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Faulhaber 3268 BP4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 77, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "ACT-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (8-60V / 48-400V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Moog SmartMotor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 77, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "ACT-021", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs ethernet/udp/tcp/wifi）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (8-60V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Hebi X5 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 38, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "ACT-022", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs ethernet/udp/tcp/wifi）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (8-60V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Hebi X8 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 38, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "ACT-023", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs ethercat/proprietary）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (8-60V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Kinova Gen3 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 38, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "ACT-024", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (8-60V / 48-48V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；RoboDrive ILM 70 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 77, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "ACT-025", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (8-60V / 12-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Innodisk Flexidrive 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 77, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "ACT-026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs ethernetip/profinet/io-link）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (8-60V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Festo DSBC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 38, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "ACT-027", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs ethercat/profinet/io-link）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (8-60V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Schunk EGP Gripper 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 38, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "ACT-028", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (8-60V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 77, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "ACT-029", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (8-60V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Dexai Allegro Hand v4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 38, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "ACT-030", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (8-60V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Shadow Dexterous Hand 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 77, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "ACT-031", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (8-60V / 6-12V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Lynxmotion LSS Arm 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "ACT-032", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Agility Robotics Digit Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "ACT-mosrac-whg240", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明通信协议，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (8-60V / 48-48V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Mosrac WHG-240 Frameless BLDC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "ACT-figure-03-helix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Figure 03 Helix Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "ACT-tienkung-ultra", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Tien Kung Ultra Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-001", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；NVIDIA Jetson Orin NX 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-002", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；NVIDIA Jetson AGX Orin 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-003", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Raspberry Pi 5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-004", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/uart/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；STM32H743 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-005", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/uart/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；ESP32-S3 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-006", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/uart/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Teensy 4.1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-007", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-008", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；NVIDIA Jetson Thor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-009", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Qualcomm RB6 (QCS6490) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Intel RealSense D455 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Hailo-8 M.2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Google Coral TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/uart/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/uart/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/uart/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "GRIPPER-ONR-VG1", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 声明了「io_link」但不在可比对通信协议词表内（我方能力边界，非厂商缺数据），无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (8-60V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；OnRobot VG1 气动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (8-60V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (8-60V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-010", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/uart/usb vs modbus）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (8-60V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Focbox Unity 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "ACT-012", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Unitree A1 Motor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "ACT-013", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Tesla M107 Joint Motor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "ACT-014", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Figure Custom Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "ACT-015", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；CubeMars GL40 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "ACT-016", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；CubeMars AK80-9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "ACT-017", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Anybotics ANYdrive 3.0 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "ACT-018", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；MIT Mini Cheetah Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "ACT-019", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Faulhaber 3268 BP4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "ACT-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Moog SmartMotor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "ACT-021", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethernet/udp/tcp/wifi）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Hebi X5 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "ACT-022", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethernet/udp/tcp/wifi）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Hebi X8 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "ACT-023", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat/proprietary）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Kinova Gen3 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "ACT-024", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；RoboDrive ILM 70 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "ACT-025", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs uart）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 12-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Innodisk Flexidrive 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "ACT-026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethernetip/profinet/io-link）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Festo DSBC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "ACT-027", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat/profinet/io-link）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Schunk EGP Gripper 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "ACT-028", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs rs485/modbus/usb/ethernet/tcp）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "ACT-029", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Dexai Allegro Hand v4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "ACT-030", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat/usb/proprietary）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Shadow Dexterous Hand 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "ACT-031", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs uart）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Lynxmotion LSS Arm 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "ACT-032", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Agility Robotics Digit Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "ACT-mosrac-whg240", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明通信协议，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Mosrac WHG-240 Frameless BLDC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "ACT-figure-03-helix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Figure 03 Helix Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "ACT-tienkung-ultra", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Tien Kung Ultra Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-001", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；NVIDIA Jetson Orin NX 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-002", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；NVIDIA Jetson AGX Orin 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Raspberry Pi 5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-004", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；STM32H743 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-005", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；ESP32-S3 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-006", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Teensy 4.1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-007", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-008", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；NVIDIA Jetson Thor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-009", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Qualcomm RB6 (QCS6490) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Intel RealSense D455 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Hailo-8 M.2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Google Coral TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs spi/i2c/usb/pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "GRIPPER-ONR-VG1", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 声明了「io_link」但不在可比对通信协议词表内（我方能力边界，非厂商缺数据），无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；OnRobot VG1 气动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-011", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs modbus）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree B2 Motor 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "ACT-013", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Tesla M107 Joint Motor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "ACT-014", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Figure Custom Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "ACT-015", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；CubeMars GL40 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "ACT-016", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；CubeMars AK80-9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "ACT-017", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Anybotics ANYdrive 3.0 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "ACT-018", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；MIT Mini Cheetah Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "ACT-019", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Faulhaber 3268 BP4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "ACT-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Moog SmartMotor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "ACT-021", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethernet/udp/tcp/wifi）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Hebi X5 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "ACT-022", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethernet/udp/tcp/wifi）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Hebi X8 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "ACT-023", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat/proprietary）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Kinova Gen3 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "ACT-024", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；RoboDrive ILM 70 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "ACT-025", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs uart）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (21.6-21.6V / 12-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Innodisk Flexidrive 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "ACT-026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethernetip/profinet/io-link）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Festo DSBC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "ACT-027", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat/profinet/io-link）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Schunk EGP Gripper 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "ACT-028", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs rs485/modbus/usb/ethernet/tcp）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "ACT-029", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Dexai Allegro Hand v4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "ACT-030", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat/usb/proprietary）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Shadow Dexterous Hand 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "ACT-031", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs uart）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Lynxmotion LSS Arm 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "ACT-032", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Agility Robotics Digit Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "ACT-mosrac-whg240", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明通信协议，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Mosrac WHG-240 Frameless BLDC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "ACT-figure-03-helix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Figure 03 Helix Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "ACT-tienkung-ultra", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Tien Kung Ultra Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-001", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；NVIDIA Jetson Orin NX 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-002", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；NVIDIA Jetson AGX Orin 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Raspberry Pi 5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-004", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；STM32H743 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-005", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；ESP32-S3 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-006", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Teensy 4.1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-007", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-008", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；NVIDIA Jetson Thor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-009", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Qualcomm RB6 (QCS6490) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Intel RealSense D455 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Hailo-8 M.2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Google Coral TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs spi/i2c/usb/pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "GRIPPER-ONR-VG1", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 声明了「io_link」但不在可比对通信协议词表内（我方能力边界，非厂商缺数据），无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；OnRobot VG1 气动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-012", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs modbus）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Unitree A1 Motor 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "ACT-014", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "双方均为专有总线，字面相同不代表互通，需厂商网关" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Figure Custom Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "ACT-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；CubeMars GL40 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "ACT-016", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；CubeMars AK80-9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "ACT-017", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Anybotics ANYdrive 3.0 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "ACT-018", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；MIT Mini Cheetah Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "ACT-019", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/rs232）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Faulhaber 3268 BP4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "ACT-020", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethercat/ethernetip/canopen/can）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Moog SmartMotor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "ACT-021", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethernet/udp/tcp/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Hebi X5 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "ACT-022", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethernet/udp/tcp/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Hebi X8 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "ACT-023", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "双方均为专有总线，字面相同不代表互通，需厂商网关" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Kinova Gen3 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "ACT-024", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethercat/canopen/can）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；RoboDrive ILM 70 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "ACT-025", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs uart）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Innodisk Flexidrive 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "ACT-026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethernetip/profinet/io-link）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Festo DSBC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "ACT-027", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethercat/profinet/io-link）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Schunk EGP Gripper 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "ACT-028", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs rs485/modbus/usb/ethernet/tcp）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "ACT-029", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Dexai Allegro Hand v4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "ACT-030", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "双方均为专有总线，字面相同不代表互通，需厂商网关" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Shadow Dexterous Hand 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "ACT-031", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs uart）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Lynxmotion LSS Arm 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "ACT-032", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "双方均为专有总线，字面相同不代表互通，需厂商网关" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Agility Robotics Digit Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "ACT-figure-03-helix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "双方均为专有总线，字面相同不代表互通，需厂商网关" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Figure 03 Helix Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "ACT-tienkung-ultra", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "双方均为专有总线，字面相同不代表互通，需厂商网关" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Tien Kung Ultra Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；NVIDIA Jetson Orin NX 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-002", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；NVIDIA Jetson AGX Orin 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Raspberry Pi 5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-004", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；STM32H743 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-005", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；ESP32-S3 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-006", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Teensy 4.1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-007", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-008", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；NVIDIA Jetson Thor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Qualcomm RB6 (QCS6490) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Intel RealSense D455 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Hailo-8 M.2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Google Coral TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/usb/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethercat/can/spi/i2c/usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethercat/can/spi/i2c/uart/usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb/pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/usb/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs spi/i2c/usb/pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/rs485）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-013", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tesla M107 Joint Motor 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "ACT-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；CubeMars GL40 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "ACT-016", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；CubeMars AK80-9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "ACT-017", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Anybotics ANYdrive 3.0 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "ACT-018", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；MIT Mini Cheetah Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "ACT-019", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/rs232）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Faulhaber 3268 BP4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "ACT-020", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethercat/ethernetip/canopen/can）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Moog SmartMotor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "ACT-021", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethernet/udp/tcp/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Hebi X5 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "ACT-022", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethernet/udp/tcp/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Hebi X8 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "ACT-023", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "双方均为专有总线，字面相同不代表互通，需厂商网关" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Kinova Gen3 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "ACT-024", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethercat/canopen/can）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；RoboDrive ILM 70 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "ACT-025", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs uart）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Innodisk Flexidrive 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "ACT-026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethernetip/profinet/io-link）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Festo DSBC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "ACT-027", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethercat/profinet/io-link）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Schunk EGP Gripper 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "ACT-028", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs rs485/modbus/usb/ethernet/tcp）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "ACT-029", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Dexai Allegro Hand v4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "ACT-030", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "双方均为专有总线，字面相同不代表互通，需厂商网关" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Shadow Dexterous Hand 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "ACT-031", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs uart）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Lynxmotion LSS Arm 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "ACT-032", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "双方均为专有总线，字面相同不代表互通，需厂商网关" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Agility Robotics Digit Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "ACT-figure-03-helix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "双方均为专有总线，字面相同不代表互通，需厂商网关" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Figure 03 Helix Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "ACT-tienkung-ultra", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "双方均为专有总线，字面相同不代表互通，需厂商网关" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Tien Kung Ultra Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；NVIDIA Jetson Orin NX 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-002", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；NVIDIA Jetson AGX Orin 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Raspberry Pi 5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-004", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；STM32H743 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-005", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；ESP32-S3 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-006", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Teensy 4.1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-007", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-008", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；NVIDIA Jetson Thor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Qualcomm RB6 (QCS6490) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Intel RealSense D455 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Hailo-8 M.2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Google Coral TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/usb/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethercat/can/spi/i2c/usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethercat/can/spi/i2c/uart/usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb/pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/usb/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs spi/i2c/usb/pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/rs485）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-014", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure Custom Actuator 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "ACT-016", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；CubeMars AK80-9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "ACT-017", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Anybotics ANYdrive 3.0 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "ACT-018", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；MIT Mini Cheetah Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "ACT-019", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Faulhaber 3268 BP4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "ACT-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Moog SmartMotor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "ACT-021", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethernet/udp/tcp/wifi）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Hebi X5 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "ACT-022", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethernet/udp/tcp/wifi）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Hebi X8 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "ACT-023", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat/proprietary）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Kinova Gen3 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "ACT-024", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；RoboDrive ILM 70 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "ACT-025", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs uart）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 12-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Innodisk Flexidrive 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "ACT-026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethernetip/profinet/io-link）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Festo DSBC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "ACT-027", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat/profinet/io-link）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Schunk EGP Gripper 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "ACT-028", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs rs485/modbus/usb/ethernet/tcp）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "ACT-029", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Dexai Allegro Hand v4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "ACT-030", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat/usb/proprietary）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Shadow Dexterous Hand 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "ACT-031", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs uart）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Lynxmotion LSS Arm 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "ACT-032", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Agility Robotics Digit Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "ACT-mosrac-whg240", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明通信协议，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Mosrac WHG-240 Frameless BLDC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "ACT-figure-03-helix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Figure 03 Helix Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "ACT-tienkung-ultra", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Tien Kung Ultra Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-001", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；NVIDIA Jetson Orin NX 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-002", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；NVIDIA Jetson AGX Orin 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Raspberry Pi 5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-004", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；STM32H743 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-005", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；ESP32-S3 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-006", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Teensy 4.1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-007", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-008", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；NVIDIA Jetson Thor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-009", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Qualcomm RB6 (QCS6490) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Intel RealSense D455 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Hailo-8 M.2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Google Coral TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs spi/i2c/usb/pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "GRIPPER-ONR-VG1", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 声明了「io_link」但不在可比对通信协议词表内（我方能力边界，非厂商缺数据），无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；OnRobot VG1 气动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-015", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs modbus）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars GL40 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "ACT-017", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Anybotics ANYdrive 3.0 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "ACT-018", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；MIT Mini Cheetah Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "ACT-019", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Faulhaber 3268 BP4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "ACT-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Moog SmartMotor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "ACT-021", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethernet/udp/tcp/wifi）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Hebi X5 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "ACT-022", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethernet/udp/tcp/wifi）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Hebi X8 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "ACT-023", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat/proprietary）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Kinova Gen3 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "ACT-024", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；RoboDrive ILM 70 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "ACT-025", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs uart）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 12-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Innodisk Flexidrive 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "ACT-026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethernetip/profinet/io-link）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Festo DSBC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "ACT-027", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat/profinet/io-link）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Schunk EGP Gripper 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "ACT-028", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs rs485/modbus/usb/ethernet/tcp）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "ACT-029", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Dexai Allegro Hand v4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "ACT-030", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat/usb/proprietary）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Shadow Dexterous Hand 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "ACT-031", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs uart）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Lynxmotion LSS Arm 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "ACT-032", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Agility Robotics Digit Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "ACT-mosrac-whg240", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明通信协议，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Mosrac WHG-240 Frameless BLDC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "ACT-figure-03-helix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Figure 03 Helix Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "ACT-tienkung-ultra", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Tien Kung Ultra Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-001", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；NVIDIA Jetson Orin NX 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-002", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；NVIDIA Jetson AGX Orin 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Raspberry Pi 5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-004", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；STM32H743 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-005", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；ESP32-S3 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-006", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Teensy 4.1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-007", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-008", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；NVIDIA Jetson Thor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-009", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Qualcomm RB6 (QCS6490) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Intel RealSense D455 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Hailo-8 M.2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Google Coral TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs spi/i2c/usb/pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "GRIPPER-ONR-VG1", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 声明了「io_link」但不在可比对通信协议词表内（我方能力边界，非厂商缺数据），无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；OnRobot VG1 气动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-016", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs modbus）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "CubeMars AK80-9 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "ACT-018", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；MIT Mini Cheetah Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "ACT-019", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/rs232）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Faulhaber 3268 BP4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "ACT-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (48-48V / 48-400V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Moog SmartMotor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "ACT-021", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs ethernet/udp/tcp/wifi）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Hebi X5 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "ACT-022", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs ethernet/udp/tcp/wifi）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Hebi X8 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "ACT-023", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Kinova Gen3 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "ACT-024", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (48-48V / 48-48V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；RoboDrive ILM 70 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "ACT-025", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs uart）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Innodisk Flexidrive 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "ACT-026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs ethernetip/profinet/io-link）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Festo DSBC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "ACT-027", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Schunk EGP Gripper 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "ACT-028", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs rs485/modbus/usb/ethernet/tcp）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "ACT-029", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Dexai Allegro Hand v4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "ACT-030", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Shadow Dexterous Hand 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "ACT-031", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs uart）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Lynxmotion LSS Arm 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "ACT-032", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Agility Robotics Digit Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "ACT-mosrac-whg240", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明通信协议，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (48-48V / 48-48V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Mosrac WHG-240 Frameless BLDC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "ACT-figure-03-helix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Figure 03 Helix Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "ACT-tienkung-ultra", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Tien Kung Ultra Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；NVIDIA Jetson Orin NX 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-002", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；NVIDIA Jetson AGX Orin 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Raspberry Pi 5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-004", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/spi/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；STM32H743 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-005", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/spi/i2c/uart/usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；ESP32-S3 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-006", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/spi/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Teensy 4.1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-007", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-008", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；NVIDIA Jetson Thor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Qualcomm RB6 (QCS6490) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Intel RealSense D455 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Hailo-8 M.2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Google Coral TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/spi/i2c/uart）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/spi/i2c/uart/usb/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/spi/i2c/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/spi/i2c/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs usb/pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/usb/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs spi/i2c/usb/pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/rs485）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/spi/ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "GRIPPER-ONR-VG1", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 声明了「io_link」但不在可比对通信协议词表内（我方能力边界，非厂商缺数据），无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；OnRobot VG1 气动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-017", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs modbus）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Anybotics ANYdrive 3.0 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "ACT-019", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Faulhaber 3268 BP4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "ACT-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Moog SmartMotor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "ACT-021", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethernet/udp/tcp/wifi）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Hebi X5 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "ACT-022", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethernet/udp/tcp/wifi）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Hebi X8 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "ACT-023", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat/proprietary）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Kinova Gen3 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "ACT-024", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；RoboDrive ILM 70 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "ACT-025", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs uart）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 12-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Innodisk Flexidrive 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "ACT-026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethernetip/profinet/io-link）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Festo DSBC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "ACT-027", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat/profinet/io-link）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Schunk EGP Gripper 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "ACT-028", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs rs485/modbus/usb/ethernet/tcp）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "ACT-029", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Dexai Allegro Hand v4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "ACT-030", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat/usb/proprietary）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Shadow Dexterous Hand 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "ACT-031", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs uart）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Lynxmotion LSS Arm 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "ACT-032", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Agility Robotics Digit Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "ACT-mosrac-whg240", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明通信协议，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Mosrac WHG-240 Frameless BLDC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "ACT-figure-03-helix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Figure 03 Helix Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "ACT-tienkung-ultra", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Tien Kung Ultra Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-001", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；NVIDIA Jetson Orin NX 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-002", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；NVIDIA Jetson AGX Orin 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Raspberry Pi 5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-004", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；STM32H743 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-005", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；ESP32-S3 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-006", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Teensy 4.1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-007", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-008", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；NVIDIA Jetson Thor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-009", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Qualcomm RB6 (QCS6490) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Intel RealSense D455 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Hailo-8 M.2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Google Coral TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs spi/i2c/usb/pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "GRIPPER-ONR-VG1", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 声明了「io_link」但不在可比对通信协议词表内（我方能力边界，非厂商缺数据），无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；OnRobot VG1 气动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-018", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can vs modbus）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MIT Mini Cheetah Actuator 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "ACT-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Moog SmartMotor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "ACT-021", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs ethernet/udp/tcp/wifi）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Hebi X5 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "ACT-022", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs ethernet/udp/tcp/wifi）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Hebi X8 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "ACT-023", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs ethercat/proprietary）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Kinova Gen3 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "ACT-024", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；RoboDrive ILM 70 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "ACT-025", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs uart）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 12-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Innodisk Flexidrive 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "ACT-026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs ethernetip/profinet/io-link）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Festo DSBC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "ACT-027", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs ethercat/profinet/io-link）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Schunk EGP Gripper 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "ACT-028", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs rs485/modbus/usb/ethernet/tcp）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "ACT-029", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Dexai Allegro Hand v4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "ACT-030", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs ethercat/usb/proprietary）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Shadow Dexterous Hand 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "ACT-031", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs uart）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Lynxmotion LSS Arm 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "ACT-032", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Agility Robotics Digit Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "ACT-mosrac-whg240", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明通信协议，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Mosrac WHG-240 Frameless BLDC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "ACT-figure-03-helix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Figure 03 Helix Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "ACT-tienkung-ultra", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Tien Kung Ultra Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-001", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；NVIDIA Jetson Orin NX 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-002", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；NVIDIA Jetson AGX Orin 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Raspberry Pi 5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-004", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；STM32H743 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-005", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；ESP32-S3 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-006", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Teensy 4.1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-007", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-008", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；NVIDIA Jetson Thor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-009", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Qualcomm RB6 (QCS6490) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Intel RealSense D455 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Hailo-8 M.2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Google Coral TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs usb/pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs spi/i2c/usb/pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "GRIPPER-ONR-VG1", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 声明了「io_link」但不在可比对通信协议词表内（我方能力边界，非厂商缺数据），无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；OnRobot VG1 气动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-019", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs232 vs modbus）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Faulhaber 3268 BP4 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "ACT-021", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs ethernet/udp/tcp/wifi）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Hebi X5 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "ACT-022", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs ethernet/udp/tcp/wifi）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Hebi X8 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "ACT-023", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Kinova Gen3 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "ACT-024", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat/canopen/can" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (48-400V / 48-48V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；RoboDrive ILM 70 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "ACT-025", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs uart）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Innodisk Flexidrive 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "ACT-026", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernetip" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Festo DSBC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "ACT-027", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Schunk EGP Gripper 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "ACT-028", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs rs485/modbus/usb/ethernet/tcp）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "ACT-029", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Dexai Allegro Hand v4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "ACT-030", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Shadow Dexterous Hand 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "ACT-031", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs uart）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Lynxmotion LSS Arm 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "ACT-032", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Agility Robotics Digit Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "ACT-mosrac-whg240", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明通信协议，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (48-400V / 48-48V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Mosrac WHG-240 Frameless BLDC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "ACT-figure-03-helix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Figure 03 Helix Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "ACT-tienkung-ultra", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Tien Kung Ultra Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-001", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；NVIDIA Jetson Orin NX 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-002", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；NVIDIA Jetson AGX Orin 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Raspberry Pi 5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-004", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；STM32H743 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-005", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；ESP32-S3 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-006", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Teensy 4.1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-007", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-008", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；NVIDIA Jetson Thor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-009", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Qualcomm RB6 (QCS6490) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Intel RealSense D455 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Hailo-8 M.2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Google Coral TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat/can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat/can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat/can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat/can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat/can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs usb/pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs spi/i2c/usb/pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "GRIPPER-ONR-VG1", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 声明了「io_link」但不在可比对通信协议词表内（我方能力边界，非厂商缺数据），无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；OnRobot VG1 气动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-020", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/ethernetip/canopen/can vs modbus）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Moog SmartMotor 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "ACT-022", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet/udp/tcp/wifi" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Hebi X8 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "ACT-023", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs ethercat/proprietary）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Kinova Gen3 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "ACT-024", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs ethercat/canopen/can）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；RoboDrive ILM 70 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "ACT-025", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs uart）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 12-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Innodisk Flexidrive 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "ACT-026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs ethernetip/profinet/io-link）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Festo DSBC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "ACT-027", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs ethercat/profinet/io-link）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Schunk EGP Gripper 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "ACT-028", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet/tcp" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "ACT-029", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Dexai Allegro Hand v4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "ACT-030", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs ethercat/usb/proprietary）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Shadow Dexterous Hand 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "ACT-031", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs uart）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Lynxmotion LSS Arm 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "ACT-032", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Agility Robotics Digit Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "ACT-mosrac-whg240", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明通信协议，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Mosrac WHG-240 Frameless BLDC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "ACT-figure-03-helix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Figure 03 Helix Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "ACT-tienkung-ultra", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Tien Kung Ultra Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；NVIDIA Jetson Orin NX 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-002", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；NVIDIA Jetson AGX Orin 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Raspberry Pi 5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-004", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/spi/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；STM32H743 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-005", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: wifi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；ESP32-S3 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-006", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/spi/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Teensy 4.1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-007", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-008", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；NVIDIA Jetson Thor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Qualcomm RB6 (QCS6490) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Intel RealSense D455 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Hailo-8 M.2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Google Coral TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/spi/i2c/uart）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/spi/i2c/uart/usb/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/spi/i2c/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/spi/i2c/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs usb/pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/usb/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/rs485）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: wifi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: wifi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "GRIPPER-ONR-VG1", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 声明了「io_link」但不在可比对通信协议词表内（我方能力边界，非厂商缺数据），无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；OnRobot VG1 气动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-021", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs modbus）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X5 Actuator 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "ACT-023", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs ethercat/proprietary）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Kinova Gen3 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "ACT-024", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs ethercat/canopen/can）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；RoboDrive ILM 70 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "ACT-025", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs uart）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 12-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Innodisk Flexidrive 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "ACT-026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs ethernetip/profinet/io-link）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Festo DSBC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "ACT-027", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs ethercat/profinet/io-link）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Schunk EGP Gripper 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "ACT-028", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet/tcp" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "ACT-029", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Dexai Allegro Hand v4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "ACT-030", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs ethercat/usb/proprietary）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Shadow Dexterous Hand 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "ACT-031", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs uart）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Lynxmotion LSS Arm 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "ACT-032", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Agility Robotics Digit Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "ACT-mosrac-whg240", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明通信协议，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Mosrac WHG-240 Frameless BLDC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "ACT-figure-03-helix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Figure 03 Helix Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "ACT-tienkung-ultra", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Tien Kung Ultra Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；NVIDIA Jetson Orin NX 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-002", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；NVIDIA Jetson AGX Orin 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Raspberry Pi 5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-004", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/spi/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；STM32H743 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-005", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: wifi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；ESP32-S3 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-006", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/spi/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Teensy 4.1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-007", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-008", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；NVIDIA Jetson Thor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Qualcomm RB6 (QCS6490) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Intel RealSense D455 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Hailo-8 M.2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Google Coral TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/spi/i2c/uart）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/spi/i2c/uart/usb/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/spi/i2c/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/spi/i2c/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs usb/pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/usb/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/rs485）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: wifi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: wifi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "GRIPPER-ONR-VG1", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 声明了「io_link」但不在可比对通信协议词表内（我方能力边界，非厂商缺数据），无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；OnRobot VG1 气动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-022", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernet/udp/tcp/wifi vs modbus）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hebi X8 Actuator 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "ACT-024", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；RoboDrive ILM 70 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "ACT-025", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs uart）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 12-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Innodisk Flexidrive 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "ACT-026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs ethernetip/profinet/io-link）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Festo DSBC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "ACT-027", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Schunk EGP Gripper 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "ACT-028", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs rs485/modbus/usb/ethernet/tcp）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "ACT-029", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Dexai Allegro Hand v4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "ACT-030", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Shadow Dexterous Hand 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "ACT-031", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs uart）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Lynxmotion LSS Arm 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "ACT-032", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "双方均为专有总线，字面相同不代表互通，需厂商网关" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Agility Robotics Digit Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "ACT-mosrac-whg240", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明通信协议，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Mosrac WHG-240 Frameless BLDC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "ACT-figure-03-helix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "双方均为专有总线，字面相同不代表互通，需厂商网关" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Figure 03 Helix Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "ACT-tienkung-ultra", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "双方均为专有总线，字面相同不代表互通，需厂商网关" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Tien Kung Ultra Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；NVIDIA Jetson Orin NX 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-002", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；NVIDIA Jetson AGX Orin 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Raspberry Pi 5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-004", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs can/spi/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；STM32H743 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-005", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs can/spi/i2c/uart/usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；ESP32-S3 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-006", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs can/spi/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Teensy 4.1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-007", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-008", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；NVIDIA Jetson Thor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Qualcomm RB6 (QCS6490) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Intel RealSense D455 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Hailo-8 M.2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Google Coral TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs can/spi/i2c/uart）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs can/spi/i2c/uart/usb/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs can/spi/i2c/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs can/spi/i2c/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs usb/pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs can/usb/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs spi/i2c/usb/pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs can/rs485）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs can/spi/ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "GRIPPER-ONR-VG1", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 声明了「io_link」但不在可比对通信协议词表内（我方能力边界，非厂商缺数据），无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；OnRobot VG1 气动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-023", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/proprietary vs modbus）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinova Gen3 Actuator 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "ACT-025", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs uart）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Innodisk Flexidrive 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "ACT-026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs ethernetip/profinet/io-link）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Festo DSBC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "ACT-027", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Schunk EGP Gripper 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "ACT-028", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs rs485/modbus/usb/ethernet/tcp）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 23, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "ACT-029", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Dexai Allegro Hand v4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "ACT-030", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Shadow Dexterous Hand 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "ACT-031", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs uart）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Lynxmotion LSS Arm 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "ACT-032", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Agility Robotics Digit Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "ACT-mosrac-whg240", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明通信协议，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (48-48V / 48-48V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Mosrac WHG-240 Frameless BLDC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "ACT-figure-03-helix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Figure 03 Helix Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "ACT-tienkung-ultra", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Tien Kung Ultra Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-001", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；NVIDIA Jetson Orin NX 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-002", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；NVIDIA Jetson AGX Orin 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Raspberry Pi 5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-004", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；STM32H743 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-005", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；ESP32-S3 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-006", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Teensy 4.1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-007", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-008", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；NVIDIA Jetson Thor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-009", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Qualcomm RB6 (QCS6490) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Intel RealSense D455 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Hailo-8 M.2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Google Coral TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat/can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat/can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat/can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat/can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat/can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs usb/pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs spi/i2c/usb/pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "GRIPPER-ONR-VG1", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 声明了「io_link」但不在可比对通信协议词表内（我方能力边界，非厂商缺数据），无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；OnRobot VG1 气动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-024", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/canopen/can vs modbus）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RoboDrive ILM 70 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "ACT-026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs ethernetip/profinet/io-link）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (12-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Festo DSBC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "ACT-027", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs ethercat/profinet/io-link）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (12-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Schunk EGP Gripper 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "ACT-028", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs rs485/modbus/usb/ethernet/tcp）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (12-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "ACT-029", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (12-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Dexai Allegro Hand v4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "ACT-030", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs ethercat/usb/proprietary）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (12-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Shadow Dexterous Hand 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "ACT-031", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (12-24V / 6-12V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Lynxmotion LSS Arm 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 77, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "ACT-032", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Agility Robotics Digit Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "ACT-mosrac-whg240", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明通信协议，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Mosrac WHG-240 Frameless BLDC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "ACT-figure-03-helix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Figure 03 Helix Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "ACT-tienkung-ultra", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Tien Kung Ultra Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-001", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；NVIDIA Jetson Orin NX 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-002", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；NVIDIA Jetson AGX Orin 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-003", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Raspberry Pi 5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-004", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；STM32H743 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-005", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；ESP32-S3 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-006", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Teensy 4.1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-007", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-008", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；NVIDIA Jetson Thor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-009", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Qualcomm RB6 (QCS6490) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Intel RealSense D455 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Hailo-8 M.2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Google Coral TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs can/spi/i2c/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs ethercat/can/spi/i2c/usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs can/spi/i2c/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs usb/pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs can/usb/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs spi/i2c/usb/pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs can/rs485）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs can/spi/ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "GRIPPER-ONR-VG1", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 声明了「io_link」但不在可比对通信协议词表内（我方能力边界，非厂商缺数据），无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (12-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；OnRobot VG1 气动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (12-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (12-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-025", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs modbus）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (12-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Innodisk Flexidrive 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "ACT-027", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: profinet/io-link" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Schunk EGP Gripper 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "ACT-028", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs rs485/modbus/usb/ethernet/tcp）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "ACT-029", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Dexai Allegro Hand v4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "ACT-030", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs ethercat/usb/proprietary）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Shadow Dexterous Hand 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "ACT-031", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs uart）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Lynxmotion LSS Arm 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "ACT-032", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Agility Robotics Digit Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "ACT-mosrac-whg240", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明通信协议，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Mosrac WHG-240 Frameless BLDC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "ACT-figure-03-helix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Figure 03 Helix Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "ACT-tienkung-ultra", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Tien Kung Ultra Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；NVIDIA Jetson Orin NX 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-002", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；NVIDIA Jetson AGX Orin 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Raspberry Pi 5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-004", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs can/spi/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；STM32H743 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-005", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs can/spi/i2c/uart/usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；ESP32-S3 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-006", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs can/spi/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Teensy 4.1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-007", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-008", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；NVIDIA Jetson Thor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Qualcomm RB6 (QCS6490) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Intel RealSense D455 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Hailo-8 M.2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Google Coral TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs can/spi/i2c/uart）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs can/spi/i2c/uart/usb/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs can/spi/i2c/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs ethercat/can/spi/i2c/usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs can/spi/i2c/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs ethercat/can/spi/i2c/uart/usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs usb/pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs can/usb/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs spi/i2c/usb/pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs can/rs485）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs can/spi/ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "GRIPPER-ONR-VG1", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 声明了「io_link」但不在可比对通信协议词表内（我方能力边界，非厂商缺数据），无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；OnRobot VG1 气动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-026", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethernetip/profinet/io-link vs modbus）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Festo DSBC 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "ACT-028", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs rs485/modbus/usb/ethernet/tcp）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "ACT-029", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Dexai Allegro Hand v4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "ACT-030", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Shadow Dexterous Hand 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "ACT-031", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs uart）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Lynxmotion LSS Arm 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "ACT-032", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Agility Robotics Digit Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "ACT-mosrac-whg240", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明通信协议，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Mosrac WHG-240 Frameless BLDC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "ACT-figure-03-helix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Figure 03 Helix Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "ACT-tienkung-ultra", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Tien Kung Ultra Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；NVIDIA Jetson Orin NX 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-002", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；NVIDIA Jetson AGX Orin 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Raspberry Pi 5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-004", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs can/spi/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；STM32H743 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-005", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs can/spi/i2c/uart/usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；ESP32-S3 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-006", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs can/spi/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Teensy 4.1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-007", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-008", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；NVIDIA Jetson Thor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Qualcomm RB6 (QCS6490) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Intel RealSense D455 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Hailo-8 M.2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Google Coral TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs can/spi/i2c/uart）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs can/spi/i2c/uart/usb/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs can/spi/i2c/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs can/spi/i2c/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs usb/pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs can/usb/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs spi/i2c/usb/pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs can/rs485）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs can/spi/ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "GRIPPER-ONR-VG1", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 声明了「io_link」但不在可比对通信协议词表内（我方能力边界，非厂商缺数据），无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；OnRobot VG1 气动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-027", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/profinet/io-link vs modbus）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Schunk EGP Gripper 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "ACT-029", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 62, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "ACT-030", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "ACT-031", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs uart）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "ACT-032", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "ACT-mosrac-whg240", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明通信协议，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "ACT-figure-03-helix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "ACT-tienkung-ultra", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-002", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-004", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-005", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-006", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-007", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-008", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs can/spi/i2c/uart）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs can/spi/i2c/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs can/spi/i2c/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "SENS-31", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "Robotiq FT 300 Force-Torque Sensor 未声明通信协议，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": true, "score": 1, "notes": "安装侧接口一致: ISO9409-1-50-4-M6/ISO9409-1-31.5-4-M5/ISO9409-1-40-4-M6 —— 二者可装在同一法兰上（可互换选型）；能否彼此对接需一方声明工具侧接口，双方均未声明，对接关系不判定", "relation": "interchangeable" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Robotiq FT 300 Force-Torque Sensor 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "flange_mount", "force_profile": { "force_senses": [ "axial_load", "bolt_torque" ], "guidance": "螺栓法兰对接：力觉策略应关注轴向载荷与拧紧扭矩；参考两侧 component.modality_details.force.torque_nm" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: rs485" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: rs485/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "GRIPPER-ONR-VG1", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 声明了「io_link」但不在可比对通信协议词表内（我方能力边界，非厂商缺数据），无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/modbus/usb/ethernet/tcp vs ethercat）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: modbus" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-028", "b": "BIONIC-HAND-002", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "Yeah Robotic Hand (formerly Rebelia) 未声明通信协议，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": false, "score": 0, "notes": "机械接口无交集（安装侧 ISO9409-1-50-4-M6/ISO9409-1-31.5-4-M5/ISO9409-1-40-4-M6 vs ISO9409-1/50MM）", "relation": "none" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Yeah Robotic Hand (formerly Rebelia) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "flange_mount", "force_profile": { "force_senses": [ "axial_load", "bolt_torque" ], "guidance": "螺栓法兰对接：力觉策略应关注轴向载荷与拧紧扭矩；参考两侧 component.modality_details.force.torque_nm" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "ACT-030", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Shadow Dexterous Hand 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "3 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "ACT-031", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs uart）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Lynxmotion LSS Arm 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "ACT-032", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Agility Robotics Digit Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "ACT-mosrac-whg240", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明通信协议，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Mosrac WHG-240 Frameless BLDC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "ACT-figure-03-helix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Figure 03 Helix Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "ACT-tienkung-ultra", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Tien Kung Ultra Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；NVIDIA Jetson Orin NX 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-002", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；NVIDIA Jetson AGX Orin 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Raspberry Pi 5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-004", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/spi/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；STM32H743 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-005", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/spi/i2c/uart/usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；ESP32-S3 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-006", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/spi/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Teensy 4.1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-007", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-008", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；NVIDIA Jetson Thor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Qualcomm RB6 (QCS6490) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Intel RealSense D455 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Hailo-8 M.2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Google Coral TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/spi/i2c/uart）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/spi/i2c/uart/usb/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/spi/i2c/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/spi/i2c/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs usb/pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/usb/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs spi/i2c/usb/pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/rs485）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/spi/ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "GRIPPER-ONR-VG1", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 声明了「io_link」但不在可比对通信协议词表内（我方能力边界，非厂商缺数据），无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；OnRobot VG1 气动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-029", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs modbus）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Dexai Allegro Hand v4 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "ACT-031", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs uart）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Lynxmotion LSS Arm 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 3, "undecided_dimensions": 1, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "ACT-032", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "双方均为专有总线，字面相同不代表互通，需厂商网关" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Agility Robotics Digit Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "ACT-mosrac-whg240", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明通信协议，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Mosrac WHG-240 Frameless BLDC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "ACT-figure-03-helix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "双方均为专有总线，字面相同不代表互通，需厂商网关" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Figure 03 Helix Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "ACT-tienkung-ultra", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "双方均为专有总线，字面相同不代表互通，需厂商网关" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Tien Kung Ultra Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；NVIDIA Jetson Orin NX 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-002", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；NVIDIA Jetson AGX Orin 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Raspberry Pi 5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-004", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；STM32H743 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-005", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；ESP32-S3 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-006", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Teensy 4.1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-007", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-008", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；NVIDIA Jetson Thor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Qualcomm RB6 (QCS6490) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Intel RealSense D455 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Hailo-8 M.2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Google Coral TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs can/spi/i2c/uart）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs can/spi/i2c/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs can/spi/i2c/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs can/rs485）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs can/spi/ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "GRIPPER-ONR-VG1", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 声明了「io_link」但不在可比对通信协议词表内（我方能力边界，非厂商缺数据），无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；OnRobot VG1 气动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-030", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/usb/proprietary vs modbus）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Shadow Dexterous Hand 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "ACT-032", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；Agility Robotics Digit Actuator 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "ACT-mosrac-whg240", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明通信协议，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；Mosrac WHG-240 Frameless BLDC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "ACT-figure-03-helix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；Figure 03 Helix Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "ACT-tienkung-ultra", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs proprietary）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；Tien Kung Ultra Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-001", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；NVIDIA Jetson Orin NX 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-002", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；NVIDIA Jetson AGX Orin 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-003", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；Raspberry Pi 5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-004", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；STM32H743 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-005", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；ESP32-S3 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-006", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；Teensy 4.1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-007", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-008", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；NVIDIA Jetson Thor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-009", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；Qualcomm RB6 (QCS6490) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；Intel RealSense D455 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；Hailo-8 M.2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；Google Coral TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs can/spi/i2c/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs ethercat/can/spi/i2c/usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs can/spi/i2c/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs usb/pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs can/usb/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs spi/i2c/usb/pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs can/rs485）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs can/spi/ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "GRIPPER-ONR-VG1", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 声明了「io_link」但不在可比对通信协议词表内（我方能力边界，非厂商缺数据），无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；OnRobot VG1 气动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs ethercat）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs ethercat）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-031", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（uart vs modbus）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Lynxmotion LSS Arm 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "ACT-figure-03-helix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "双方均为专有总线，字面相同不代表互通，需厂商网关" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；Figure 03 Helix Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "ACT-tienkung-ultra", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "双方均为专有总线，字面相同不代表互通，需厂商网关" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；Tien Kung Ultra Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；NVIDIA Jetson Orin NX 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-002", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；NVIDIA Jetson AGX Orin 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；Raspberry Pi 5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-004", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；STM32H743 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-005", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；ESP32-S3 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-006", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；Teensy 4.1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-007", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-008", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；NVIDIA Jetson Thor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；Qualcomm RB6 (QCS6490) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；Intel RealSense D455 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；Hailo-8 M.2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；Google Coral TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/usb/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethercat/can/spi/i2c/usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethercat/can/spi/i2c/uart/usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb/pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/usb/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs spi/i2c/usb/pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/rs485）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-032", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Agility Robotics Digit Actuator 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-mosrac-whg240", "b": "GRIPPER-ONR-VG1", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明通信协议；OnRobot VG1 气动夹爪 声明了「io_link」但不在可比对通信协议词表内（我方能力边界，非厂商缺数据），无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明机械接口；OnRobot VG1 气动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-mosrac-whg240", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明通信协议，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-mosrac-whg240", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明通信协议，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-mosrac-whg240", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明通信协议，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": false, "score": 0, "notes": "电压区间不重叠" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Mosrac WHG-240 Frameless BLDC 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "ACT-tienkung-ultra", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "双方均为专有总线，字面相同不代表互通，需厂商网关" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；Tien Kung Ultra Actuator System 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；NVIDIA Jetson Orin NX 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-002", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；NVIDIA Jetson AGX Orin 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；Raspberry Pi 5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-004", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；STM32H743 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-005", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；ESP32-S3 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-006", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；Teensy 4.1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-007", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-008", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；NVIDIA Jetson Thor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；Qualcomm RB6 (QCS6490) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；Intel RealSense D455 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；Hailo-8 M.2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；Google Coral TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/usb/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethercat/can/spi/i2c/usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethercat/can/spi/i2c/uart/usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb/pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/usb/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs spi/i2c/usb/pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/rs485）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-figure-03-helix", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Figure 03 Helix Actuator System 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；NVIDIA Jetson Orin NX 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-002", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；NVIDIA Jetson AGX Orin 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；Raspberry Pi 5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-004", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；STM32H743 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-005", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；ESP32-S3 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-006", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；Teensy 4.1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-007", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-008", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；NVIDIA Jetson Thor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；Qualcomm RB6 (QCS6490) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；Intel RealSense D455 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；Hailo-8 M.2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；Google Coral TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/usb/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethercat/can/spi/i2c/usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/i2c/uart/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethercat/can/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethercat/can/spi/i2c/uart/usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb/pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/usb/pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs spi/i2c/usb/pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/rs485）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-tienkung-ultra", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（proprietary vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Tien Kung Ultra Actuator System 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-002", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；NVIDIA Jetson AGX Orin 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-003", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；Raspberry Pi 5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-004", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；STM32H743 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-005", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；ESP32-S3 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-006", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；Teensy 4.1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-007", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-008", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；NVIDIA Jetson Thor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-009", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；Qualcomm RB6 (QCS6490) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-010", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；Intel RealSense D455 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；Hailo-8 M.2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-012", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；Google Coral TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-001", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Orin NX 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-003", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；Raspberry Pi 5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-004", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；STM32H743 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-005", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；ESP32-S3 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-006", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；Teensy 4.1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-007", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-008", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；NVIDIA Jetson Thor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-009", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；Qualcomm RB6 (QCS6490) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-010", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；Intel RealSense D455 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；Hailo-8 M.2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-012", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；Google Coral TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-002", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson AGX Orin 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-004", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；STM32H743 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-005", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；ESP32-S3 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-006", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；Teensy 4.1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-007", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-008", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；NVIDIA Jetson Thor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-009", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；Qualcomm RB6 (QCS6490) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-010", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；Intel RealSense D455 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；Hailo-8 M.2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-012", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；Google Coral TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart/pcie/mipi vs can/rs485）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart/pcie/mipi vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart/pcie/mipi vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart/pcie/mipi vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart/pcie/mipi vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart/pcie/mipi vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-003", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart/pcie/mipi vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Raspberry Pi 5 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-005", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；ESP32-S3 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-006", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；Teensy 4.1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-007", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-008", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；NVIDIA Jetson Thor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-009", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；Qualcomm RB6 (QCS6490) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；Intel RealSense D455 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；Hailo-8 M.2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；Google Coral TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/i2c/uart/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-004", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "STM32H743 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-006", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；Teensy 4.1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-007", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-008", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；NVIDIA Jetson Thor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-009", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；Qualcomm RB6 (QCS6490) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb/wifi vs mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；Intel RealSense D455 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb/wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；Hailo-8 M.2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb/wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；Google Coral TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb/wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb/wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb/wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb/wifi vs pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb/wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb/wifi vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb/wifi vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb/wifi vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb/wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb/wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb/wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb/wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb/wifi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb/wifi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: wifi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb/wifi vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb/wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb/wifi vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb/wifi vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb/wifi vs pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb/wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb/wifi vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb/wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb/wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb/wifi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb/wifi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/i2c/uart/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/wifi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb/wifi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb/wifi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb/wifi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-005", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb/wifi vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ESP32-S3 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-007", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-008", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；NVIDIA Jetson Thor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-009", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；Qualcomm RB6 (QCS6490) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；Intel RealSense D455 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；Hailo-8 M.2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；Google Coral TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/i2c/uart/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-006", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Teensy 4.1 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-008", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；NVIDIA Jetson Thor 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-009", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Qualcomm RB6 (QCS6490) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-010", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Intel RealSense D455 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Hailo-8 M.2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-012", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Google Coral TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart/pcie/mipi vs can/rs485）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart/pcie/mipi vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart/pcie/mipi vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart/pcie/mipi vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart/pcie/mipi vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart/pcie/mipi vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-007", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/uart/pcie/mipi vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-009", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；Qualcomm RB6 (QCS6490) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-010", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；Intel RealSense D455 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；Hailo-8 M.2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-012", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；Google Coral TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-008", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-010", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；Intel RealSense D455 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；Hailo-8 M.2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-012", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；Google Coral TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-009", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 (QCS6490) 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（mipi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；Hailo-8 M.2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（mipi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；Google Coral TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（mipi vs can/spi/i2c/uart）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（mipi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（mipi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（mipi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（mipi vs ethercat/can/spi/i2c/usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（mipi vs ethercat/can/spi/i2c/uart/usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（mipi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（mipi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（mipi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（mipi vs usb/pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（mipi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（mipi vs spi/i2c/usb/pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（mipi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（mipi vs can/rs485）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（mipi vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（mipi vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（mipi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（mipi vs pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（mipi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（mipi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（mipi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（mipi vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（mipi vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（mipi vs can/spi/ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（mipi vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（mipi vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（mipi vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（mipi vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（mipi vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-010", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（mipi vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel RealSense D455 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-012", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；Google Coral TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/spi/i2c/uart）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ethercat/can/spi/i2c/usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ethercat/can/spi/i2c/uart/usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/rs485）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/spi/ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-011", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 M.2 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-013", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；NXP i.MX 8M Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/spi/i2c/uart）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ethercat/can/spi/i2c/usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ethercat/can/spi/i2c/uart/usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/rs485）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/spi/ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-012", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral TPU 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-014", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；TI TDA4VM 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-013", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NXP i.MX 8M Plus 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-015", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；Infineon AURIX TC397 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-014", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VM 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-016", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；Renesas RZ/V2H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart vs pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart vs usb/pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart vs pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": false, "compatibility_score": 37, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-015", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Infineon AURIX TC397 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-017", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；AMD Xilinx Kria K26 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-016", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-018", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；Microchip PolarFire SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-017", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Xilinx Kria K26 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-019", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；Horizon Robotics J5 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/usb/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/usb/pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb/pcie/mipi vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb/pcie/mipi vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/i2c/uart/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-018", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/usb/pcie/mipi vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microchip PolarFire SoC 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "CHIP-020", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；Allwinner T507 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-019", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J5 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "CHIP-qualcomm-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；Qualcomm Dragonwing IQ10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-020", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Allwinner T507 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "CHIP-qualcomm-iq9", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；Qualcomm Dragonwing IQ9 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/pcie/mipi vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/pcie/mipi vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/pcie/mipi vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/pcie/mipi vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/pcie/mipi vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/pcie/mipi vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ10 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "CHIP-intel-core-ultra-s3-edge", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；Intel Core Ultra Series 3 Edge 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq9", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Dragonwing IQ9 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "CHIP-nvidia-thor-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ethercat/can/spi/i2c/usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ethercat/can/spi/i2c/uart/usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/rs485）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/spi/ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-edge", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Edge 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "CHIP-amd-ryzen-ai-2026", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；AMD Ryzen AI Processor 2026 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-v2", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Jetson Thor (2026 BC Award) 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "CHIP-microsoft-braga", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；Microsoft Braga AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ethercat/can/spi/i2c/usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ethercat/can/spi/i2c/uart/usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/rs485）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/spi/ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amd-ryzen-ai-2026", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AMD Ryzen AI Processor 2026 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "CHIP-gigadevice-gd32h7", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ethercat/can/spi/i2c/usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；GigaDevice GD32H7 Series 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ethercat/can/spi/i2c/uart/usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/rs485）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/spi/ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-microsoft-braga", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Microsoft Braga AI Chip 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "CHIP-advantech-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；Advantech Qualcomm IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat/can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat/can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat/can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat/can/spi/i2c/usb/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/spi/i2c/usb/ethernet vs pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/spi/i2c/usb/ethernet vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/spi/i2c/usb/ethernet vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/spi/i2c/usb/ethernet vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/spi/i2c/usb/ethernet vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/usb/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/spi/i2c/usb/ethernet vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/spi/i2c/usb/ethernet vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/spi/i2c/usb/ethernet vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/spi/i2c/usb/ethernet vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/spi/i2c/usb/ethernet vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/spi/i2c/usb/ethernet vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/spi/i2c/usb/ethernet vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/spi/i2c/usb/ethernet vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/spi/i2c/usb/ethernet vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/i2c/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/spi/i2c/usb/ethernet vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Series 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "CHIP-qualcomm-rb6-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；Qualcomm RB6 v2 (QCS8250) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-advantech-iq10", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech Qualcomm IQ10 Platform 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "CHIP-horizon-j6", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；Horizon Robotics J6 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-rb6-v2", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm RB6 v2 (QCS8250) 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "CHIP-renesas-rzv2h-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；Renesas RZ/V2H v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-horizon-j6", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics J6 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "CHIP-ti-tda4vp", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat/can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；TI TDA4VP 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat/can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat/can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-renesas-rzv2h-v2", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Renesas RZ/V2H v2 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "CHIP-mediatek-genio-700", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；MediaTek Genio 700 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat/can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat/can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-tda4vp", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI TDA4VP 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "CHIP-mediatek-edge-ai-7b", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；MediaTek Edge AI Chip (Dual 7B) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/pcie/mipi vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/pcie/mipi vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/pcie/mipi vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/pcie/mipi vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/pcie/mipi vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-genio-700", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/pcie/mipi vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Genio 700 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "CHIP-rockchip-rk3588s-v2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；Rockchip RK3588S v2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-mediatek-edge-ai-7b", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "MediaTek Edge AI Chip (Dual 7B) 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "CHIP-amlogic-a311d2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；Amlogic A311D2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3588s-v2", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588S v2 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "CHIP-intel-core-ultra-s3-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；Intel Core Ultra Series 3 Robotics Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/i2c/uart" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-amlogic-a311d2", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/i2c/uart/pcie/mipi vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Amlogic A311D2 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "CHIP-qualcomm-iq10-advantech", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；Advantech MIC-710AI (IQ10) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-core-ultra-s3-robotics", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel Core Ultra Series 3 Robotics Edition 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "CHIP-gigadevice-gd32h7-robot", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat/can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；GigaDevice GD32H7 Robot Edition 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-qualcomm-iq10-advantech", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/pcie/mipi vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Advantech MIC-710AI (IQ10) 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "CHIP-snapdragon-x2-plus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/spi/i2c/uart/usb/ethernet vs pcie/mipi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；Qualcomm Snapdragon X2 Plus 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/spi/i2c/uart/usb/ethernet vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/spi/i2c/uart/usb/ethernet vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/spi/i2c/uart/usb/ethernet vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/spi/i2c/uart/usb/ethernet vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/i2c/usb/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/spi/i2c/uart/usb/ethernet vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/spi/i2c/uart/usb/ethernet vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/spi/i2c/uart/usb/ethernet vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/spi/i2c/uart/usb/ethernet vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/spi/i2c/uart/usb/ethernet vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/spi/i2c/uart/usb/ethernet vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/spi/i2c/uart/usb/ethernet vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/spi/i2c/uart/usb/ethernet vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/spi/i2c/uart/usb/ethernet vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/i2c/uart/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-gigadevice-gd32h7-robot", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat/can/spi/i2c/uart/usb/ethernet vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GigaDevice GD32H7 Robot Edition 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "CHIP-intel-ces2026-ai", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；Intel CES 2026 AI Chip 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi vs can/rs485）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi vs can/spi/ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-snapdragon-x2-plus", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Qualcomm Snapdragon X2 Plus 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "CHIP-turbox-irb10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；Thundercomm TurboX IRB10 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/rs485）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/spi/ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-intel-ces2026-ai", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Intel CES 2026 AI Chip 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "CHIP-neura-robotics-iq10", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；NEURA Robotics IQ10 Platform 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs can/rs485）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-turbox-irb10", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Thundercomm TurboX IRB10 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "CHIP-nvidia-thor-robotics", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；NVIDIA Thor (Robotics Variant) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs can/rs485）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-neura-robotics-iq10", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NEURA Robotics IQ10 Platform 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-robotics", "b": "CHIP-096", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口；Hailo-8 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-robotics", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-robotics", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-robotics", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-robotics", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-robotics", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-robotics", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-robotics", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-robotics", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-robotics", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-robotics", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-robotics", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-robotics", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs can/rs485）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-robotics", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-robotics", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-robotics", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-robotics", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-robotics", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-robotics", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-robotics", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-robotics", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-robotics", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-robotics", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-robotics", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-robotics", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-robotics", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-robotics", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-robotics", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-robotics", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-robotics", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-robotics", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-robotics", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-robotics", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-robotics", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-robotics", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-robotics", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-robotics", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-robotics", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-robotics", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-robotics", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-robotics", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-robotics", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-robotics", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-robotics", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-nvidia-thor-robotics", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "NVIDIA Thor (Robotics Variant) 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-096", "b": "CHIP-097", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 未声明机械接口；Hailo-10H 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-096", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-096", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-096", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-096", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-096", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-096", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-096", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-096", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-096", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-096", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-096", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/rs485）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-096", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-096", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-096", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-096", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-096", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-096", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-096", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-096", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-096", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-096", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-096", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-096", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-096", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-096", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-096", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-096", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-096", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-096", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-096", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-096", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-096", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-096", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-096", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/spi/ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-096", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-096", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-096", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-096", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-096", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-096", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-096", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-096", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-096", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-8 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-097", "b": "CHIP-098", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-10H 未声明机械接口；Google Coral Edge TPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-097", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-10H 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-097", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-10H 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-097", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-10H 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-097", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-10H 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-097", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-10H 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-097", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-10H 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-097", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-10H 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-097", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-10H 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-097", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-10H 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-097", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/rs485）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-10H 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-097", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-10H 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-097", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-10H 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-097", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-10H 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-097", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-10H 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-097", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-10H 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-097", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-10H 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-097", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-10H 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-097", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-10H 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-097", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-10H 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-097", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-10H 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-097", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-10H 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-097", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-10H 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-097", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-10H 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-097", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-10H 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-097", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-10H 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-097", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-10H 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-097", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-10H 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-097", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-10H 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-097", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-10H 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-097", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-10H 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-097", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-10H 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-097", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-10H 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-097", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/spi/ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-10H 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-097", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-10H 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-097", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-10H 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-097", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-10H 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-097", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-10H 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-097", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-10H 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-097", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-10H 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-097", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-10H 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-097", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-10H 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-097", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Hailo-10H 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-098", "b": "CHIP-099", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral Edge TPU 未声明机械接口；Rockchip RK3588 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-098", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral Edge TPU 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-098", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral Edge TPU 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-098", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral Edge TPU 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-098", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral Edge TPU 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-098", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/pcie vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral Edge TPU 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-098", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/pcie vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral Edge TPU 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-098", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral Edge TPU 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-098", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral Edge TPU 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-098", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/pcie vs can/rs485）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral Edge TPU 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-098", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/pcie vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral Edge TPU 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-098", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/pcie vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral Edge TPU 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-098", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral Edge TPU 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-098", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral Edge TPU 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-098", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral Edge TPU 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-098", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral Edge TPU 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-098", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral Edge TPU 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-098", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral Edge TPU 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-098", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral Edge TPU 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-098", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral Edge TPU 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-098", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral Edge TPU 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-098", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral Edge TPU 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-098", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral Edge TPU 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-098", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral Edge TPU 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-098", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral Edge TPU 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-098", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral Edge TPU 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-098", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral Edge TPU 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-098", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral Edge TPU 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-098", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/pcie vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral Edge TPU 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-098", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/pcie vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral Edge TPU 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-098", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral Edge TPU 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-098", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral Edge TPU 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-098", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/pcie vs can/spi/ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral Edge TPU 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-098", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral Edge TPU 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-098", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral Edge TPU 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-098", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral Edge TPU 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-098", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral Edge TPU 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-098", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral Edge TPU 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-098", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/pcie vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral Edge TPU 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-098", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/pcie vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral Edge TPU 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-098", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/pcie vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral Edge TPU 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-098", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/pcie vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Google Coral Edge TPU 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-099", "b": "CHIP-100", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Horizon Robotics Journey J6M 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-099", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-099", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-099", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-099", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/usb/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-099", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/usb/pcie/mipi vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-099", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-099", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-099", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-099", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/usb/pcie/mipi vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-099", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/usb/pcie/mipi vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-099", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-099", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-099", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-099", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-099", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-099", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-099", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-099", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-099", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-099", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-099", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-099", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-099", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-099", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-099", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-099", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-099", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/usb/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-099", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/usb/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-099", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-099", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-099", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-099", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-099", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-099", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-099", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-099", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-099", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/usb/pcie/mipi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-099", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/usb/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-099", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/usb/pcie/mipi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-099", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/usb/pcie/mipi vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Rockchip RK3588 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-100", "b": "CHIP-101", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics Journey J6M 未声明机械接口；Cambricon MLU220 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-100", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics Journey J6M 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-100", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics Journey J6M 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-100", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi/ethernet vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics Journey J6M 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-100", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi/ethernet vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics Journey J6M 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-100", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi/ethernet vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics Journey J6M 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-100", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi/ethernet vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics Journey J6M 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-100", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics Journey J6M 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-100", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi/ethernet vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics Journey J6M 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-100", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi/ethernet vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics Journey J6M 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-100", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi/ethernet vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics Journey J6M 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-100", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi/ethernet vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics Journey J6M 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-100", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics Journey J6M 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-100", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics Journey J6M 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-100", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics Journey J6M 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-100", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics Journey J6M 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-100", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics Journey J6M 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-100", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics Journey J6M 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-100", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics Journey J6M 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-100", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics Journey J6M 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-100", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics Journey J6M 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-100", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics Journey J6M 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-100", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics Journey J6M 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-100", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics Journey J6M 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-100", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi/ethernet vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics Journey J6M 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-100", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics Journey J6M 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-100", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics Journey J6M 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-100", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics Journey J6M 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-100", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi/ethernet vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics Journey J6M 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-100", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi/ethernet vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics Journey J6M 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-100", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics Journey J6M 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-100", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics Journey J6M 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-100", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics Journey J6M 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-100", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi/ethernet vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics Journey J6M 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-100", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi/ethernet vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics Journey J6M 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-100", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi/ethernet vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics Journey J6M 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-100", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics Journey J6M 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-100", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi/ethernet vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics Journey J6M 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-100", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi/ethernet vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics Journey J6M 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-100", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi/ethernet vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Horizon Robotics Journey J6M 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-101", "b": "CHIP-102", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Cambricon MLU220 未声明机械接口；Huawei Ascend 310B 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-101", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Cambricon MLU220 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-101", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Cambricon MLU220 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-101", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Cambricon MLU220 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-101", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Cambricon MLU220 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-101", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Cambricon MLU220 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-101", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/rs485）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Cambricon MLU220 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-101", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Cambricon MLU220 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-101", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Cambricon MLU220 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-101", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Cambricon MLU220 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-101", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Cambricon MLU220 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-101", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Cambricon MLU220 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-101", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Cambricon MLU220 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-101", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Cambricon MLU220 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-101", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Cambricon MLU220 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-101", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Cambricon MLU220 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-101", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Cambricon MLU220 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-101", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Cambricon MLU220 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-101", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Cambricon MLU220 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-101", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Cambricon MLU220 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-101", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Cambricon MLU220 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-101", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Cambricon MLU220 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-101", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Cambricon MLU220 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-101", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Cambricon MLU220 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-101", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Cambricon MLU220 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-101", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Cambricon MLU220 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-101", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Cambricon MLU220 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-101", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Cambricon MLU220 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-101", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Cambricon MLU220 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-101", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/spi/ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Cambricon MLU220 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-101", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Cambricon MLU220 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-101", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Cambricon MLU220 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-101", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Cambricon MLU220 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-101", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Cambricon MLU220 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-101", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Cambricon MLU220 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-101", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Cambricon MLU220 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-101", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Cambricon MLU220 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-101", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Cambricon MLU220 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-101", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Cambricon MLU220 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-102", "b": "CHIP-103", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Huawei Ascend 310B 未声明机械接口；Kinara Ara-2 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-102", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/usb/pcie/ethernet vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Huawei Ascend 310B 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-102", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/usb/pcie/ethernet vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Huawei Ascend 310B 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-102", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Huawei Ascend 310B 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-102", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Huawei Ascend 310B 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-102", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/usb/pcie/ethernet vs can/rs485）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Huawei Ascend 310B 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-102", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/usb/pcie/ethernet vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Huawei Ascend 310B 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-102", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/usb/pcie/ethernet vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Huawei Ascend 310B 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-102", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Huawei Ascend 310B 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-102", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Huawei Ascend 310B 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-102", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Huawei Ascend 310B 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-102", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/pcie/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Huawei Ascend 310B 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-102", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Huawei Ascend 310B 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-102", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Huawei Ascend 310B 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-102", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Huawei Ascend 310B 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-102", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Huawei Ascend 310B 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-102", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/pcie/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Huawei Ascend 310B 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-102", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Huawei Ascend 310B 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-102", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/pcie/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Huawei Ascend 310B 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-102", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Huawei Ascend 310B 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-102", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Huawei Ascend 310B 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-102", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Huawei Ascend 310B 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-102", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Huawei Ascend 310B 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-102", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Huawei Ascend 310B 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-102", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Huawei Ascend 310B 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-102", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Huawei Ascend 310B 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-102", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Huawei Ascend 310B 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-102", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Huawei Ascend 310B 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-102", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Huawei Ascend 310B 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-102", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: spi/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Huawei Ascend 310B 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-102", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Huawei Ascend 310B 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-102", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Huawei Ascend 310B 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-102", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Huawei Ascend 310B 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-102", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Huawei Ascend 310B 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-102", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Huawei Ascend 310B 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-102", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/usb/pcie/ethernet vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Huawei Ascend 310B 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-102", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/usb/pcie/ethernet vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Huawei Ascend 310B 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-102", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（spi/i2c/usb/pcie/ethernet vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Huawei Ascend 310B 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-103", "b": "DATA-001", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinara Ara-2 未声明机械接口；ALOHA (LeRobot) 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-103", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs dynamixel）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinara Ara-2 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-103", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinara Ara-2 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-103", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinara Ara-2 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-103", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/rs485）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinara Ara-2 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-103", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinara Ara-2 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-103", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinara Ara-2 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-103", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinara Ara-2 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-103", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinara Ara-2 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-103", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinara Ara-2 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-103", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinara Ara-2 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-103", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinara Ara-2 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-103", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinara Ara-2 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-103", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinara Ara-2 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-103", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinara Ara-2 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-103", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinara Ara-2 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-103", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinara Ara-2 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-103", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinara Ara-2 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-103", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinara Ara-2 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-103", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinara Ara-2 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-103", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinara Ara-2 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-103", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinara Ara-2 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-103", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinara Ara-2 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-103", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinara Ara-2 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-103", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinara Ara-2 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-103", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinara Ara-2 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-103", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinara Ara-2 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-103", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/spi/ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinara Ara-2 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-103", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinara Ara-2 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-103", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinara Ara-2 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-103", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinara Ara-2 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-103", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinara Ara-2 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-103", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinara Ara-2 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-103", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinara Ara-2 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-103", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinara Ara-2 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-103", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinara Ara-2 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-103", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Kinara Ara-2 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-31", "b": "BIONIC-HAND-002", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "Robotiq FT 300 Force-Torque Sensor 未声明通信协议；Yeah Robotic Hand (formerly Rebelia) 未声明通信协议，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": false, "score": 0, "notes": "机械接口无交集（安装侧 ISO9409-1-50-4-M6/ISO9409-1-31.5-4-M5/ISO9409-1-40-4-M6 vs ISO9409-1/50MM）", "relation": "none" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "flange_mount", "force_profile": { "force_senses": [ "axial_load", "bolt_torque" ], "guidance": "螺栓法兰对接：力觉策略应关注轴向载荷与拧紧扭矩；参考两侧 component.modality_details.force.torque_nm" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-001", "b": "DATA-003", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: dynamixel" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明机械接口；GELLO 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-001", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-001", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-001", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs can/rs485）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-001", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-001", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-001", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-001", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-001", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-001", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-001", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-001", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-001", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-001", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-001", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-001", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-001", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-001", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-001", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-001", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-001", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-001", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-001", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-001", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-001", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-001", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-001", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs can/spi/ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-001", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-001", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-001", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-001", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-001", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-001", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-001", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-001", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-001", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ALOHA (LeRobot) 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-003", "b": "DATA-009", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GELLO 未声明机械接口；GelSight Mini 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-003", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GELLO 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-003", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs can/rs485）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GELLO 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-003", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GELLO 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-003", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GELLO 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-003", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GELLO 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-003", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GELLO 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-003", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GELLO 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-003", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GELLO 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-003", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GELLO 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-003", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GELLO 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-003", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GELLO 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-003", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GELLO 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-003", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GELLO 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-003", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GELLO 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-003", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GELLO 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-003", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GELLO 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-003", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GELLO 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-003", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GELLO 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GELLO 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-003", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GELLO 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-003", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GELLO 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-003", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GELLO 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-003", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GELLO 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-003", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GELLO 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-003", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GELLO 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-003", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs can/spi/ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GELLO 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-003", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GELLO 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-003", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GELLO 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-003", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GELLO 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-003", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GELLO 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-003", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GELLO 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-003", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GELLO 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-003", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GELLO 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-003", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GELLO 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-003", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（dynamixel vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GELLO 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-009", "b": "DATA-010", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明机械接口；Meta DIGIT 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-009", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/ros2 vs can/rs485）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-009", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/ros2 vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-009", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ros2" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-009", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-009", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-009", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/ros2 vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-009", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-009", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/ros2 vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-009", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/ros2 vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-009", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/ros2 vs pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-009", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/ros2 vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-009", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-009", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/ros2 vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-009", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-009", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/ros2 vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-009", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/ros2 vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-009", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/ros2 vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-009", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/ros2" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-009", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-009", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ros2" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-009", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ros2" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-009", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/ros2" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-009", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/ros2" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-009", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ros2" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-009", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-009", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-009", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/ros2" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-009", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-009", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-009", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ros2" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-009", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/ros2 vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-009", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/ros2 vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-009", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/ros2 vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelSight Mini 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-010", "b": "DATA-011", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs can/rs485）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明机械接口；DM-Tac W系列 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-010", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-010", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-010", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-010", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-010", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-010", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-010", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-010", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-010", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-010", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-010", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-010", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-010", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-010", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-010", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-010", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-010", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-010", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-010", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-010", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-010", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-010", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-010", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs can/spi/ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-010", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-010", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-010", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-010", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-010", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-010", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-010", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-010", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-010", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Meta DIGIT 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-011", "b": "DATA-012", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs485 vs wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明机械接口；TachinGlove 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-011", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs485 vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-011", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs485 vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-011", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs485 vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-011", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs485 vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-011", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs485 vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-011", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs485 vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-011", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs485 vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-011", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs485 vs pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-011", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs485 vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-011", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs485 vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-011", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs485 vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-011", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs485 vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-011", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-011", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs485 vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-011", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs485 vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-011", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs485 vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-011", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs485 vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-011", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs485 vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-011", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs485 vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-011", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: rs485" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-011", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs485 vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-011", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-011", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-011", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-011", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs485 vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-011", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs485 vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-011", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs485 vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-011", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs485 vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-011", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs485 vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-011", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs485 vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-011", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/rs485 vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DM-Tac W系列 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-012", "b": "DATA-015", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（wifi vs ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TachinGlove 未声明机械接口；GelFinger GF225 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-012", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（wifi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TachinGlove 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-012", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（wifi vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TachinGlove 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-012", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TachinGlove 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-012", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（wifi vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TachinGlove 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-012", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（wifi vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TachinGlove 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-012", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（wifi vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TachinGlove 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-012", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（wifi vs pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TachinGlove 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-012", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TachinGlove 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-012", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（wifi vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TachinGlove 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-012", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（wifi vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TachinGlove 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-012", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（wifi vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TachinGlove 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-012", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（wifi vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TachinGlove 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-012", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TachinGlove 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-012", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（wifi vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TachinGlove 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "TachinGlove 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-012", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（wifi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TachinGlove 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-012", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（wifi vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TachinGlove 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-012", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（wifi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TachinGlove 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-012", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（wifi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TachinGlove 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-012", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（wifi vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TachinGlove 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-012", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（wifi vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TachinGlove 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-012", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（wifi vs can/spi/ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TachinGlove 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-012", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（wifi vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TachinGlove 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-012", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（wifi vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TachinGlove 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-012", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（wifi vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TachinGlove 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-012", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（wifi vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TachinGlove 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-012", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: wifi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TachinGlove 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-012", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（wifi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TachinGlove 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-012", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（wifi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TachinGlove 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-012", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（wifi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TachinGlove 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-012", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（wifi vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TachinGlove 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-015", "b": "DATA-glove-doglove", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ros2 vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明机械接口；DOGlove 力反馈数据手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-015", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ros2 vs usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-015", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ros2 vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-015", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ros2 vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-015", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ros2 vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-015", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ros2 vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-015", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ros2 vs pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-015", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ros2 vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-015", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ros2 vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-015", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ros2 vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-015", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ros2 vs usb/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-015", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ros2 vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-015", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ros2 vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-015", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ros2 vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-015", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ros2" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-015", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ros2 vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-015", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ros2" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-015", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ros2" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-015", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ros2" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-015", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ros2" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-015", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ros2" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-015", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ros2 vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-015", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ros2 vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-015", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ros2" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-015", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ros2 vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-015", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ros2 vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-015", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ros2" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-015", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ros2 vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-015", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ros2 vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-015", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ros2 vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "GelFinger GF225 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-doglove", "b": "DATA-glove-manus-quantum", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明机械接口；Manus Quantum Metagloves 动捕手套 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-doglove", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-doglove", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-doglove", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-doglove", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-doglove", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-doglove", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-doglove", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-doglove", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-doglove", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-doglove", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-doglove", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-doglove", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-doglove", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-doglove", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-doglove", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-doglove", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-doglove", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-doglove", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-doglove", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs can/spi/ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-doglove", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-doglove", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-doglove", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-doglove", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-doglove", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-doglove", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-doglove", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-doglove", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-doglove", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DOGlove 力反馈数据手套 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-manus-quantum", "b": "CHIP-axelera-metis-aipu", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明机械接口；Axelera Metis AIPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-manus-quantum", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-manus-quantum", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-manus-quantum", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-manus-quantum", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs pcie/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-manus-quantum", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-manus-quantum", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-manus-quantum", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-manus-quantum", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-manus-quantum", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs can/pcie/mipi/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-manus-quantum", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-manus-quantum", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs pcie）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-manus-quantum", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-manus-quantum", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-manus-quantum", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-manus-quantum", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-manus-quantum", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-manus-quantum", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-manus-quantum", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs can/spi/ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-manus-quantum", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-manus-quantum", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-manus-quantum", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-manus-quantum", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-manus-quantum", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-manus-quantum", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-manus-quantum", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-manus-quantum", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "DATA-glove-manus-quantum", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Manus Quantum Metagloves 动捕手套 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axelera-metis-aipu", "b": "CHIP-axera-ax650n", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Axelera Metis AIPU 未声明机械接口；爱芯元智 AX650N 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axelera-metis-aipu", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Axelera Metis AIPU 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axelera-metis-aipu", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Axelera Metis AIPU 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axelera-metis-aipu", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Axelera Metis AIPU 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axelera-metis-aipu", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Axelera Metis AIPU 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axelera-metis-aipu", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Axelera Metis AIPU 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axelera-metis-aipu", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Axelera Metis AIPU 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axelera-metis-aipu", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Axelera Metis AIPU 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axelera-metis-aipu", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Axelera Metis AIPU 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axelera-metis-aipu", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Axelera Metis AIPU 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axelera-metis-aipu", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Axelera Metis AIPU 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axelera-metis-aipu", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Axelera Metis AIPU 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axelera-metis-aipu", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Axelera Metis AIPU 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axelera-metis-aipu", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Axelera Metis AIPU 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axelera-metis-aipu", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Axelera Metis AIPU 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axelera-metis-aipu", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Axelera Metis AIPU 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axelera-metis-aipu", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Axelera Metis AIPU 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axelera-metis-aipu", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/spi/ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Axelera Metis AIPU 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axelera-metis-aipu", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Axelera Metis AIPU 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axelera-metis-aipu", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Axelera Metis AIPU 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axelera-metis-aipu", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Axelera Metis AIPU 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axelera-metis-aipu", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Axelera Metis AIPU 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axelera-metis-aipu", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Axelera Metis AIPU 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axelera-metis-aipu", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Axelera Metis AIPU 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axelera-metis-aipu", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Axelera Metis AIPU 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axelera-metis-aipu", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Axelera Metis AIPU 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axelera-metis-aipu", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Axelera Metis AIPU 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax650n", "b": "CHIP-axera-ax8850", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX650N 未声明机械接口；爱芯元智 AX8850 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax650n", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX650N 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax650n", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX650N 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax650n", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX650N 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax650n", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX650N 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax650n", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX650N 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax650n", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX650N 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax650n", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX650N 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax650n", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX650N 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax650n", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX650N 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax650n", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX650N 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax650n", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX650N 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax650n", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX650N 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax650n", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX650N 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax650n", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX650N 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax650n", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX650N 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax650n", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX650N 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax650n", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX650N 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax650n", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX650N 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax650n", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX650N 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax650n", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX650N 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax650n", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX650N 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax650n", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX650N 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax650n", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/pcie/mipi/ethernet vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX650N 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax650n", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/pcie/mipi/ethernet vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX650N 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax650n", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/pcie/mipi/ethernet vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX650N 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax8850", "b": "CHIP-blacksesame-huashan-a2000", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX8850 未声明机械接口；黑芝麻智能 华山 A2000 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax8850", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX8850 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax8850", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX8850 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax8850", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX8850 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax8850", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX8850 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax8850", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX8850 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax8850", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX8850 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax8850", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX8850 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax8850", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX8850 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax8850", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX8850 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax8850", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX8850 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax8850", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX8850 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax8850", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX8850 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax8850", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX8850 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax8850", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX8850 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax8850", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX8850 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax8850", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX8850 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax8850", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX8850 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax8850", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX8850 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax8850", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX8850 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax8850", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX8850 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax8850", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX8850 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax8850", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX8850 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax8850", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX8850 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-axera-ax8850", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "爱芯元智 AX8850 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-blacksesame-huashan-a2000", "b": "CHIP-sophgo-bm1684x", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "黑芝麻智能 华山 A2000 未声明机械接口；算能 SOPHON BM1684X 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-blacksesame-huashan-a2000", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "黑芝麻智能 华山 A2000 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-blacksesame-huashan-a2000", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "黑芝麻智能 华山 A2000 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-blacksesame-huashan-a2000", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "黑芝麻智能 华山 A2000 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-blacksesame-huashan-a2000", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "黑芝麻智能 华山 A2000 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-blacksesame-huashan-a2000", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "黑芝麻智能 华山 A2000 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-blacksesame-huashan-a2000", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "黑芝麻智能 华山 A2000 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-blacksesame-huashan-a2000", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "黑芝麻智能 华山 A2000 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-blacksesame-huashan-a2000", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "黑芝麻智能 华山 A2000 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-blacksesame-huashan-a2000", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "黑芝麻智能 华山 A2000 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-blacksesame-huashan-a2000", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "黑芝麻智能 华山 A2000 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-blacksesame-huashan-a2000", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "黑芝麻智能 华山 A2000 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-blacksesame-huashan-a2000", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "黑芝麻智能 华山 A2000 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-blacksesame-huashan-a2000", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "黑芝麻智能 华山 A2000 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-blacksesame-huashan-a2000", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "黑芝麻智能 华山 A2000 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-blacksesame-huashan-a2000", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "黑芝麻智能 华山 A2000 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-blacksesame-huashan-a2000", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "黑芝麻智能 华山 A2000 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-blacksesame-huashan-a2000", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "黑芝麻智能 华山 A2000 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-blacksesame-huashan-a2000", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "黑芝麻智能 华山 A2000 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-blacksesame-huashan-a2000", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "黑芝麻智能 华山 A2000 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-blacksesame-huashan-a2000", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "黑芝麻智能 华山 A2000 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-blacksesame-huashan-a2000", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "黑芝麻智能 华山 A2000 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-blacksesame-huashan-a2000", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "黑芝麻智能 华山 A2000 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-blacksesame-huashan-a2000", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "黑芝麻智能 华山 A2000 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-sophgo-bm1684x", "b": "CHIP-cambricon-mlu370-s4", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "算能 SOPHON BM1684X 未声明机械接口；寒武纪 MLU370-S4 推理加速卡 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-sophgo-bm1684x", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "算能 SOPHON BM1684X 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-sophgo-bm1684x", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "算能 SOPHON BM1684X 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-sophgo-bm1684x", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "算能 SOPHON BM1684X 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-sophgo-bm1684x", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "算能 SOPHON BM1684X 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-sophgo-bm1684x", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "算能 SOPHON BM1684X 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-sophgo-bm1684x", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "算能 SOPHON BM1684X 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-sophgo-bm1684x", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/ethernet vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "算能 SOPHON BM1684X 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-sophgo-bm1684x", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "算能 SOPHON BM1684X 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-sophgo-bm1684x", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "算能 SOPHON BM1684X 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-sophgo-bm1684x", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "算能 SOPHON BM1684X 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-sophgo-bm1684x", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/ethernet vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "算能 SOPHON BM1684X 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-sophgo-bm1684x", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/ethernet vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "算能 SOPHON BM1684X 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-sophgo-bm1684x", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "算能 SOPHON BM1684X 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-sophgo-bm1684x", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/ethernet vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "算能 SOPHON BM1684X 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-sophgo-bm1684x", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/ethernet vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "算能 SOPHON BM1684X 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-sophgo-bm1684x", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/ethernet vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "算能 SOPHON BM1684X 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-sophgo-bm1684x", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/ethernet vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "算能 SOPHON BM1684X 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-sophgo-bm1684x", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/ethernet vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "算能 SOPHON BM1684X 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-sophgo-bm1684x", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "算能 SOPHON BM1684X 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-sophgo-bm1684x", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/ethernet vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "算能 SOPHON BM1684X 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-sophgo-bm1684x", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/ethernet vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "算能 SOPHON BM1684X 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-sophgo-bm1684x", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/ethernet vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "算能 SOPHON BM1684X 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-cambricon-mlu370-s4", "b": "CHIP-rockchip-rk3576", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "寒武纪 MLU370-S4 推理加速卡 未声明机械接口；瑞芯微 RK3576 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-cambricon-mlu370-s4", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "寒武纪 MLU370-S4 推理加速卡 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-cambricon-mlu370-s4", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "寒武纪 MLU370-S4 推理加速卡 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-cambricon-mlu370-s4", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "寒武纪 MLU370-S4 推理加速卡 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-cambricon-mlu370-s4", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "寒武纪 MLU370-S4 推理加速卡 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-cambricon-mlu370-s4", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "寒武纪 MLU370-S4 推理加速卡 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-cambricon-mlu370-s4", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "寒武纪 MLU370-S4 推理加速卡 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-cambricon-mlu370-s4", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "寒武纪 MLU370-S4 推理加速卡 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-cambricon-mlu370-s4", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "寒武纪 MLU370-S4 推理加速卡 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-cambricon-mlu370-s4", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "寒武纪 MLU370-S4 推理加速卡 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-cambricon-mlu370-s4", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "寒武纪 MLU370-S4 推理加速卡 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-cambricon-mlu370-s4", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "寒武纪 MLU370-S4 推理加速卡 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-cambricon-mlu370-s4", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/spi/ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "寒武纪 MLU370-S4 推理加速卡 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-cambricon-mlu370-s4", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "寒武纪 MLU370-S4 推理加速卡 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-cambricon-mlu370-s4", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "寒武纪 MLU370-S4 推理加速卡 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-cambricon-mlu370-s4", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "寒武纪 MLU370-S4 推理加速卡 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-cambricon-mlu370-s4", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "寒武纪 MLU370-S4 推理加速卡 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-cambricon-mlu370-s4", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "寒武纪 MLU370-S4 推理加速卡 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-cambricon-mlu370-s4", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "寒武纪 MLU370-S4 推理加速卡 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-cambricon-mlu370-s4", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "寒武纪 MLU370-S4 推理加速卡 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-cambricon-mlu370-s4", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "寒武纪 MLU370-S4 推理加速卡 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-cambricon-mlu370-s4", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "寒武纪 MLU370-S4 推理加速卡 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3576", "b": "CHIP-simaai-modalix", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "瑞芯微 RK3576 未声明机械接口；SiMa.ai MLSoC Modalix 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3576", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "瑞芯微 RK3576 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3576", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "瑞芯微 RK3576 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均原生支持 ROS2" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3576", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "瑞芯微 RK3576 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3576", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "瑞芯微 RK3576 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3576", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "瑞芯微 RK3576 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3576", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "瑞芯微 RK3576 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3576", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "瑞芯微 RK3576 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3576", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "瑞芯微 RK3576 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3576", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "瑞芯微 RK3576 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3576", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "瑞芯微 RK3576 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3576", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "瑞芯微 RK3576 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3576", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "瑞芯微 RK3576 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3576", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "瑞芯微 RK3576 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3576", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "瑞芯微 RK3576 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3576", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "瑞芯微 RK3576 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3576", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "瑞芯微 RK3576 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3576", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "瑞芯微 RK3576 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3576", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/pcie/mipi/ethernet vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "瑞芯微 RK3576 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3576", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/pcie/mipi/ethernet vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "瑞芯微 RK3576 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-rockchip-rk3576", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/pcie/mipi/ethernet vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "瑞芯微 RK3576 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-simaai-modalix", "b": "CHIP-ambarella-n1-655", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SiMa.ai MLSoC Modalix 未声明机械接口；Ambarella N1-655 边缘 GenAI SoC 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-simaai-modalix", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SiMa.ai MLSoC Modalix 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-simaai-modalix", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SiMa.ai MLSoC Modalix 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-simaai-modalix", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SiMa.ai MLSoC Modalix 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-simaai-modalix", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SiMa.ai MLSoC Modalix 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-simaai-modalix", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SiMa.ai MLSoC Modalix 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-simaai-modalix", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SiMa.ai MLSoC Modalix 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-simaai-modalix", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SiMa.ai MLSoC Modalix 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-simaai-modalix", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SiMa.ai MLSoC Modalix 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-simaai-modalix", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SiMa.ai MLSoC Modalix 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-simaai-modalix", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SiMa.ai MLSoC Modalix 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-simaai-modalix", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SiMa.ai MLSoC Modalix 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-simaai-modalix", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SiMa.ai MLSoC Modalix 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-simaai-modalix", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SiMa.ai MLSoC Modalix 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-simaai-modalix", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SiMa.ai MLSoC Modalix 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-simaai-modalix", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SiMa.ai MLSoC Modalix 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-simaai-modalix", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SiMa.ai MLSoC Modalix 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-simaai-modalix", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SiMa.ai MLSoC Modalix 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-simaai-modalix", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SiMa.ai MLSoC Modalix 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-simaai-modalix", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie/mipi/ethernet vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "SiMa.ai MLSoC Modalix 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ambarella-n1-655", "b": "CHIP-ti-am69a", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie/mipi/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Ambarella N1-655 边缘 GenAI SoC 未声明机械接口；TI AM69A 边缘 AI 处理器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ambarella-n1-655", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Ambarella N1-655 边缘 GenAI SoC 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ambarella-n1-655", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Ambarella N1-655 边缘 GenAI SoC 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ambarella-n1-655", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Ambarella N1-655 边缘 GenAI SoC 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ambarella-n1-655", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Ambarella N1-655 边缘 GenAI SoC 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ambarella-n1-655", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Ambarella N1-655 边缘 GenAI SoC 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ambarella-n1-655", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Ambarella N1-655 边缘 GenAI SoC 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ambarella-n1-655", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Ambarella N1-655 边缘 GenAI SoC 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ambarella-n1-655", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Ambarella N1-655 边缘 GenAI SoC 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ambarella-n1-655", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Ambarella N1-655 边缘 GenAI SoC 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ambarella-n1-655", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Ambarella N1-655 边缘 GenAI SoC 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ambarella-n1-655", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Ambarella N1-655 边缘 GenAI SoC 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ambarella-n1-655", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Ambarella N1-655 边缘 GenAI SoC 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ambarella-n1-655", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Ambarella N1-655 边缘 GenAI SoC 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ambarella-n1-655", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Ambarella N1-655 边缘 GenAI SoC 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ambarella-n1-655", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Ambarella N1-655 边缘 GenAI SoC 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ambarella-n1-655", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/pcie/mipi/ethernet vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Ambarella N1-655 边缘 GenAI SoC 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ambarella-n1-655", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/pcie/mipi/ethernet vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Ambarella N1-655 边缘 GenAI SoC 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ambarella-n1-655", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/pcie/mipi/ethernet vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Ambarella N1-655 边缘 GenAI SoC 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-am69a", "b": "CHIP-deepx-dx-m1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI AM69A 边缘 AI 处理器 未声明机械接口；DEEPX DX-M1 边缘 NPU 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-am69a", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI AM69A 边缘 AI 处理器 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": false, "score": 0, "notes": "双方均有声明：仅一方支持 ROS2，混合使用需额外驱动" } ], "overall_compatible": false, "compatibility_score": 63, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-am69a", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi/ethernet vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI AM69A 边缘 AI 处理器 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-am69a", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI AM69A 边缘 AI 处理器 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-am69a", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI AM69A 边缘 AI 处理器 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-am69a", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI AM69A 边缘 AI 处理器 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-am69a", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi/ethernet vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI AM69A 边缘 AI 处理器 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-am69a", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi/ethernet vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI AM69A 边缘 AI 处理器 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-am69a", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI AM69A 边缘 AI 处理器 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-am69a", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI AM69A 边缘 AI 处理器 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-am69a", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI AM69A 边缘 AI 处理器 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-am69a", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi/ethernet vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI AM69A 边缘 AI 处理器 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-am69a", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi/ethernet vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI AM69A 边缘 AI 处理器 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-am69a", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi/ethernet vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI AM69A 边缘 AI 处理器 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-am69a", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI AM69A 边缘 AI 处理器 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-am69a", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi/ethernet vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI AM69A 边缘 AI 处理器 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-am69a", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi/ethernet vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI AM69A 边缘 AI 处理器 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-ti-am69a", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/pcie/mipi/ethernet vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "TI AM69A 边缘 AI 处理器 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-deepx-dx-m1", "b": "CHIP-houmo-manye-m30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: pcie" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DEEPX DX-M1 边缘 NPU 未声明机械接口；后摩智能 漫界 M30 存算一体芯片 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": true, "score": 1, "notes": "双方均明确不支持 ROS2，无 ROS2 生态冲突" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-deepx-dx-m1", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DEEPX DX-M1 边缘 NPU 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-deepx-dx-m1", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DEEPX DX-M1 边缘 NPU 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-deepx-dx-m1", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DEEPX DX-M1 边缘 NPU 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-deepx-dx-m1", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DEEPX DX-M1 边缘 NPU 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-deepx-dx-m1", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DEEPX DX-M1 边缘 NPU 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-deepx-dx-m1", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DEEPX DX-M1 边缘 NPU 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-deepx-dx-m1", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/spi/ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DEEPX DX-M1 边缘 NPU 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-deepx-dx-m1", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DEEPX DX-M1 边缘 NPU 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-deepx-dx-m1", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DEEPX DX-M1 边缘 NPU 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-deepx-dx-m1", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DEEPX DX-M1 边缘 NPU 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-deepx-dx-m1", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DEEPX DX-M1 边缘 NPU 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-deepx-dx-m1", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DEEPX DX-M1 边缘 NPU 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-deepx-dx-m1", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DEEPX DX-M1 边缘 NPU 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-deepx-dx-m1", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DEEPX DX-M1 边缘 NPU 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-deepx-dx-m1", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DEEPX DX-M1 边缘 NPU 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-deepx-dx-m1", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "DEEPX DX-M1 边缘 NPU 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-houmo-manye-m30", "b": "SENS-cam-orbbec-gemini335", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "后摩智能 漫界 M30 存算一体芯片 未声明机械接口；奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-houmo-manye-m30", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "后摩智能 漫界 M30 存算一体芯片 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-houmo-manye-m30", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "后摩智能 漫界 M30 存算一体芯片 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-houmo-manye-m30", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "后摩智能 漫界 M30 存算一体芯片 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-houmo-manye-m30", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs rs485/usb/ros2/ttl）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "后摩智能 漫界 M30 存算一体芯片 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-houmo-manye-m30", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "后摩智能 漫界 M30 存算一体芯片 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-houmo-manye-m30", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/spi/ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "后摩智能 漫界 M30 存算一体芯片 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-houmo-manye-m30", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "后摩智能 漫界 M30 存算一体芯片 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-houmo-manye-m30", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "后摩智能 漫界 M30 存算一体芯片 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-houmo-manye-m30", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs i2c/usb/ros2）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "后摩智能 漫界 M30 存算一体芯片 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-houmo-manye-m30", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "后摩智能 漫界 M30 存算一体芯片 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-houmo-manye-m30", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "后摩智能 漫界 M30 存算一体芯片 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-houmo-manye-m30", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "后摩智能 漫界 M30 存算一体芯片 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-houmo-manye-m30", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "后摩智能 漫界 M30 存算一体芯片 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-houmo-manye-m30", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "后摩智能 漫界 M30 存算一体芯片 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "CHIP-houmo-manye-m30", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（pcie vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "后摩智能 漫界 M30 存算一体芯片 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "正实 2F-20 电动夹爪 未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-cam-orbbec-gemini335", "b": "SENS-cam-percipio-fm851", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口；图漾科技 FM851 工业级 3D 相机 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-cam-orbbec-gemini335", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ros2" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-cam-orbbec-gemini335", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ros2" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-cam-orbbec-gemini335", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/ros2" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-cam-orbbec-gemini335", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/ros2" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-cam-orbbec-gemini335", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ros2" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-cam-orbbec-gemini335", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-cam-orbbec-gemini335", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-cam-orbbec-gemini335", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/ros2" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-cam-orbbec-gemini335", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-cam-orbbec-gemini335", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-cam-orbbec-gemini335", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ros2" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-cam-orbbec-gemini335", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/ros2 vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-cam-orbbec-gemini335", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/ros2 vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-cam-orbbec-gemini335", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/ros2 vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "奥比中光 Gemini 335 双目结构光深度相机 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-cam-percipio-fm851", "b": "SENS-lidar-hesai-ft120", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明机械接口；禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-cam-percipio-fm851", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-cam-percipio-fm851", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-cam-percipio-fm851", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-cam-percipio-fm851", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-cam-percipio-fm851", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-cam-percipio-fm851", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-cam-percipio-fm851", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-cam-percipio-fm851", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-cam-percipio-fm851", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-cam-percipio-fm851", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-cam-percipio-fm851", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/ethernet vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-cam-percipio-fm851", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/ethernet vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-cam-percipio-fm851", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/ethernet vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "图漾科技 FM851 工业级 3D 相机 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-lidar-hesai-ft120", "b": "SENS-lidar-robosense-ac1", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ros2/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口；速腾聚创 Active Camera AC1 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-lidar-hesai-ft120", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ros2" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-lidar-hesai-ft120", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ros2" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-lidar-hesai-ft120", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ros2/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-lidar-hesai-ft120", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ros2/ethernet vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-lidar-hesai-ft120", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ros2/ethernet vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-lidar-hesai-ft120", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ros2" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-lidar-hesai-ft120", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ros2/ethernet vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-lidar-hesai-ft120", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ros2/ethernet vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-lidar-hesai-ft120", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ros2/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-lidar-hesai-ft120", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ros2/ethernet vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-lidar-hesai-ft120", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ros2/ethernet vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-lidar-hesai-ft120", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ros2/ethernet vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "禾赛科技 FT120 纯固态补盲激光雷达 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-lidar-robosense-ac1", "b": "ACT-oss-leap-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ros2" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明机械接口；LEAP Hand 开源灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-lidar-robosense-ac1", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ros2" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-lidar-robosense-ac1", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ros2/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-lidar-robosense-ac1", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ros2/ethernet vs can/spi/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-lidar-robosense-ac1", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ros2/ethernet vs can/i2c/uart/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-lidar-robosense-ac1", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ros2" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-lidar-robosense-ac1", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ros2/ethernet vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-lidar-robosense-ac1", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ros2/ethernet vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-lidar-robosense-ac1", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ros2/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-lidar-robosense-ac1", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ros2/ethernet vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-lidar-robosense-ac1", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ros2/ethernet vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-lidar-robosense-ac1", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ros2/ethernet vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "速腾聚创 Active Camera AC1 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-oss-leap-hand", "b": "ACT-oss-ruka-hand", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/ros2" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明机械接口；RUKA Hand 腱绳驱动灵巧手 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-oss-leap-hand", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ros2" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-oss-leap-hand", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-oss-leap-hand", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-oss-leap-hand", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/ros2" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-oss-leap-hand", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-oss-leap-hand", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-oss-leap-hand", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ros2" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-oss-leap-hand", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/usb/ros2/ttl vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-oss-leap-hand", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/usb/ros2/ttl vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-oss-leap-hand", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（rs485/usb/ros2/ttl vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "LEAP Hand 开源灵巧手 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-oss-ruka-hand", "b": "ACT-oss-odri-actuator", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ros2" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明机械接口；ODRI 开源力控关节模组 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-oss-ruka-hand", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-oss-ruka-hand", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-oss-ruka-hand", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb/ros2" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-oss-ruka-hand", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-oss-ruka-hand", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-oss-ruka-hand", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ros2" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-oss-ruka-hand", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/ros2 vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-oss-ruka-hand", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/ros2 vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-oss-ruka-hand", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/ros2 vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "RUKA Hand 腱绳驱动灵巧手 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-oss-odri-actuator", "b": "ACT-oss-mjbots-moteus", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/spi" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明机械接口；mjbots moteus 无刷伺服驱动器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-oss-odri-actuator", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-oss-odri-actuator", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ros2" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-oss-odri-actuator", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/ros2/ethernet vs i2c/usb）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-oss-odri-actuator", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/ros2/ethernet vs usb/wifi）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-oss-odri-actuator", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ros2/ethernet" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-oss-odri-actuator", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/ros2/ethernet vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-oss-odri-actuator", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/ros2/ethernet vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-oss-odri-actuator", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/ros2/ethernet vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ODRI 开源力控关节模组 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-oss-mjbots-moteus", "b": "ACT-oss-vesc", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: can/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明机械接口；VESC 开源无刷电机控制器 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-oss-mjbots-moteus", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-oss-mjbots-moteus", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-oss-mjbots-moteus", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-oss-mjbots-moteus", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/usb vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-oss-mjbots-moteus", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/usb vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-oss-mjbots-moteus", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/usb vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-oss-mjbots-moteus", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/spi/usb vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "mjbots moteus 无刷伺服驱动器 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-oss-vesc", "b": "SENS-oss-anyskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明机械接口；AnySkin 可更换磁性电子皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-oss-vesc", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-oss-vesc", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-oss-vesc", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/i2c/uart/usb vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-oss-vesc", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/i2c/uart/usb vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-oss-vesc", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/i2c/uart/usb vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "ACT-oss-vesc", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（can/i2c/uart/usb vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "VESC 开源无刷电机控制器 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-oss-anyskin", "b": "SENS-oss-reskin", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: i2c/usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明机械接口；ReSkin 磁性弹性体触觉皮肤 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-oss-anyskin", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-oss-anyskin", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ros2" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-oss-anyskin", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（i2c/usb/ros2 vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-oss-anyskin", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（i2c/usb/ros2 vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-oss-anyskin", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（i2c/usb/ros2 vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "AnySkin 可更换磁性电子皮肤 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-oss-reskin", "b": "RPLAT-oss-open-duck-mini", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: usb" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明机械接口；Open Duck Mini 开源小型双足平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-oss-reskin", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（i2c/usb vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-oss-reskin", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（i2c/usb vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-oss-reskin", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（i2c/usb vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "SENS-oss-reskin", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（i2c/usb vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "ReSkin 磁性弹性体触觉皮肤 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "RPLAT-oss-open-duck-mini", "b": "RPLAT-oss-reachy2", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/wifi vs ros2/ethernet）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明机械接口；Reachy 2 开源人形上身平台 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "RPLAT-oss-open-duck-mini", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/wifi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "RPLAT-oss-open-duck-mini", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/wifi vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "RPLAT-oss-open-duck-mini", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（usb/wifi vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Open Duck Mini 开源小型双足平台 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "RPLAT-oss-reachy2", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ros2/ethernet vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "RPLAT-oss-reachy2", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ros2/ethernet vs ethercat）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "RPLAT-oss-reachy2", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ros2/ethernet vs modbus）" }, { "dimension": "electrical", "compatible": null, "score": 0, "notes": "一方或双方无电压数据，无法判定" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "Reachy 2 开源人形上身平台 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 0, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "bus_coupling", "force_profile": { "force_senses": [], "guidance": "信号级耦合（协议互通），无显著力学约束" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "GRIPPER-ONR-VG1", "b": "GRIPPER-ONR-NG1", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 声明了「io_link」但不在可比对通信协议词表内（我方能力边界，非厂商缺数据），无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 未声明机械接口；OnRobot NG10 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "GRIPPER-ONR-VG1", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 声明了「io_link」但不在可比对通信协议词表内（我方能力边界，非厂商缺数据），无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "GRIPPER-ONR-VG1", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 声明了「io_link」但不在可比对通信协议词表内（我方能力边界，非厂商缺数据），无法判定（无数据 ≠ 不兼容）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "OnRobot VG1 气动夹爪 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 1, "undecided_dimensions": 3, "hard_dimensions_decided": 1, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "1 个维度有双方声明且均兼容（含 1 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "GRIPPER-ONR-NG1", "b": "GRIPPER-ONR-NG30", "dimensions": [ { "dimension": "protocol", "compatible": true, "score": 1, "notes": "共享协议: ethercat" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明机械接口；OnRobot NG30 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": true, "compatibility_score": 100, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "2 个维度有双方声明且均兼容（含 2 项硬约束）", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "GRIPPER-ONR-NG1", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs modbus）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "OnRobot NG10 电动夹爪 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" }, { "a": "GRIPPER-ONR-NG30", "b": "GRIPPER-POS-2F20", "dimensions": [ { "dimension": "protocol", "compatible": false, "score": 0, "notes": "协议无交集（ethercat vs modbus）" }, { "dimension": "electrical", "compatible": true, "score": 1, "notes": "电压区间重叠 (24-24V / 24-24V)" }, { "dimension": "mechanical", "compatible": null, "score": 0, "notes": "OnRobot NG30 电动夹爪 未声明机械接口；正实 2F-20 电动夹爪 未声明机械接口，无法判定（无数据 ≠ 不兼容）" }, { "dimension": "software", "compatible": null, "score": 0, "notes": "双方均未声明 ROS2 支持，无法判定（无数据 ≠ 不兼容）" } ], "overall_compatible": false, "compatibility_score": 50, "decided_dimensions": 2, "undecided_dimensions": 2, "hard_dimensions_decided": 2, "interaction_type": "connector_insert", "force_profile": { "force_senses": [ "insertion_force", "electrical_contact" ], "guidance": "接插件插拔：关注插入力与接触力；本平台无原始插拔力曲线，需传感采集补充" }, "verdict_reason": "存在双方均有声明且确实冲突的维度", "evidence_basis": "基于厂商公开声明字段的规则推断，非实测；未声明维度记为无法判定，不计入分子也不计入分母；判 true 至少需一项硬约束（协议/电气/机械）有双方声明" } ] }